JP2014051576A - 研磨用組成物 - Google Patents
研磨用組成物 Download PDFInfo
- Publication number
- JP2014051576A JP2014051576A JP2012196226A JP2012196226A JP2014051576A JP 2014051576 A JP2014051576 A JP 2014051576A JP 2012196226 A JP2012196226 A JP 2012196226A JP 2012196226 A JP2012196226 A JP 2012196226A JP 2014051576 A JP2014051576 A JP 2014051576A
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- JP
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- Prior art keywords
- acid
- polishing
- polishing composition
- metal
- composition according
- Prior art date
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- 238000005498 polishing Methods 0.000 title claims abstract description 275
- 239000000203 mixture Substances 0.000 title claims abstract description 143
- 229910052751 metal Inorganic materials 0.000 claims abstract description 105
- 239000002184 metal Substances 0.000 claims abstract description 102
- 150000004715 keto acids Chemical class 0.000 claims abstract description 53
- 229910052752 metalloid Inorganic materials 0.000 claims abstract description 53
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910045601 alloy Inorganic materials 0.000 claims description 42
- 239000000956 alloy Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 35
- 230000008859 change Effects 0.000 claims description 33
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- 229910052721 tungsten Inorganic materials 0.000 claims description 19
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 16
- 239000010937 tungsten Substances 0.000 claims description 16
- 238000000227 grinding Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229910052714 tellurium Inorganic materials 0.000 claims description 7
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 6
- 229910000618 GeSbTe Inorganic materials 0.000 claims description 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
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- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 4
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- CYQAYERJWZKYML-UHFFFAOYSA-N phosphorus pentasulfide Chemical compound S1P(S2)(=S)SP3(=S)SP1(=S)SP2(=S)S3 CYQAYERJWZKYML-UHFFFAOYSA-N 0.000 description 1
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- WKFBZNUBXWCCHG-UHFFFAOYSA-N phosphorus trifluoride Chemical compound FP(F)F WKFBZNUBXWCCHG-UHFFFAOYSA-N 0.000 description 1
- PZHNNJXWQYFUTD-UHFFFAOYSA-N phosphorus triiodide Chemical compound IP(I)I PZHNNJXWQYFUTD-UHFFFAOYSA-N 0.000 description 1
- VSAISIQCTGDGPU-UHFFFAOYSA-N phosphorus trioxide Inorganic materials O1P(O2)OP3OP1OP2O3 VSAISIQCTGDGPU-UHFFFAOYSA-N 0.000 description 1
- LFGREXWGYUGZLY-UHFFFAOYSA-N phosphoryl Chemical group [P]=O LFGREXWGYUGZLY-UHFFFAOYSA-N 0.000 description 1
