JP2014047368A - ドラムスパッタ装置 - Google Patents
ドラムスパッタ装置 Download PDFInfo
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- JP2014047368A JP2014047368A JP2012189309A JP2012189309A JP2014047368A JP 2014047368 A JP2014047368 A JP 2014047368A JP 2012189309 A JP2012189309 A JP 2012189309A JP 2012189309 A JP2012189309 A JP 2012189309A JP 2014047368 A JP2014047368 A JP 2014047368A
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- drum
- granular material
- sputtering
- vacuum
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- 238000004544 sputter deposition Methods 0.000 title claims abstract description 83
- 239000008187 granular material Substances 0.000 claims abstract description 199
- 238000005477 sputtering target Methods 0.000 claims abstract description 24
- 238000011084 recovery Methods 0.000 claims description 35
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 21
- 239000001301 oxygen Substances 0.000 claims description 21
- 229910052760 oxygen Inorganic materials 0.000 claims description 21
- 239000007789 gas Substances 0.000 description 18
- 238000004891 communication Methods 0.000 description 15
- 239000011324 bead Substances 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000001766 barrel sputter deposition Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- 238000013019 agitation Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/223—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating specially adapted for coating particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/18—Non-metallic particles coated with metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3464—Operating strategies
- H01J37/347—Thickness uniformity of coated layers or desired profile of target erosion
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
【解決手段】粒状体が収容される真空容器2と、真空容器2内に配置されて少なくとも一方側端面10cが開口された筒状のドラム10と、ドラム10内に配置されるスパッタリングターゲット16と、を備えており、支持アーム11、回転用駆動モータ12、揺動用駆動モータ13、第一ギア部材14、及び第二ギア部材15により、ドラム10の軸線周りにドラムを回転させるとともに、ドラム10の軸線方向における一方側端部10eと他方側端部10fとが相対的に上下に入れ替わるようにドラム10を揺動させることが可能となっている。
【選択図】図1
Description
上記の実施形態で説明したドラムスパッタ装置1を用意し、粒状体供給室3及び粒状体回収室4を使用せず、ドラム10を揺動させずに30分間スパッタリングを行った。そして、粒状体の供給から粒状体の回収までに要した時間を計測した。
上記の実施形態で説明したドラムスパッタ装置1を用意し、粒状体供給室3及び粒状体回収室4を使用し、ドラム10を揺動させて30分間スパッタリングを行った。そして、粒状体の供給から粒状体の回収までに要した時間を計測した。
比較例1では、真空容器2の真空引きに150分、真空容器2内でのスパッタリングに30分、粒状体の取り出し作業に30分かかり、合計時間が210分となった。
上記の実施形態で説明したドラムスパッタ装置1を使用して、粒状体であるビーズにAlの触媒担持層を形成した。このとき、ドラム10を1rpmの回転速度で30分間回転させてスパッタリングを行った。その後、ビーズの触媒担持層にFeのカーボンナノチューブ合成用触媒を付着させた。このとき、ドラム10を5rpmの回転速度で9分間回転させてスパッタリングを行った。ビーズとしては、φ0.5mmのアルミナビーズを200g用いた。Alの平均膜厚は15nmであった。Feの平均膜厚は1.0nmであった。
ドラム10を回転させずにビーズが静止した状態でスパッタを行ったことを除き、実施例2と同一条件とした。
