KR102028207B1 - 화학기계 연마층의 제조 방법 - Google Patents

화학기계 연마층의 제조 방법 Download PDF

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Publication number
KR102028207B1
KR102028207B1 KR1020130030670A KR20130030670A KR102028207B1 KR 102028207 B1 KR102028207 B1 KR 102028207B1 KR 1020130030670 A KR1020130030670 A KR 1020130030670A KR 20130030670 A KR20130030670 A KR 20130030670A KR 102028207 B1 KR102028207 B1 KR 102028207B1
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South Korea
Prior art keywords
mold cavity
axis
nozzle opening
donut
mold
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020130030670A
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English (en)
Korean (ko)
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KR20130108168A (ko
Inventor
브라이언 캔트렐
캐쓸린 맥휴
제임스 머네인
조지 매클레인
듀런 허트
로버트 에이 브래디
크리스토퍼 에이 영
제프리 보처트 밀러
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
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Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Publication of KR20130108168A publication Critical patent/KR20130108168A/ko
Application granted granted Critical
Publication of KR102028207B1 publication Critical patent/KR102028207B1/ko
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/12Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001Manufacture of flexible abrasive materials
    • B24D11/003Manufacture of flexible abrasive materials without embedded abrasive particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
KR1020130030670A 2012-03-22 2013-03-22 화학기계 연마층의 제조 방법 Expired - Fee Related KR102028207B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/427,383 2012-03-22
US13/427,383 US8709114B2 (en) 2012-03-22 2012-03-22 Method of manufacturing chemical mechanical polishing layers

Publications (2)

Publication Number Publication Date
KR20130108168A KR20130108168A (ko) 2013-10-02
KR102028207B1 true KR102028207B1 (ko) 2019-10-02

Family

ID=49112322

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130030670A Expired - Fee Related KR102028207B1 (ko) 2012-03-22 2013-03-22 화학기계 연마층의 제조 방법

Country Status (7)

Country Link
US (1) US8709114B2 (https=)
JP (1) JP6026931B2 (https=)
KR (1) KR102028207B1 (https=)
CN (1) CN103358238B (https=)
DE (1) DE102013004947A1 (https=)
FR (1) FR2988315B1 (https=)
TW (1) TWI551395B (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9034063B2 (en) * 2012-09-27 2015-05-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing grooved chemical mechanical polishing layers
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
CN104354091B (zh) * 2014-11-27 2017-02-22 奚经龙 一种用于水钻的抛光滚筒的制造方法
CN104858787B (zh) * 2015-06-18 2017-04-12 浙江工商大学 一种研磨盘表面自生长的研磨机构
US10092998B2 (en) * 2015-06-26 2018-10-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad
US10005172B2 (en) * 2015-06-26 2018-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled-porosity method for forming polishing pad
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101134303A (zh) * 2006-08-30 2008-03-05 力晶半导体股份有限公司 抛光垫及其制造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1916330A1 (de) * 1969-03-29 1970-10-08 Richard Zippel & Co Kg Farbspr Anlage zur Herstellung von grossen oder kompliziert geformten Formteilen aus fluessigen Mehrkomponenten-Kunststoffen
US4158535A (en) * 1977-01-25 1979-06-19 Olin Corporation Generation of polyurethane foam
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
EP1268134A1 (en) * 1999-12-14 2003-01-02 Rodel Holdings, Inc. Method of manufacturing a polymer or polymer composite polishing pad
GB0008553D0 (en) 2000-04-06 2000-05-24 Unilever Plc Process and apparatus for the production of a detergent bar
TWI220405B (en) * 2002-11-19 2004-08-21 Iv Technologies Co Ltd Method of fabricating a polishing pad having a detection window thereon
TW592894B (en) * 2002-11-19 2004-06-21 Iv Technologies Co Ltd Method of fabricating a polishing pad
JP2007081322A (ja) * 2005-09-16 2007-03-29 Jsr Corp 化学機械研磨パッドの製造方法
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於cmp之特製拋光墊及其製造方法及其用途
US20110275288A1 (en) * 2010-05-10 2011-11-10 Chien-Min Sung Cmp pad dressers with hybridized conditioning and related methods
US7226339B2 (en) * 2005-08-22 2007-06-05 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
KR20080090496A (ko) * 2006-02-03 2008-10-08 제이에스알 가부시끼가이샤 화학 기계 연마 패드
JP2008184597A (ja) * 2007-01-31 2008-08-14 Kuraray Co Ltd 研磨パッドの製造方法
US7820005B2 (en) * 2008-07-18 2010-10-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad manufacturing process
JP5166172B2 (ja) * 2008-09-02 2013-03-21 富士紡ホールディングス株式会社 研磨パッドの製造方法
US8552980B2 (en) 2009-04-30 2013-10-08 Gregory A. Shaver Computer input devices and associated computing devices, software, and methods
US8257544B2 (en) * 2009-06-10 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having a low defect integral window
TWI404596B (zh) * 2009-09-22 2013-08-11 San Fang Chemical Industry Co 製造研磨墊之方法及研磨墊
CN102133734B (zh) * 2010-01-21 2015-02-04 智胜科技股份有限公司 具有侦测窗的研磨垫及其制造方法
US8444727B2 (en) * 2011-08-16 2013-05-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101134303A (zh) * 2006-08-30 2008-03-05 力晶半导体股份有限公司 抛光垫及其制造方法

Also Published As

Publication number Publication date
JP2013211549A (ja) 2013-10-10
FR2988315B1 (fr) 2016-06-10
JP6026931B2 (ja) 2016-11-16
CN103358238A (zh) 2013-10-23
CN103358238B (zh) 2016-02-24
TWI551395B (zh) 2016-10-01
TW201347908A (zh) 2013-12-01
US20130247476A1 (en) 2013-09-26
US8709114B2 (en) 2014-04-29
KR20130108168A (ko) 2013-10-02
DE102013004947A1 (de) 2013-09-26
FR2988315A1 (fr) 2013-09-27

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