JP2014022588A - 基板処理方法 - Google Patents
基板処理方法 Download PDFInfo
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- JP2014022588A JP2014022588A JP2012160393A JP2012160393A JP2014022588A JP 2014022588 A JP2014022588 A JP 2014022588A JP 2012160393 A JP2012160393 A JP 2012160393A JP 2012160393 A JP2012160393 A JP 2012160393A JP 2014022588 A JP2014022588 A JP 2014022588A
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- 239000000758 substrate Substances 0.000 title claims abstract description 151
- 238000003672 processing method Methods 0.000 title claims abstract description 19
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 98
- 239000002019 doping agent Substances 0.000 claims abstract description 95
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 86
- 239000001257 hydrogen Substances 0.000 claims abstract description 86
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 22
- 239000010703 silicon Substances 0.000 claims abstract description 22
- 238000000137 annealing Methods 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 21
- 239000000126 substance Substances 0.000 claims description 9
- 230000004913 activation Effects 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 5
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 claims description 4
- 229910052805 deuterium Inorganic materials 0.000 claims description 4
- 150000002431 hydrogen Chemical class 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 14
- 239000000377 silicon dioxide Substances 0.000 abstract description 7
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract description 6
- 239000007789 gas Substances 0.000 description 35
- 239000010410 layer Substances 0.000 description 29
- 238000006243 chemical reaction Methods 0.000 description 24
- 230000007246 mechanism Effects 0.000 description 19
- 238000000034 method Methods 0.000 description 17
- 239000012535 impurity Substances 0.000 description 15
- 239000001307 helium Substances 0.000 description 10
- 229910052734 helium Inorganic materials 0.000 description 10
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 5
- 238000005468 ion implantation Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052724 xenon Inorganic materials 0.000 description 4
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- YZCKVEUIGOORGS-NJFSPNSNSA-N Tritium Chemical compound [3H] YZCKVEUIGOORGS-NJFSPNSNSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 229910052722 tritium Inorganic materials 0.000 description 2
- BMIBJCFFZPYJHF-UHFFFAOYSA-N 2-methoxy-5-methyl-3-(4,4,5,5-tetramethyl-1,3,2-dioxaborolan-2-yl)pyridine Chemical compound COC1=NC=C(C)C=C1B1OC(C)(C)C(C)(C)O1 BMIBJCFFZPYJHF-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000010574 gas phase reaction Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- QGLVEAGMVUQOJP-UHFFFAOYSA-N prop-2-enylboronic acid Chemical compound OB(O)CC=C QGLVEAGMVUQOJP-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/228—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a liquid phase, e.g. alloy diffusion processes
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
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- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02321—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment introduction of substances into an already existing insulating layer
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
- H01L21/2686—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation using incoherent radiation
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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Abstract