- FFUQCRZBKUBHQT-UHFFFAOYSA-N phosphoryl fluoride Chemical compound FP(F)(F)=O FFUQCRZBKUBHQT-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- OYEHPCDNVJXUIW-UHFFFAOYSA-N plutonium atom Chemical compound [Pu] OYEHPCDNVJXUIW-UHFFFAOYSA-N 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 229960002429 proline Drugs 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- FVSKHRXBFJPNKK-UHFFFAOYSA-N propionitrile Chemical compound CCC#N FVSKHRXBFJPNKK-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003216 pyrazines Chemical class 0.000 description 1
- 150000003217 pyrazoles Chemical class 0.000 description 1
- 150000004892 pyridazines Chemical class 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003233 pyrroles Chemical class 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229940043230 sarcosine Drugs 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- BHRZNVHARXXAHW-UHFFFAOYSA-N sec-butylamine Chemical compound CCC(C)N BHRZNVHARXXAHW-UHFFFAOYSA-N 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- DFRFKDSWUNYYGW-UHFFFAOYSA-N selenoxo-phosphino Chemical compound [Se]=[P] DFRFKDSWUNYYGW-UHFFFAOYSA-N 0.000 description 1
- 229960001153 serine Drugs 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- PFUVRDFDKPNGAV-UHFFFAOYSA-N sodium peroxide Chemical compound [Na+].[Na+].[O-][O-] PFUVRDFDKPNGAV-UHFFFAOYSA-N 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- OKQKDCXVLPGWPO-UHFFFAOYSA-N sulfanylidenephosphane Chemical compound S=P OKQKDCXVLPGWPO-UHFFFAOYSA-N 0.000 description 1
- 229940032330 sulfuric acid Drugs 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 1
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- DLYUQMMRRRQYAE-UHFFFAOYSA-N tetraphosphorus decaoxide Chemical compound O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 1
- LOZDOQJARMKMFN-UHFFFAOYSA-N tetraphosphorus pentasulfide Chemical compound S1P(S2)P3SP2SP1S3 LOZDOQJARMKMFN-UHFFFAOYSA-N 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- WQYSXVGEZYESBR-UHFFFAOYSA-N thiophosphoryl chloride Chemical compound ClP(Cl)(Cl)=S WQYSXVGEZYESBR-UHFFFAOYSA-N 0.000 description 1
- 229960002898 threonine Drugs 0.000 description 1
- 229940034208 thyroxine Drugs 0.000 description 1
- XUIIKFGFIJCVMT-UHFFFAOYSA-N thyroxine-binding globulin Natural products IC1=CC(CC([NH3+])C([O-])=O)=CC(I)=C1OC1=CC(I)=C(O)C(I)=C1 XUIIKFGFIJCVMT-UHFFFAOYSA-N 0.000 description 1
- UAXOELSVPTZZQG-UHFFFAOYSA-N tiglic acid Natural products CC(C)=C(C)C(O)=O UAXOELSVPTZZQG-UHFFFAOYSA-N 0.000 description 1
- ADDWXBZCQABCGO-UHFFFAOYSA-N titanium(iii) phosphide Chemical compound [Ti]#P ADDWXBZCQABCGO-UHFFFAOYSA-N 0.000 description 1
