JP2014031444A - 回路接続用接着剤組成物、接着シート、接着剤リール及び回路部材の接続構造体 - Google Patents
回路接続用接着剤組成物、接着シート、接着剤リール及び回路部材の接続構造体 Download PDFInfo
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- JP2014031444A JP2014031444A JP2012172961A JP2012172961A JP2014031444A JP 2014031444 A JP2014031444 A JP 2014031444A JP 2012172961 A JP2012172961 A JP 2012172961A JP 2012172961 A JP2012172961 A JP 2012172961A JP 2014031444 A JP2014031444 A JP 2014031444A
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Conductive Materials (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
【解決手段】本発明は、熱可塑性樹脂と、ラジカル重合性化合物と、ラジカル重合開始剤とを含み、ラジカル重合性化合物が酸変性エポキシアクリレートを含有する回路接続用接着剤組成物を提供する。
【選択図】なし
Description
(測定条件)
装置:東ソー株式会社製 GPC−8020
検出器:東ソー株式会社製 RI−8020
カラム:日立化成工業株式会社製 Gelpack GL−A−160−S+GL−A150
試料濃度:120mg/3mL
溶媒:テトラヒドロフラン
注入量:60μL
圧力:30kgf/cm2
流量:1.00mL/min
(a)熱可塑性樹脂は、加熱により粘度の高い液状状態になって外力により自由に変形し、冷却し外力を取り除くとその形状を保ったままで硬くなり、この過程を繰り返し行える性質を持つ樹脂(高分子)をいう。また、(a)熱可塑性樹脂は、上記の性質を有する反応性官能基を有する樹脂(高分子)であってもよい。(a)熱可塑性樹脂のガラス転移温度(Tg)は、−30℃以上190℃以下が好ましく、−25℃以上170℃以下がより好ましく、−20℃以上150℃以下が更に好ましい。
本実施形態に係る接着剤組成物は、(b)ラジカル重合性化合物として酸変性エポキシアクリレートを含有する。ここで、エポキシアクリレートは、エポキシ樹脂末端のエポキシ基に(メタ)アクリル酸が付加して得られる化合物である。また、酸変性エポキシアクリレートは、エポキシアクリレート中に存在する水酸基の一部又は全部に、ブレンステッド酸又は酸無水物が付加して得られる化合物である。
[式(M)中、R15及びR16はそれぞれ独立に水素原子又はメチル基を示し、R17はエチレン基又はプロピレン基を示し、R18は飽和脂肪族基又は飽和脂環式基を示し、R19は、エステル基を含有する飽和脂肪族基又は飽和脂環式基、若しくは、カーボネート基を含有する飽和脂肪族基又は飽和脂環式基を示し、kは1〜40の整数を示す。なお、式(M)中、R17同士、R18同士はそれぞれ同一でも異なってもよい。]
[式(N)中、R20は(メタ)アクリロイルオキシ基を示し、R21は水素原子又はメチル基を示し、l及びmはそれぞれ独立に1〜8の整数を示す。なお、式(N)中、R20同士、R21同士、l同士及びm同士はそれぞれ同一でも異なってもよい。]
(c)ラジカル重合開始剤としては、従来から知られている有機過酸化物やアゾ化合物等、外部からのエネルギーの付与によりラジカルを発生する化合物を用いることができる。(c)ラジカル重合開始剤としては、安定性、反応性、相溶性の観点から、1分間半減期温度が90〜175℃であり且つ重量平均分子量が180〜1000の有機過酸化物が好ましい。1分間半減期温度がこの範囲にあることで、貯蔵安定性に更に優れ、ラジカル重合性も充分に高く、短時間で硬化できる。
本実施形態の接着剤組成物は、(d)導電性粒子を更に含むことができる。(d)導電性粒子は、その全体又は表面に導電性を有する粒子であればよいが、接続端子を有する部材の接続に使用する場合は、接続端子間の距離よりも平均粒径が小さい粒子が好ましい。
本実施形態に係る接着剤組成物には、硬化速度の制御及び貯蔵安定性を更に向上させるために、安定化剤を添加することできる。このような安定化剤としては、特に制限なく公知の化合物を使用することができるが、例えば、ベンゾキノン、ハイドロキノン等のキノン誘導体;4−メトキシフェノール、4−t−ブチルカテコール等のフェノール誘導体;2,2,6,6−テトラメチルピペリジン−1−オキシル、4−ヒドロキシ−2,2,6,6−テトラメチルピペリジン−1−オキシル等のアミノキシル誘導体;テトラメチルピペリジルメタクリレート等のヒンダードアミン誘導体が挙げられる。安定化剤は、1種を単独で又は2種以上を混合して用いることができる。
