JP2014004681A5 - - Google Patents
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- Publication number
- JP2014004681A5 JP2014004681A5 JP2013129309A JP2013129309A JP2014004681A5 JP 2014004681 A5 JP2014004681 A5 JP 2014004681A5 JP 2013129309 A JP2013129309 A JP 2013129309A JP 2013129309 A JP2013129309 A JP 2013129309A JP 2014004681 A5 JP2014004681 A5 JP 2014004681A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- mems die
- mems
- spring
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000002955 isolation Methods 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Claims (3)
- センサ、および
接合部分
を備えるＭＥＭＳダイと、
アイソレーション装置と
を備える微小電子機械システム（ＭＥＭＳ）パッケージであって、前記アイソレーション装置が、
前記ＭＥＭＳダイの前記接合部分に接合されるように構成され、前記ＭＥＭＳダイの前記接合部分の熱膨張率にほぼ等しい熱膨張率を有する第１の層と、
モノリシック材料で形成されたばね層と
を備え、前記ばね層が、
前記第１の層に接合するように構成された第１の区間と、
回路板に接合するように構成された第２の区間と、
前記第１の区間を前記第２の区間に柔軟に取り付けられるように構成された１つまたは複数のばね要素と
を備える、ＭＥＭＳパッケージ。 - 前記第１の層が、前記ＭＥＭＳダイが前記第１の層に実装されたときＭＥＭＳダイが通過することを可能にするように構成された空洞を備え、前記空洞が、前記ＭＥＭＳダイだけに接合されるように構成された少なくとも１つのフランジを備え、前記第１の層または前記ばね層のうちの少なくとも１つが、前記少なくとも１つのフランジを前記ばね層から分離するように構成された凹部を備える、請求項１に記載のパッケージ。
- 前記ばね層がシリコンを含み、前記第１の層がガラスを含む、請求項１に記載のパッケージ。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/533,356 | 2012-06-26 | ||
| US13/533,356 US9187313B2 (en) | 2012-06-26 | 2012-06-26 | Anodically bonded strain isolator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014004681A JP2014004681A (ja) | 2014-01-16 |
| JP2014004681A5 true JP2014004681A5 (ja) | 2016-07-21 |
Family
ID=48655969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013129309A Withdrawn JP2014004681A (ja) | 2012-06-26 | 2013-06-20 | 陽極接合ひずみアイソレータ |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9187313B2 (ja) |
| EP (2) | EP2915778B1 (ja) |
| JP (1) | JP2014004681A (ja) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130264755A1 (en) * | 2012-04-05 | 2013-10-10 | Honeywell International Inc. | Methods and systems for limiting sensor motion |
| US20140374847A1 (en) * | 2013-06-20 | 2014-12-25 | Honeywell International Inc. | Packaging method for mems devices |
| EP2871456B1 (en) * | 2013-11-06 | 2018-10-10 | Invensense, Inc. | Pressure sensor and method for manufacturing a pressure sensor |
| CN105182004A (zh) * | 2015-09-06 | 2015-12-23 | 苏州大学 | 基于硅硅键合的减小封装应力的微机械加速度计 |
| FR3042483B1 (fr) | 2015-10-16 | 2017-11-24 | Thales Sa | Microsysteme electromecanique et procede de fabrication |
| US10278281B1 (en) * | 2015-10-30 | 2019-04-30 | Garmin International, Inc. | MEMS stress isolation and stabilization system |
| US10060820B2 (en) * | 2015-12-22 | 2018-08-28 | Continental Automotive Systems, Inc. | Stress-isolated absolute pressure sensor |
| EP3243793B1 (en) * | 2016-05-10 | 2018-11-07 | ams AG | Sensor assembly and arrangement and method for manufacturing a sensor assembly |
| US10442680B2 (en) * | 2016-06-14 | 2019-10-15 | Mems Drive, Inc. | Electric connection flexures |
| GB2555412A (en) | 2016-10-25 | 2018-05-02 | Atlantic Inertial Systems Ltd | Inertial sensor |
| FR3075772B1 (fr) | 2017-12-22 | 2020-11-20 | Commissariat Energie Atomique | Mise en œuvre d'une structure de decouplage pour l'assemblage d'un composant avec un boitier |
| US10988375B1 (en) | 2018-10-04 | 2021-04-27 | EngeniusMicro, LLC | Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors |
| US20230391609A1 (en) * | 2022-06-03 | 2023-12-07 | International Business Machines Corporation | Micromachined superconducting interconnect in silicon |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008023465A1 (en) * | 2006-08-25 | 2008-02-28 | Kyocera Corporation | Microelectronic machine mechanism device, and its manufacturing method |
| US8614491B2 (en) | 2009-04-07 | 2013-12-24 | Honeywell International Inc. | Package interface plate for package isolation structures |
-
2012
- 2012-06-26 US US13/533,356 patent/US9187313B2/en active Active
-
2013
- 2013-06-13 EP EP15163575.2A patent/EP2915778B1/en not_active Not-in-force
- 2013-06-13 EP EP13171937.9A patent/EP2679536B1/en not_active Not-in-force
- 2013-06-20 JP JP2013129309A patent/JP2014004681A/ja not_active Withdrawn
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