- OWNZHTHZRZVKSQ-UHFFFAOYSA-N tribromo(sulfanylidene)-$l^{5}-phosphane Chemical compound BrP(Br)(Br)=S OWNZHTHZRZVKSQ-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- LHGOOQAICOQNRG-UHFFFAOYSA-N trifluoro(sulfanylidene)-$l^{5}-phosphane Chemical compound FP(F)(F)=S LHGOOQAICOQNRG-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- OUYCCCASQSFEME-UHFFFAOYSA-N tyrosine Natural products OC(=O)C(N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-UHFFFAOYSA-N 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
- AQLJVWUFPCUVLO-UHFFFAOYSA-N urea hydrogen peroxide Chemical compound OO.NC(N)=O AQLJVWUFPCUVLO-UHFFFAOYSA-N 0.000 description 1
- 239000004474 valine Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229940048462 zinc phosphide Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
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- Mechanical Treatment Of Semiconductor (AREA)
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Abstract
【解決手段】金属元素または半金属元素を含む研磨対象物を研磨する用途で使用される研磨用組成物に、金属元素または半金属元素を含むオキソ酸と、水とを含ませる。
【選択図】なし
Description
本形態に係る研磨用組成物は、金属元素または半金属元素を含むオキソ酸と、水とを必須の構成成分として含む。また、本形態に係る研磨用組成物は、非金属酸化剤および/または研磨促進剤(錯化剤など)をさらに含むことが好ましい。そして、砥粒、防食剤、界面活性剤などの添加剤をさらに含んでもよい。
本形態に係る研磨用組成物は、その特徴的な構成成分として、金属元素または半金属元素を含むオキソ酸を必須に含む。
本形態に係る研磨用組成物は、各成分を分散または溶解するための分散媒または溶媒として水を必須に含む。他の成分の作用を阻害することを抑制するという観点から、不純物をできる限り含有しない水が好ましく、具体的には、イオン交換樹脂にて不純物イオンを除去した後、フィルタを通して異物を除去した純水や超純水、または蒸留水が好ましい。
本形態に係る研磨用組成物は、任意の成分として、非金属酸化剤を含んでもよい。本明細書において「非金属酸化剤」とは、金属元素を含有せず、研磨対象物に含まれる金属元素または半金属元素の単体に対して酸化剤として機能することができる化合物を意味する。したがって、「非金属酸化剤」は、かような機能を発揮するのに十分な酸化還元電位を有するものであるか否かという基準に従って選定されうる。このため、「非金属酸化剤」の外延は必ずしも一義的に明確に定まるものではないが、一例として、例えば、過酸化水素、硝酸、過硫酸、亜塩素酸、次亜塩素酸、酸化水素およびその付加物、例えば尿素過酸化水素およびカーボネート、有機過酸化物、例えばベンゾイル、過酢酸、およびジ−t−ブチル、スルフェイト(SO5)、スルフェイト(S5O8)、並びに過酸化ナトリウムが挙げられる。さらには、過ヨウ素酸、亜ヨウ素酸、次亜ヨウ素酸、ヨウ素酸、過臭素酸、亜臭素酸、次亜臭素酸、臭素酸、過塩素酸、塩素酸、過塩素酸、過ホウ酸、およびそれぞれの塩などが挙げられる。
本形態に係る研磨用組成物は、任意の成分として、研磨促進剤を含んでもよい。研磨促進剤は、研磨対象物の表面に錯形成して結合し、不溶性の脆性膜を研磨対象物の表面に形成することによって研磨用組成物による研磨対象物の研磨速度を向上させる働きをする。研磨促進剤の具体例としては、窒素化合物、カルボン酸化合物、リン含有化合物、スルホン酸化合物などが挙げられる。
本形態に係る研磨用組成物は、任意の成分として、砥粒(研磨剤)を含んでもよい。砥粒は、研磨対象物を機械的に研磨する働きをする。砥粒は、無機粒子、有機粒子、及び有機無機複合粒子のいずれであってもよい。無機粒子の具体例としては、例えば、シリカ、アルミナ、セリア、チタニアなどの金属酸化物からなる粒子、並びに窒化ケイ素粒子、炭化ケイ素粒子及び窒化ホウ素粒子が挙げられる。有機粒子の具体例としては、例えばポリメタクリル酸メチル粒子が挙げられる。その中でもシリカ粒子が好ましく、特に好ましいのはコロイダルシリカである。
本形態に係る研磨用組成物は、任意の成分として、金属防食剤を含んでもよい。研磨用組成物中に金属防食剤を加えた場合には、研磨用組成物を用いて研磨した後の研磨対象物にディッシング等の表面欠陥がより生じにくくなるという有利な効果が奏される。また、研磨用組成物が上述した非金属酸化剤を含む場合、金属防食剤がともに含まれると、非金属酸化剤による研磨対象物表面の酸化を緩和するとともに、非金属酸化剤による研磨対象物表面の酸化により生じる金属イオンと反応して不溶性の錯体を生成する働きをする。この金属防食剤の働きは、研磨用組成物による研磨対象物の過剰なエッチングを防止する。なお、このような過剰なエッチング防止の効果は、研磨対象物が半金属元素を含む場合(例えば、相変化合金を含む場合)に特に顕著である。
具体的な記載は省略するが、本形態に係る研磨用組成物は、任意の成分として、その他の成分(例えば、水溶性高分子、防腐剤、防カビ剤、金属酸化剤、還元剤、難溶性の有機物を溶解するための有機溶媒など)をさらに含んでもよい。また、本形態に係る研磨用組成物は、一液型であってもよいし、二液型を始めとする多液型であってもよい。さらに、前記実施形態の研磨用組成物は、研磨用組成物の原液を水で希釈することにより調製されてもよい。
研磨用組成物のpHは特に限定されない。ただし、12以下、さらに言えば10以下のpHであれば、研磨用組成物の取り扱いは容易になる。また、1以上、さらに言えば3以上であれば、研磨用組成物が砥粒を含む場合に当該砥粒の分散性が向上する。