図5に、ビーズの写真を示す。図5(a)は、実施例2においてAlの触媒担持層を形成する前の写真である。図5(b)は、実施例2においてAlの触媒担持層を形成した後の写真である。図5(c)は、実施例2においてFeのカーボンナノチューブ合成用触媒を付着させた後の写真である。図5(d)は、比較例2においてFeのカーボンナノチューブ合成用触媒を付着させた後の写真である。図5(a)〜(c)と図5(d)とを比べると明らかなように、実施例2のビーズは、比較例2のビーズに比べて、スパッタのムラが小さくなっていた。
Claims (5)
- 粒状体が収容される真空容器と、
前記真空容器内に配置されて少なくとも一方側端面が開口された筒状のドラムと、
前記ドラム内に配置されるスパッタリングターゲットと、
前記ドラムの軸線周りに前記ドラムを回転させる回転機構と、
前記ドラムの軸線方向における一方側端部と他方側端部とが相対的に上下に入れ替わるように前記ドラムを揺動させる揺動機構と、
を有するドラムスパッタ装置。 - 前記ドラムは、軸線方向両端部が窄んでいる、
請求項1に記載のドラムスパッタ装置。 - 前記真空容器と接続される粒状体供給室と、
前記真空容器と前記粒状体供給室との間を開閉する第一の開閉装置と、
前記粒状体供給室内の空気を吸引する第一の吸引装置と、
前記粒状体供給室内に空気を供給する第一の大気開放装置と、
を更に有する請求項1又は2に記載のドラムスパッタ装置。 - 前記真空容器と接続されて前記ドラムの下方に配置される粒状体回収室と、
前記真空容器と前記粒状体回収室との間を開閉する第二の開閉装置と、
前記粒状体回収室内の空気を吸引する第二の吸引装置と、
前記粒状体回収室内に空気を供給する第二の大気開放装置と、
を更に有する請求項1〜3の何れか一項に記載のドラムスパッタ装置。 - 前記真空容器内に酸素を供給する酸素供給装置、
を更に有する請求項1〜4の何れか一項に記載のドラムスパッタ装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012189309A JP6301053B2 (ja) | 2012-08-29 | 2012-08-29 | ドラムスパッタ装置 |
CN201380044728.8A CN104603322B (zh) | 2012-08-29 | 2013-08-21 | 滚筒溅射装置 |
PCT/JP2013/072307 WO2014034497A1 (ja) | 2012-08-29 | 2013-08-21 | ドラムスパッタ装置 |
EP13833669.8A EP2891729B1 (en) | 2012-08-29 | 2013-08-21 | Drum sputtering device |
US14/424,123 US9920419B2 (en) | 2012-08-29 | 2013-08-21 | Drum sputtering device |
KR1020157004573A KR102197984B1 (ko) | 2012-08-29 | 2013-08-21 | 드럼 스퍼터 장치 |
CA2883512A CA2883512C (en) | 2012-08-29 | 2013-08-21 | Drum sputtering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012189309A JP6301053B2 (ja) | 2012-08-29 | 2012-08-29 | ドラムスパッタ装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017000102A Division JP6337977B2 (ja) | 2017-01-04 | 2017-01-04 | ドラムスパッタ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014047368A true JP2014047368A (ja) | 2014-03-17 |
JP6301053B2 JP6301053B2 (ja) | 2018-03-28 |
Family
ID=50183312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012189309A Active JP6301053B2 (ja) | 2012-08-29 | 2012-08-29 | ドラムスパッタ装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9920419B2 (ja) |
EP (1) | EP2891729B1 (ja) |
JP (1) | JP6301053B2 (ja) |
KR (1) | KR102197984B1 (ja) |
CN (1) | CN104603322B (ja) |
CA (1) | CA2883512C (ja) |
WO (1) | WO2014034497A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017057507A (ja) * | 2017-01-04 | 2017-03-23 | 日立化成株式会社 | ドラムスパッタ装置 |
US9920419B2 (en) | 2012-08-29 | 2018-03-20 | Hitachi Chemical Company, Ltd. | Drum sputtering device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11545343B2 (en) * | 2019-04-22 | 2023-01-03 | Board Of Trustees Of Michigan State University | Rotary plasma reactor |
CN114318269B (zh) * | 2022-01-05 | 2022-10-28 | 中国科学院兰州化学物理研究所 | 一种磁性粉体材料表面溅射沉积金属的装置及方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH03153864A (ja) * | 1989-11-09 | 1991-07-01 | Nippon Shokubai Kagaku Kogyo Co Ltd | 粒子の表面被覆方法及びその装置 |
