JP2014029991A - 窒化物半導体装置の電極構造および窒化物半導体電界効果トランジスタ - Google Patents
窒化物半導体装置の電極構造および窒化物半導体電界効果トランジスタ Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 121
- 150000004767 nitrides Chemical class 0.000 title claims abstract description 109
- 230000005669 field effect Effects 0.000 title claims description 20
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- 238000010276 construction Methods 0.000 claims 1
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- 230000005533 two-dimensional electron gas Effects 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
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- 239000010432 diamond Substances 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
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- 229910017083 AlN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
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Abstract
【解決手段】この電極構造によれば、ソース電極(111),ドレイン電極(112)が絶縁膜(107)と窒化物半導体積層体(105)の凹部(116,119)の開口縁(116A,119A)との間で窒化物半導体積層体(105)の表面に接するように凹部(116,119)から絶縁膜(107)の表面(107C)に亘って形成されている。このようなオーミック電極の構造によれば、オーミック電極の端縁部が窒化物半導体積層体と絶縁膜との間に挟まれた従来の電極構造に比べて、窒化物半導体積層体(105)に隣接するソース電極(111),ドレイン電極(112)の端でのオン時の最大電界強度を低減でき、オン耐圧を向上させることができる。
【選択図】図1
Description
上記窒化物半導体積層体の表面上に形成されていると共に上記凹部の開口縁から上記窒化物半導体積層体の表面に沿って予め定められた距離だけ離隔した絶縁膜と、
上記絶縁膜と上記凹部の開口縁との間で上記窒化物半導体積層体の表面に接するように上記窒化物半導体積層体の凹部から上記絶縁膜の表面に亘って形成されたオーミック電極とを備えたことを特徴としている。
上記絶縁膜が上記凹部の開口縁から離隔した第2の距離の2倍以上である。
シリコン窒化膜を含む絶縁膜またはシリコン窒化膜からなる絶縁膜、あるいは、シリコン酸化窒化膜からなる絶縁膜、シリコン窒化炭化膜からなる絶縁膜、酸化アルミニウムまたは窒化アルミニウムからなる絶縁膜である。
第1のGaN系半導体層と、
上記第1のGaN系半導体層上に積層されていると共に上記第1のGaN系半導体層とヘテロ界面を形成する第2のGaN系半導体層とを有する。
上記オーミック電極で構成されたソース電極と、
上記オーミック電極で構成されたドレイン電極と、
上記窒化物半導体積層体上に形成されたゲート電極と
を備えた。
図1はこの発明の第1実施形態の電極構造の実施形態を備えた窒化物半導体装置の断面図を示しており、この窒化物半導体装置はGaN系HFET(Hetero-junction Field Effect Transistor;ヘテロ接合電界効果トランジスタ)である。
上記絶縁膜107を貫通して上記AlGaNバリア層104に達するショットキー電極としてのゲート電極113を形成してもよい。
図9〜図13を参照して、上記実施形態の電極構造におけるドレイン電極112の端での最大電界強度のシミュレーション結果を説明する。
第2実施形態の窒化物半導体装置の電極構造は、第1実施形態における絶縁膜107を、シリコン酸窒化膜(SiON)を含む絶縁膜、または、シリコン炭窒化膜(SiCN)を含む絶縁膜としたものである。この絶縁膜としてSiON膜またはSiCN膜を含むことにより、電流コラプスの低減を図れる。
第3実施形態の窒化物半導体装置の電極構造は、第1実施形態における絶縁膜107を、酸化アルミニウム膜(Al2O3)を含む絶縁膜、または、シリコン酸化膜(SiO2)を含む絶縁膜としたものである。この絶縁膜としてAl2O3膜またはSiO2膜を含むことにより、電流コラプスの低減を図れる。
第4実施形態の窒化物半導体装置の電極構造は、第1実施形態における絶縁膜107を、AlN膜を含む絶縁膜としたものである。この絶縁膜としてAlN膜を含むことにより、電流コラプスの低減を図れる。
