KR102085640B1 - 홈이 있는 화학기계 연마층의 제조 방법 - Google Patents

홈이 있는 화학기계 연마층의 제조 방법 Download PDF

Info

Publication number
KR102085640B1
KR102085640B1 KR1020130114229A KR20130114229A KR102085640B1 KR 102085640 B1 KR102085640 B1 KR 102085640B1 KR 1020130114229 A KR1020130114229 A KR 1020130114229A KR 20130114229 A KR20130114229 A KR 20130114229A KR 102085640 B1 KR102085640 B1 KR 102085640B1
Authority
KR
South Korea
Prior art keywords
mold cavity
axis
nozzle opening
donut
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020130114229A
Other languages
English (en)
Korean (ko)
Other versions
KR20140041360A (ko
Inventor
제프리 제임스 헨드런
케네쓰 바발라
제프리 보처트 밀러
브라이언 티 캔트렐
제임스 티 머네인
캐쓸린 맥휴
조지 에이치 맥클레인
듀런 에이 허트
로버트 에이 브래디
크리스토퍼 에이 영
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Publication of KR20140041360A publication Critical patent/KR20140041360A/ko
Application granted granted Critical
Publication of KR102085640B1 publication Critical patent/KR102085640B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020130114229A 2012-09-27 2013-09-26 홈이 있는 화학기계 연마층의 제조 방법 Active KR102085640B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/628,364 2012-09-27
US13/628,364 US9034063B2 (en) 2012-09-27 2012-09-27 Method of manufacturing grooved chemical mechanical polishing layers

Publications (2)

Publication Number Publication Date
KR20140041360A KR20140041360A (ko) 2014-04-04
KR102085640B1 true KR102085640B1 (ko) 2020-03-06

Family

ID=50337486

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130114229A Active KR102085640B1 (ko) 2012-09-27 2013-09-26 홈이 있는 화학기계 연마층의 제조 방법

Country Status (5)

Country Link
US (1) US9034063B2 (https=)
JP (1) JP6238664B2 (https=)
KR (1) KR102085640B1 (https=)
CN (1) CN103692370B (https=)
TW (1) TWI594840B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10722999B2 (en) * 2016-06-17 2020-07-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads and methods of making
CN111318956A (zh) * 2018-12-13 2020-06-23 夏泰鑫半导体(青岛)有限公司 聚氨酯研磨垫及其制造方法、及化学机械研磨装置
CN116061102A (zh) * 2023-02-06 2023-05-05 上海芯谦集成电路有限公司 一种具有沟槽的抛光垫及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090053976A1 (en) 2005-02-18 2009-02-26 Roy Pradip K Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2981322B2 (ja) * 1991-10-28 1999-11-22 松下電工株式会社 天井収納装置
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
WO2000059680A1 (en) * 1999-03-30 2000-10-12 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
GB0008553D0 (en) 2000-04-06 2000-05-24 Unilever Plc Process and apparatus for the production of a detergent bar
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
KR100877386B1 (ko) 2001-11-13 2009-01-07 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
US7073244B2 (en) 2002-09-20 2006-07-11 Lear Corporation Process for machining a flexible foam
TW592894B (en) * 2002-11-19 2004-06-21 Iv Technologies Co Ltd Method of fabricating a polishing pad
US7704125B2 (en) * 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
EP1466699A1 (en) * 2003-04-09 2004-10-13 JSR Corporation Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method
JP2007081322A (ja) * 2005-09-16 2007-03-29 Jsr Corp 化学機械研磨パッドの製造方法
KR20060046093A (ko) * 2004-05-20 2006-05-17 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 화학 기계 연마 방법
US7037175B1 (en) * 2004-10-19 2006-05-02 Cabot Microelectronics Corporation Method of sharpening cutting edges
US7275928B2 (en) * 2004-11-23 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a striation reduced chemical mechanical polishing pad
JP3769581B1 (ja) 2005-05-18 2006-04-26 東洋ゴム工業株式会社 研磨パッドおよびその製造方法
KR20070070094A (ko) * 2005-12-28 2007-07-03 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 화학 기계 연마 방법
CN101134303A (zh) * 2006-08-30 2008-03-05 力晶半导体股份有限公司 抛光垫及其制造方法
US7300340B1 (en) * 2006-08-30 2007-11-27 Rohm and Haas Electronics Materials CMP Holdings, Inc. CMP pad having overlaid constant area spiral grooves
US7234224B1 (en) * 2006-11-03 2007-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Curved grooving of polishing pads
JP5166172B2 (ja) * 2008-09-02 2013-03-21 富士紡ホールディングス株式会社 研磨パッドの製造方法
US8585790B2 (en) * 2009-04-23 2013-11-19 Applied Materials, Inc. Treatment of polishing pad window
TWI426981B (zh) * 2010-11-23 2014-02-21 Univ Nat Pingtung Sci & Tech 晶圓研磨盤構造及其製造方法
US8444727B2 (en) * 2011-08-16 2013-05-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
US8986585B2 (en) * 2012-03-22 2015-03-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers having a window
US8709114B2 (en) * 2012-03-22 2014-04-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090053976A1 (en) 2005-02-18 2009-02-26 Roy Pradip K Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof

Also Published As

Publication number Publication date
TWI594840B (zh) 2017-08-11
KR20140041360A (ko) 2014-04-04
US20140083018A1 (en) 2014-03-27
CN103692370B (zh) 2016-08-17
TW201433411A (zh) 2014-09-01
JP2014072527A (ja) 2014-04-21
US9034063B2 (en) 2015-05-19
JP6238664B2 (ja) 2017-11-29
CN103692370A (zh) 2014-04-02

Similar Documents

Publication Publication Date Title
KR102028207B1 (ko) 화학기계 연마층의 제조 방법
KR102028208B1 (ko) 윈도우가 있는 화학기계 연마층의 제조 방법
US9238295B2 (en) Soft and conditionable chemical mechanical window polishing pad
US8348724B2 (en) Polishing pad manufacturing method
US9102034B2 (en) Method of chemical mechanical polishing a substrate
US9238296B2 (en) Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
KR20130020588A (ko) 화학기계 연마층의 제조 방법
KR102085640B1 (ko) 홈이 있는 화학기계 연마층의 제조 방법
US20240253175A1 (en) Polishing pad with endpoint window
CN118418036A (zh) 具有端点窗口的抛光垫
KR20200140748A (ko) 엽상 돌출 구조체를 갖는 cmp 연마 패드

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000