JP2009078232A (ja) * | 2007-09-26 | 2009-04-16 | Omnibus:Kk | コーティング装置 |
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US3517644A (en) * | 1965-06-23 | 1970-06-30 | Mallory & Co Inc P R | Apparatus for making metal alloy resistors |
GB1497782A (en) * | 1975-02-13 | 1978-01-12 | Atomic Energy Authority Uk | Apparatus for depositing material |
JPH0680417B2 (ja) | 1985-06-26 | 1994-10-12 | 株式会社島津製作所 | 検量線を使用する成分分析方法 |
JP2909744B2 (ja) * | 1988-06-09 | 1999-06-23 | 日新製鋼株式会社 | 微粉末を被覆する方法と装置 |
FR2727132B1 (fr) * | 1994-11-18 | 1996-12-20 | Surface Engineering | Appareil de depot sous vide relatif d'un materiau sur des pieces en vrac |
US6241858B1 (en) | 1999-09-03 | 2001-06-05 | Flex Products, Inc. | Methods and apparatus for producing enhanced interference pigments |
JP3620842B2 (ja) * | 2002-12-25 | 2005-02-16 | 孝之 阿部 | 多角バレルスパッタ装置、多角バレルスパッタ方法及びそれにより形成された被覆微粒子、被覆微粒子の製造方法 |
JP2007204785A (ja) * | 2006-01-31 | 2007-08-16 | Bridgestone Corp | 粒子コーティング方法及び粒子コーティング装置 |
JP5039487B2 (ja) | 2007-09-26 | 2012-10-03 | 株式会社アルバック | 金属蒸着装置および同装置における粉体状担体の撹拌方法 |
JP5497553B2 (ja) * | 2010-06-28 | 2014-05-21 | 日本ピラー工業株式会社 | 微粒子の皮膜形成方法及びその装置 |
JP2012172240A (ja) * | 2011-02-24 | 2012-09-10 | Ikusei Rika Kogyo:Kk | スパッタリング装置 |
JP6301053B2 (ja) | 2012-08-29 | 2018-03-28 | 日立化成株式会社 | ドラムスパッタ装置 |
-
2012
- 2012-08-29 JP JP2012189309A patent/JP6301053B2/ja active Active
-
2013
- 2013-08-21 CA CA2883512A patent/CA2883512C/en active Active
- 2013-08-21 KR KR1020157004573A patent/KR102197984B1/ko active IP Right Grant
- 2013-08-21 WO PCT/JP2013/072307 patent/WO2014034497A1/ja active Application Filing
- 2013-08-21 EP EP13833669.8A patent/EP2891729B1/en active Active
- 2013-08-21 US US14/424,123 patent/US9920419B2/en active Active
- 2013-08-21 CN CN201380044728.8A patent/CN104603322B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03153864A (ja) * | 1989-11-09 | 1991-07-01 | Nippon Shokubai Kagaku Kogyo Co Ltd | 粒子の表面被覆方法及びその装置 |
JP2009078232A (ja) * | 2007-09-26 | 2009-04-16 | Omnibus:Kk | コーティング装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9920419B2 (en) | 2012-08-29 | 2018-03-20 | Hitachi Chemical Company, Ltd. | Drum sputtering device |
JP2017057507A (ja) * | 2017-01-04 | 2017-03-23 | 日立化成株式会社 | ドラムスパッタ装置 |
Also Published As
Publication number | Publication date |
---|---|
KR102197984B1 (ko) | 2021-01-04 |
KR20150046052A (ko) | 2015-04-29 |
WO2014034497A1 (ja) | 2014-03-06 |
US9920419B2 (en) | 2018-03-20 |
CA2883512A1 (en) | 2014-03-06 |
JP6301053B2 (ja) | 2018-03-28 |
CA2883512C (en) | 2020-10-27 |
CN104603322A (zh) | 2015-05-06 |
CN104603322B (zh) | 2018-10-19 |
EP2891729A1 (en) | 2015-07-08 |
EP2891729A4 (en) | 2016-04-27 |
US20150307983A1 (en) | 2015-10-29 |
EP2891729B1 (en) | 2020-03-04 |
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