[式(Q)中、R25、R26及びR27はそれぞれ独立に、水素原子、炭素数1〜5のアルキル基、炭素数1〜5のアルコキシ基、炭素数1〜5のアルコキシカルボニル基又はアリール基を示し、R28は(メタ)アクリロイル基、ビニル基、イソシアナート基、イミダゾール基、メルカプト基、アミノ基、メチルアミノ基、ジメチルアミノ基、ベンジルアミノ基、フェニルアミノ基、シクロヘキシルアミノ基、モルホリノ基、ピペラジノ基、ウレイド基又はグリシジル基を示し、sは1〜10の整数を示す。]
図1は、実施形態に係る接着シートを示す模式断面図である。接着シート5は、基材6とその一方面上に設けられた上記接着剤組成物から形成された接着剤層4とを有する。
図2は、接着剤リールの一実施形態を示す斜視図である。図2に示す接着剤リール50は、筒状の巻芯1及び巻芯1の軸方向の両端面にそれぞれ設けられた円形の側板2を備える。
次に、上述した接着剤組成物を用いた接続構造体について説明する。図3は、第1実施形態に係る接続構造体を示す模式断面図である。図4は、図3に示す接続構造体の製造方法を示す模式断面図である。図3に示す回路部材の接続構造体100は、(d)導電性粒子を含有しない接着剤組成物を用いて得られる。
(ポリエステルウレタンの準備)
ポリエステルウレタン樹脂(商品名:UR−4800、東洋紡株式会社製、Mw:32000、Tg:106℃)をメチルエチルケトンとトルエンの1:1混合溶媒に溶解して樹脂分30質量%の混合溶媒溶解品を準備した。
フェノキシ樹脂(商品名:YP−50、東都化成株式会社製、Mw:60000、Tg:80℃)40質量部をメチルエチルケトン60質量部に溶解して、固形分40質量%の溶液を準備した。
(酸変性エポキシアクリレート(EA1)の合成)
ビスフェノールF型エポキシ樹脂(商品名:EPICON−835、DIC株式会社製)1850g、アクリル酸720.6g、メチルハイドロキノン5.5g、カルビトールアセテート1349.6g及びソルベントナフサ578.4gを混合し90℃で攪拌して、反応液を調製した。反応液を60℃まで冷却し、トリフェニルフォスフィン16.5gを加え、98℃で32時間反応した後室温まで冷却し、ビスフェノールF型エポキシアクリレート(A1)を得た。
ビフェニル型エポキシ樹脂(商品名:YL6121H、三菱化学株式会社製)1800g、アクリル酸720.6g、メチルハイドロキノン5.5g、カルビトールアセテート1349.6g及びソルベントナフサ578.4gを混合し90℃で攪拌して、反応液を調製した。反応液を60℃まで冷却し、トリフェニルフォスフィン16.5gを仕込み、98℃で32時間反応した後室温まで冷却し、ビフェニル型エポキシアクリレート(A2)を得た。
ビフェニル型エポキシ樹脂(商品名:YX7399、三菱化学株式会社)2600g、アクリル酸720.6g、メチルハイドロキノン5.5g、カルビトールアセテート1349.6g及びソルベントナフサ578.4gを混合し90℃で攪拌して、反応液を調製した。反応液を60℃まで冷却し、トリフェニルフォスフィン16.5gを仕込み、98℃で32時間反応した後室温まで冷却し、ビフェニル型エポキシアクリレート(A3)を得た。
攪拌機、温度計、塩化カルシウム乾燥管を有する還流冷却管、及び、窒素ガス導入管を備えた反応容器に、数平均分子量1000のポリ(1,6−ヘキサンジオールカーボネート)(商品名:デュラノール T5652、旭化成ケミカルズ株式会社製)2500g(2.50mol)と、イソホロンジイソシアネート(シグマアルドリッチ社製)666g(3.00mol)とを3時間で均一に滴下し、反応容器に充分に窒素ガスを導入した後、70〜75℃に加熱して反応させた。反応容器に、ハイドロキノンモノメチルエーテル(シグマアルドリッチ社製)0.53gと、ジブチルスズジラウレート(シグマアルドリッチ社製)5.53gとを添加した後、2−ヒドロキシエチルアクリレート(シグマアルドリッチ社製)238g(2.05mol)を加え、空気雰囲気下70℃で6時間反応させ、ウレタンアクリレート(UA1)を得た。ウレタンアクリレートのMwは15000であった。
イソシアヌル酸変性2官能アクリレートとして、ジ(アクリロキシエチル)イソシアヌレート(商品名:アロニックスM−215、東亞合成株式会社製)を準備した。
リン酸基を有するビニル化合物として、2−(メタ)アクリロイルオキシエチルホスフェート(商品名:ライトエステルP−2M、共栄社化学株式会社製)を準備した。
ラジカル重合開始剤として、ジベンゾイルパーオキサイド(商品名:ナイパーBW、日油株式会社製)を準備した。
(導電性粒子の作製)
ポリスチレンを核とする粒子の表面に厚み0.2μmのニッケル層を設けた後、このニッケル層の外側に厚み0.02μmの金層を設けて、平均粒径10μm、比重2.5の導電性粒子を作製した。
(接着剤組成物の作製)
固形質量比で表1に示すように熱可塑性樹脂、ラジカル重合性化合物及びラジカル重合開始剤を配合し、さらに、接着剤成分(接着剤組成物における導電性粒子を除いた成分)の全体積を基準として導電性粒子を1.5体積%配合分散させて、接着剤組成物を得た。
