JP2014044976A5 - - Google Patents

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Publication number
JP2014044976A5
JP2014044976A5 JP2012184847A JP2012184847A JP2014044976A5 JP 2014044976 A5 JP2014044976 A5 JP 2014044976A5 JP 2012184847 A JP2012184847 A JP 2012184847A JP 2012184847 A JP2012184847 A JP 2012184847A JP 2014044976 A5 JP2014044976 A5 JP 2014044976A5
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JP
Japan
Prior art keywords
value
frequency power
control range
signal
analog
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JP2012184847A
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English (en)
Japanese (ja)
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JP2014044976A (ja
JP5841917B2 (ja
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Priority claimed from JP2012184847A external-priority patent/JP5841917B2/ja
Priority to JP2012184847A priority Critical patent/JP5841917B2/ja
Priority to TW102101095A priority patent/TWI478204B/zh
Priority to US13/743,367 priority patent/US20140057445A1/en
Priority to KR20130006127A priority patent/KR101479639B1/ko
Priority to CN201310018419.5A priority patent/CN103632914B/zh
Publication of JP2014044976A publication Critical patent/JP2014044976A/ja
Publication of JP2014044976A5 publication Critical patent/JP2014044976A5/ja
Publication of JP5841917B2 publication Critical patent/JP5841917B2/ja
Application granted granted Critical
Priority to US15/284,668 priority patent/US10727088B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012184847A 2012-08-24 2012-08-24 プラズマ処理装置及びプラズマ処理方法 Active JP5841917B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012184847A JP5841917B2 (ja) 2012-08-24 2012-08-24 プラズマ処理装置及びプラズマ処理方法
TW102101095A TWI478204B (zh) 2012-08-24 2013-01-11 Plasma processing device and plasma processing method
US13/743,367 US20140057445A1 (en) 2012-08-24 2013-01-17 Plasma processing apparatus and plasma processing method
CN201310018419.5A CN103632914B (zh) 2012-08-24 2013-01-18 等离子体处理装置以及等离子体处理方法
KR20130006127A KR101479639B1 (ko) 2012-08-24 2013-01-18 플라즈마 처리 장치 및 플라즈마 처리 방법
US15/284,668 US10727088B2 (en) 2012-08-24 2016-10-04 Plasma processing apparatus and plasma processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012184847A JP5841917B2 (ja) 2012-08-24 2012-08-24 プラズマ処理装置及びプラズマ処理方法

Publications (3)

Publication Number Publication Date
JP2014044976A JP2014044976A (ja) 2014-03-13
JP2014044976A5 true JP2014044976A5 (enExample) 2015-07-23
JP5841917B2 JP5841917B2 (ja) 2016-01-13

Family

ID=50148356

Family Applications (1)

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JP2012184847A Active JP5841917B2 (ja) 2012-08-24 2012-08-24 プラズマ処理装置及びプラズマ処理方法

Country Status (5)

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US (2) US20140057445A1 (enExample)
JP (1) JP5841917B2 (enExample)
KR (1) KR101479639B1 (enExample)
CN (1) CN103632914B (enExample)
TW (1) TWI478204B (enExample)

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KR101503258B1 (ko) * 2014-11-14 2015-03-17 (주) 일하하이텍 플라즈마를 이용한 기판 처리 방법
JP6491888B2 (ja) * 2015-01-19 2019-03-27 株式会社日立ハイテクノロジーズ プラズマ処理方法およびプラズマ処理装置
JP6670697B2 (ja) * 2016-04-28 2020-03-25 東京エレクトロン株式会社 プラズマ処理装置
US10424467B2 (en) * 2017-03-13 2019-09-24 Applied Materials, Inc. Smart RF pulsing tuning using variable frequency generators
JP7061922B2 (ja) * 2018-04-27 2022-05-02 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
CN108566717B (zh) * 2018-06-29 2024-07-02 合肥中科离子医学技术装备有限公司 采用微波垂直注入激励等离子体发生装置
US11424105B2 (en) * 2019-08-05 2022-08-23 Hitachi High-Tech Corporation Plasma processing apparatus
US12437968B2 (en) * 2020-09-02 2025-10-07 Hitachi High-Tech Corporation Plasma processing apparatus and plasma processing method
KR20230168145A (ko) * 2022-06-03 2023-12-12 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치, 플라즈마 처리 방법, 압력 밸브 제어 장치, 압력 밸브 제어 방법 및 압력 조정 시스템

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Publication number Priority date Publication date Assignee Title
IL76283A0 (en) 1985-09-03 1986-01-31 Ibm Process and system for coding signals
JP3286951B2 (ja) * 1993-07-16 2002-05-27 株式会社アルバック プラズマｃｖｄ成膜方法と装置
DE69408405T2 (de) * 1993-11-11 1998-08-20 Nissin Electric Co Ltd Plasma-CVD-Verfahren und Vorrichtung
JPH08250479A (ja) * 1995-03-15 1996-09-27 Hitachi Ltd 表面処理方法及び表面処理装置
KR100560886B1 (ko) * 1997-09-17 2006-03-13 동경 엘렉트론 주식회사 가스 플라즈마 프로세스를 감시 및 제어하기 위한 시스템및 방법
KR100521120B1 (ko) * 1998-02-13 2005-10-12 가부시끼가이샤 히다치 세이사꾸쇼 반도체소자의 표면처리방법 및 장치
JP2001085394A (ja) 1999-09-10 2001-03-30 Hitachi Ltd 表面処理方法および表面処理装置
JP4414518B2 (ja) * 1999-09-10 2010-02-10 株式会社日立製作所 表面処理装置
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US20050112891A1 (en) 2003-10-21 2005-05-26 David Johnson Notch-free etching of high aspect SOI structures using a time division multiplex process and RF bias modulation
JP2005130198A (ja) 2003-10-23 2005-05-19 Ulvac Japan Ltd 高周波装置
JP2005214932A (ja) * 2004-02-02 2005-08-11 Daihen Corp 信号処理装置、この信号処理装置を用いた電圧測定装置及び電流測定装置
JP4920991B2 (ja) * 2006-02-22 2012-04-18 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
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KR101489326B1 (ko) * 2008-09-09 2015-02-11 삼성전자주식회사 기판의 처리 방법
JP5377993B2 (ja) * 2009-01-30 2013-12-25 株式会社日立ハイテクノロジーズ プラズマ処理方法
US8383001B2 (en) * 2009-02-20 2013-02-26 Tokyo Electron Limited Plasma etching method, plasma etching apparatus and storage medium
JP5977509B2 (ja) * 2011-12-09 2016-08-24 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
US9070998B2 (en) * 2012-07-27 2015-06-30 Amphenol Corporation High speed electrical contact assembly

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