102 アンドープAlGaNバッファ層
103 アンドープGaNチャネル層
104 アンドープAlGaNバリア層
104A 表面
104B 側壁
105 窒化物半導体積層体
106 2次元電子ガス(2DEG)層
107 絶縁膜
107A,107B 開口部
107A‐1,107B‐1 側壁
111 ソース電極
111A 第1鍔部
111B 第2鍔部
112 ドレイン電極
112A 第1鍔部
112B 第2鍔部
112C 外縁
113 ゲート電極
116,119 凹部
116A,119A 開口縁
126 フォトレジスト層
126A,126B 開口
L1 仮想線
X1 第1の距離
X2 第2の距離
Y1 絶縁膜の膜厚
Y2 凹部の深さ
Claims (4)
- ヘテロ界面を有すると共に表面から上記ヘテロ界面に向かって窪んだ凹部を有する窒化物半導体積層体と、
上記窒化物半導体積層体の表面上に形成されていると共に上記凹部の開口縁から上記窒化物半導体積層体の表面に沿って予め定められた距離だけ離隔した絶縁膜と、
上記絶縁膜と上記凹部の開口縁との間で上記窒化物半導体積層体の表面に接するように上記窒化物半導体積層体の凹部から上記絶縁膜の表面に亘って形成されたオーミック電極と
を備えたことを特徴とする窒化物半導体装置の電極構造。 - 請求項1に記載の窒化物半導体装置の電極構造において、
上記凹部の開口縁から上記窒化物半導体積層体の表面の法線方向に伸ばした仮想線と上記絶縁膜の表面上の上記オーミック電極の外縁との間の第1の距離は、
上記絶縁膜が上記凹部の開口縁から離隔した第2の距離の2倍以上であることを特徴とする窒化物半導体装置の電極構造。 - 請求項1または2に記載の窒化物半導体装置の電極構造において、
上記窒化物半導体積層体は、
第1のGaN系半導体層と、
上記第1のGaN系半導体層上に積層されていると共に上記第1のGaN系半導体層とヘテロ界面を形成する第2のGaN系半導体層とを有することを特徴とする窒化物半導体装置の電極構造。 - 請求項1から3のいずれか1つに記載の窒化物半導体装置の電極構造を備え、
上記オーミック電極で構成されたソース電極と、
上記オーミック電極で構成されたドレイン電極と、
上記窒化物半導体積層体上に形成されたゲート電極と
を備えたことを特徴とする窒化物半導体電界効果トランジスタ。
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JP2013127606A JP2014029991A (ja) | 2012-06-29 | 2013-06-18 | 窒化物半導体装置の電極構造および窒化物半導体電界効果トランジスタ |
CN201380033935.3A CN104395994A (zh) | 2012-06-29 | 2013-06-26 | 氮化物半导体器件的电极结构和氮化物半导体场效应晶体管 |
PCT/JP2013/067518 WO2014003058A1 (ja) | 2012-06-29 | 2013-06-26 | 窒化物半導体装置の電極構造および窒化物半導体電界効果トランジスタ |
US14/410,220 US20150349108A1 (en) | 2012-06-29 | 2013-06-26 | Electrode structure for nitride semiconductor device, and nitride semiconductor field effect transistor |
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US10217819B2 (en) * | 2015-05-20 | 2019-02-26 | Samsung Electronics Co., Ltd. | Semiconductor device including metal-2 dimensional material-semiconductor contact |
EP4016586A4 (en) * | 2020-06-01 | 2022-10-12 | Nuvoton Technology Corporation Japan | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE |
WO2022051932A1 (en) * | 2020-09-09 | 2022-03-17 | Innoscience (Suzhou) Technology Co., Ltd. | Semiconductor device structures and methods of manufacturing the same |
CN117832260B (zh) * | 2024-01-12 | 2024-08-27 | 上海新微半导体有限公司 | 一种漏极结构及制作方法 |
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WO2014003058A1 (ja) | 2014-01-03 |
US20150349108A1 (en) | 2015-12-03 |
CN104395994A (zh) | 2015-03-04 |
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