上述した形態に係る研磨用組成物は、金属元素または半金属元素を含む研磨対象物を研磨する用途で使用される。以下、当該用途について、詳細に説明する。
まず、研磨対象物が半金属元素を含む場合の一例として、研磨対象物が相変化合金を含む場合について、説明する。すなわち、本発明の一実施形態において、上述した形態に係る研磨用組成物は、相変化合金を含む研磨対象物を研磨する用途、さらに言えば、相変化合金を含んだ研磨対象物を研磨して相変化デバイスを製造する用途で使用される。相変化合金の具体例としては、上述したゲルマニウム(Ge)やアンチモン(Sb)、テルル(Te)、ポロニウム(Po)などの半金属元素を含有する合金、より具体的には、GST合金およびインジウムアンチモナイド(InSb)が挙げられる。特に好ましい実施形態は、研磨対象物はGST合金を含む。
続いて、上述した形態に係る研磨用組成物を用いたCMP法が適用される別の場面として、絶縁体層に配線構造を形成する工程が挙げられる。CMP法を利用した配線構造の形成工程では、まず凹部が形成された絶縁体層(例えば、SiO2層)上に、タングステンなどからなるメタル層を、少なくとも凹部が完全に埋まるように形成する。次いで、凹部以外の箇所の絶縁体層が露出するまでメタル層をCMP法により研磨除去することで、凹部内に配線部が形成されるのである。
上述した形態に係る研磨用組成物の製造方法は、特に制限されず、例えば、金属元素または半金属元素を含むオキソ酸(またはその塩もしくは水和物)、および必要に応じて上述したような他の成分を、水中で攪拌混合することにより得ることができる。
上述のように、本発明に係る研磨用組成物は、金属元素または半金属元素を含む研磨対象物の研磨に好適に用いられる。よって、本発明の他の形態によれば、金属元素または半金属元素を含む研磨対象物を、本発明に係る研磨用組成物で研磨する工程を含む研磨方法が提供される。また、本発明のさらに他の形態によれば、金属元素または半金属元素を含む研磨対象物を、本発明に係る研磨方法で研磨する工程を含む基板の製造方法もまた、提供される。
下記の表1に示す組成で、砥粒、オキソ酸(金属元素または半金属元素を含む)、および必要に応じて非金属酸化剤および研磨促進剤を水中で攪拌混合し(混合温度:約25℃、混合時間:約10分)、実施例1〜22および比較例1〜15(オキソ酸を含まない)の研磨用組成物を調製した。この際、砥粒としては、約70nmの平均二次粒子径(平均一次粒子径35nm、会合度2)の有機酸(スルホン酸)修飾されたコロイダルシリカを用いた。また、組成物のpHは、水酸化カリウム(KOH)を加えることで調整し、pHメータにより確認した。
上記で得られた実施例1〜22および比較例1〜15の研磨用組成物を用い、相変化合金膜であるGST合金膜(ゲルマニウムとアンチモンとテルルとの質量比は2:2:5)を含む基板を研磨対象物として、相変化合金膜(GST合金膜)に対する研磨速度を測定した。研磨速度は、直流4探針法を原理とするシート抵抗測定器を用いて測定される研磨前後のウェハの厚みの差を、研磨時間で除することにより求めた。なお、研磨条件は以下のとおりである。
上記で得られた実施例9、13、16および18、並びに比較例1〜4、12および13の研磨用組成物を用い、メタル層であるタングステン層を含むタングステンブランケット基板を研磨対象物として、メタル層(タングステン層)に対する研磨速度を測定した。なお、研磨速度の測定方法および研磨条件は上記の「相変化合金膜に対する研磨速度の測定」と同様である。
Claims (11)
- 金属元素または半金属元素を含む研磨対象物を研磨する用途で使用される研磨用組成物であって、
金属元素または半金属元素を含むオキソ酸と、
水と、
を含む、研磨用組成物。 - 前記研磨対象物が相変化合金を含み、
前記オキソ酸が半金属元素を含む、請求項1に記載の研磨用組成物。 - 前記相変化合金がゲルマニウム−アンチモン−テルル合金である、請求項2に記載の研磨用組成物。
- 前記オキソ酸が、半金属元素であるテルルを含む、請求項1〜3のいずれか1項に記載の研磨用組成物。
- 前記研磨対象物が金属元素を含むメタル層を含む、請求項1に記載の研磨用組成物。
- 前記メタル層がタングステンを含む、請求項5に記載の研磨用組成物。
- 前記オキソ酸と前記研磨対象物とが、同一の金属元素または半金属元素を含む、請求項1〜6のいずれか1項に記載の研磨用組成物。
- さらに非金属酸化剤を含む、請求項1〜7のいずれか1項に記載の研磨用組成物。
- さらに研磨促進剤を含む、請求項1〜8のいずれか1項に記載の研磨用組成物。
- 金属元素または半金属元素を含む研磨対象物を、請求項1〜9のいずれか1項に記載の研磨用組成物で研磨する工程を含む、研磨方法。
- 金属元素または半金属元素を含む研磨対象物を、請求項10に記載の研磨方法で研磨する工程を含む、基板の製造方法。
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JP7295849B2 (ja) | 2017-10-03 | 2023-06-21 | シーエムシー マテリアルズ,インコーポレイティド | タングステンバフ用途のための表面処理研削粒子 |
JP2021150561A (ja) * | 2020-03-23 | 2021-09-27 | 昭和電工マテリアルズ株式会社 | 研磨剤及び研磨方法 |
JP7487507B2 (ja) | 2020-03-23 | 2024-05-21 | 株式会社レゾナック | 研磨剤及び研磨方法 |
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WO2014038391A1 (ja) | 2014-03-13 |
TW201422795A (zh) | 2014-06-16 |
KR20150052057A (ko) | 2015-05-13 |
US9390938B2 (en) | 2016-07-12 |
KR102162824B1 (ko) | 2020-10-08 |
US20160153095A1 (en) | 2016-06-02 |
JP6222907B2 (ja) | 2017-11-01 |
US20150218709A1 (en) | 2015-08-06 |
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