【解決手段】表面に自然酸化膜が形成された基板を水素雰囲気中にて加熱することによって、二酸化ケイ素を水素で還元している。さらに、自然酸化膜との界面近傍に存在しているシリコンを水素終端している。これにより、シリコンに水素が結合した水素導入層が基板表面に形成される。水素導入層が形成された基板の表面にドーパント液を供給し、水素導入層中の水素をドーパントに置き換えることによって、基板の表面にドーパントが導入される。自然酸化膜の還元によって形成された水素導入層は比較的厚いため、基板の表面から必要とされる深さに均一にドーパントを導入することができる。ドーパントが導入された基板の表面にはフラッシュ光が照射されて、ドーパントが活性化される。
【選択図】図4
Description
11 反応容器
12 発熱体
21 処理ガス供給機構
22 水素ガス供給源
23 不活性ガス供給源
30 液供給装置
36 ノズル
38 ドーパント液供給源
40 フラッシュランプアニール装置
101 自然酸化膜
102 水素導入層
103 ドーパント液
104 ドーパント導入層
FL フラッシュランプ
W 基板
Claims (4)
- シリコンの基板の表面にドーパントを導入する基板処理方法であって、
表面に酸化膜が形成された基板を水素を含む雰囲気中にて加熱して前記酸化膜を水素還元するとともに、前記酸化膜との界面に存在しているシリコンを水素終端する水素アニール工程と、
前記水素アニール工程の後、前記基板の表面にドーパントを含む薬液を供給して当該表面にドーパントを導入する導入工程と、
を備えることを特徴とする基板処理方法。 - 請求項1記載の基板処理方法において、
前記水素アニール工程は、水素濃度が4%以上10%以下の雰囲気中にて表面に酸化膜が形成された基板を600℃以上1300℃以下で30分以上60分以下加熱することを特徴とする基板処理方法。 - 請求項1または請求項2に記載の基板処理方法において、
前記水素は重水素であることを特徴とする基板処理方法。 - 請求項1から請求項3のいずれかに記載の基板処理方法において、
前記導入工程の後、前記基板の表面にフラッシュ光を照射して導入されたドーパントを活性化する活性化工程をさらに備えることを特徴とする基板処理方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2012160393A JP6157809B2 (ja) | 2012-07-19 | 2012-07-19 | 基板処理方法 |
KR1020157001169A KR101632544B1 (ko) | 2012-07-19 | 2013-06-05 | 기판 처리 방법 |
US14/408,390 US9343311B2 (en) | 2012-07-19 | 2013-06-05 | Substrate treatment method |
PCT/JP2013/065571 WO2014013809A1 (ja) | 2012-07-19 | 2013-06-05 | 基板処理方法 |
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JP2012160393A JP6157809B2 (ja) | 2012-07-19 | 2012-07-19 | 基板処理方法 |
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JP2014022588A true JP2014022588A (ja) | 2014-02-03 |
JP6157809B2 JP6157809B2 (ja) | 2017-07-05 |
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US (1) | US9343311B2 (ja) |
JP (1) | JP6157809B2 (ja) |
KR (1) | KR101632544B1 (ja) |
WO (1) | WO2014013809A1 (ja) |
Cited By (2)
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US10128135B2 (en) | 2015-03-26 | 2018-11-13 | SCREEN Holdings Co., Ltd. | Heat treatment method and heat treatment device |
JPWO2018084159A1 (ja) * | 2016-11-02 | 2019-07-04 | 株式会社カネカ | 太陽電池およびその製造方法、ならびに太陽電池モジュール |
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DE102016106328B4 (de) | 2016-04-06 | 2021-12-16 | Mesa Parts GmbH | Vorrichtung zum temperaturabhängigen Abbau des Drucks eines in einem Drucktank gelagerten Mediums |
JP6810578B2 (ja) * | 2016-11-18 | 2021-01-06 | 株式会社Screenホールディングス | ドーパント導入方法および熱処理方法 |
JP6768481B2 (ja) * | 2016-12-12 | 2020-10-14 | 株式会社Screenホールディングス | ドーパント導入方法および熱処理方法 |
JP7038558B2 (ja) * | 2018-02-05 | 2022-03-18 | 株式会社Screenホールディングス | 熱処理方法 |
CN112670150B (zh) * | 2020-12-22 | 2023-11-17 | 马鞍山市胜康精密机电有限公司 | 一种光电元器件加工用离子注入装置 |
US11894232B2 (en) | 2022-03-22 | 2024-02-06 | Applied Materials, Inc. | Methods for forming charge layers using gas and liquid phase coatings |
US20240153775A1 (en) * | 2022-11-04 | 2024-05-09 | Applied Materials, Inc. | Plasma assisted damage engineering during ion implantation |
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- 2013-06-05 WO PCT/JP2013/065571 patent/WO2014013809A1/ja active Application Filing
- 2013-06-05 US US14/408,390 patent/US9343311B2/en active Active
- 2013-06-05 KR KR1020157001169A patent/KR101632544B1/ko active IP Right Grant
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US10128135B2 (en) | 2015-03-26 | 2018-11-13 | SCREEN Holdings Co., Ltd. | Heat treatment method and heat treatment device |
JPWO2018084159A1 (ja) * | 2016-11-02 | 2019-07-04 | 株式会社カネカ | 太陽電池およびその製造方法、ならびに太陽電池モジュール |
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KR20150020701A (ko) | 2015-02-26 |
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