実施例及び比較例で得られた接着剤組成物をそれぞれ、塗工装置を用いて厚み80μmのフッ素樹脂フィルム上に塗布し、70℃、10分の熱風乾燥によって接着剤層の厚みが16μmの接着シートを作製した。次いで、得られた接着シートのフッ素樹脂フィルム側とは反対側の面に対して垂直にスリット刃を入れ、接着シートを切断しながら、0.1m/sの速度で該接着シートを巻き取って、リール状製品(接着テープ)を得た。
実施例1〜10及び比較例1〜4で作製した接着シートの接着剤層を、ポリイミドフィルム上にライン幅25μm、ピッチ50μm、厚み8μmの銅回路を500本有するフレキシブル回路板(FPC)と、0.2μmのITOの薄層を形成した厚み1.1mmのガラス(ITO、表面抵抗20Ω/□)との間に介在させた。これを、熱圧着装置(加熱方式:コンスタントヒート型、東レエンジニアリング社製)を用いて、160℃、3MPaで10秒間加熱加圧して幅2mmにわたり接続し、接続構造体Aを作製した。この接続構造体Aの隣接回路間の抵抗値を、接続直後と、85℃、85%RHの恒温恒湿槽中に240時間保持した後(高温高湿試験後)とにおいて、マルチメータを用いて測定した。抵抗値は隣接回路間の抵抗37点の平均で示した。
上述の通り作製した接着テープを用いて、以下の通り、耐ブロッキング性の評価を行った。まず、接着テープが回転しないように固定し、この接着テープから引き出した接着シートの先端に75gf(0.74N)の荷重を加えたままの状態で、35℃の恒温槽中に保持した。2時間保持後、接着テープが回転できるようにして、該接着テープから接着シートを0.1m/sの速度で100m引き出し、基材フィルムと接着剤層との間に剥離が発生したものを耐ブロッキング性「なし」、基材フィルムと接着剤層の剥離が発生しなかったものを耐ブロッキング性「あり」と判定した。なお、判定は目視によって行った。結果を表2に示す。
Claims (11)
- 熱可塑性樹脂と、ラジカル重合性化合物と、ラジカル重合開始剤とを含み、
前記ラジカル重合性化合物が酸変性エポキシアクリレートを含有する、回路接続用接着剤組成物。 - 前記酸変性エポキシアクリレートが、ビスフェノールF型酸変性エポキシアクリレート又はビフェニル型酸変性エポキシアクリレートである、請求項1に記載の接着剤組成物。
- 前記酸変性エポキシアクリレートの重量平均分子量が3000〜15000である、請求項1又は2に記載の接着剤組成物。
- 前記ラジカル重合性化合物が、リン酸基を有するビニル化合物を更に含有する、請求項1〜3のいずれか一項に記載の接着剤組成物。
- 前記熱可塑性樹脂が、フェノキシ樹脂、ポリウレタン樹脂、ポリエステルウレタン樹脂、ブチラール樹脂、アクリル樹脂、ポリイミド樹脂及びポリアミド樹脂からなる群より選ばれる少なくとも1種を含有する、請求項1〜4のいずれか一項に記載の接着剤組成物。
- 導電性粒子を更に含む、請求項1〜5のいずれか一項に記載の接着剤組成物。
- 基材と、該基材上に設けられた請求項1〜6のいずれか一項に記載の回路接続用接着剤組成物からなる接着剤層と、を備える接着シート。
- 請求項7に記載の接着シートと、該接着シートが巻かれた巻芯と、を備える接着剤リール。
- 第1の基板及び該第1の基板の主面上に配置された第1の接続端子を有する第1の回路部材と、
第2の基板及び該第2の基板の主面上に配置された第2の接続端子を有する第2の回路部材と、
前記第1の回路部材及び前記第2の回路部材の間に配置された接続部材と、を備え、
前記接続部材が、請求項1〜6のいずれか一項に記載の回路接続用接着剤組成物の硬化物を含有し、
前記第1の接続端子及び前記第2の接続端子が電気的に接続されている、回路部材の接続構造体。 - 前記第1の基板及び前記第2の基板の少なくとも一方が、ガラス転移温度が200℃以下の熱可塑性樹脂を含む基材から構成されている、請求項9に記載の接続構造体。
- 前記第1の基板が、ポリエチレンテレフタレート、ポリカーボネート及びポリエチレンナフタレートからなる群より選ばれる少なくとも1種を含有する基材から構成され、
前記第2の基板が、ポリイミド樹脂及びポリエチレンテレフタレートからなる群より選ばれる少なくとも1種を含有する基材から構成されている、請求項9又は10に記載の接続構造体。
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WO2018147163A1 (ja) * | 2017-02-13 | 2018-08-16 | デクセリアルズ株式会社 | 接続構造体、異方性接着材料、および接続構造体の製造方法 |
JP2018133562A (ja) * | 2017-02-13 | 2018-08-23 | デクセリアルズ株式会社 | 接続構造体、異方性接着材料、および接続構造体の製造方法 |
JP2020139020A (ja) * | 2019-02-27 | 2020-09-03 | ナミックス株式会社 | 導電性接着剤 |
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