WO2010012548A3 - Verkapselung, mems sowie verfahren zum selektiven verkapseln - Google Patents

Verkapselung, mems sowie verfahren zum selektiven verkapseln Download PDF

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Publication number
WO2010012548A3
WO2010012548A3 PCT/EP2009/057994 EP2009057994W WO2010012548A3 WO 2010012548 A3 WO2010012548 A3 WO 2010012548A3 EP 2009057994 W EP2009057994 W EP 2009057994W WO 2010012548 A3 WO2010012548 A3 WO 2010012548A3
Authority
WO
WIPO (PCT)
Prior art keywords
encapsulation
mems
selective
component structure
film
Prior art date
Application number
PCT/EP2009/057994
Other languages
English (en)
French (fr)
Other versions
WO2010012548A2 (de
Inventor
Peter Rothacher
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to CN2009801294226A priority Critical patent/CN102105390A/zh
Priority to EP09779956A priority patent/EP2303769A2/de
Priority to US13/055,987 priority patent/US8242569B2/en
Publication of WO2010012548A2 publication Critical patent/WO2010012548A2/de
Publication of WO2010012548A3 publication Critical patent/WO2010012548A3/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1057—Mounting in enclosures for microelectro-mechanical devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)

Abstract

Die Erfindung betrifft eine Verkapselung (4) einer empfindliehen Bauelementstruktur (3) auf einem Halbleitersubstrat (2) mit einer die Bauelementstruktur (3) überdeckenden Folie (5). Erfindungsgemäß ist vorgesehen, dass in der Folie (5) eine Kavität (8) für die Bauelementstruktur (3) vorgesehen ist. Ferner betrifft die Erfindung ein MEMS (1) sowie ein Verfahren zum Verkapseln einer empfindlichen Bauelementstruktur (3).
PCT/EP2009/057994 2008-07-28 2009-06-25 Verkapselung, mems sowie verfahren zum selektiven verkapseln WO2010012548A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2009801294226A CN102105390A (zh) 2008-07-28 2009-06-25 封装装置、mems以及用于选择性封装的方法
EP09779956A EP2303769A2 (de) 2008-07-28 2009-06-25 Verkapselung, mems sowie verfahren zum selektiven verkapseln
US13/055,987 US8242569B2 (en) 2008-07-28 2009-06-25 Encapsulation, MEMS and method of selective encapsulation

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008040775A DE102008040775A1 (de) 2008-07-28 2008-07-28 Verkapselung, MEMS sowie Verfahren zum selektiven Verkapseln
DE102008040775.5 2008-07-28

Publications (2)

Publication Number Publication Date
WO2010012548A2 WO2010012548A2 (de) 2010-02-04
WO2010012548A3 true WO2010012548A3 (de) 2010-12-23

Family

ID=41461706

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/057994 WO2010012548A2 (de) 2008-07-28 2009-06-25 Verkapselung, mems sowie verfahren zum selektiven verkapseln

Country Status (6)

Country Link
US (1) US8242569B2 (de)
EP (1) EP2303769A2 (de)
CN (1) CN102105390A (de)
DE (1) DE102008040775A1 (de)
TW (1) TW201012740A (de)
WO (1) WO2010012548A2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008042106A1 (de) * 2008-09-15 2010-03-18 Robert Bosch Gmbh Verkapselung, MEMS sowie Verfahren zum Verkapseln
DE102008054415A1 (de) * 2008-12-09 2010-06-10 Robert Bosch Gmbh Anordnung zweier Substrate mit einer SLID-Bondverbindung und Verfahren zur Herstellung einer solchen Anordnung
DE102011112476A1 (de) * 2011-09-05 2013-03-07 Epcos Ag Bauelement und Verfahren zum Herstellen eines Bauelements
KR102306976B1 (ko) 2013-09-13 2021-09-30 에베 그룹 에. 탈너 게엠베하 접합 레이어 도포 방법
US10224260B2 (en) * 2013-11-26 2019-03-05 Infineon Technologies Ag Semiconductor package with air gap
US10225511B1 (en) 2015-12-30 2019-03-05 Google Llc Low power framework for controlling image sensor mode in a mobile image capture device
US10732809B2 (en) 2015-12-30 2020-08-04 Google Llc Systems and methods for selective retention and editing of images captured by mobile image capture device
CN105762019B (zh) * 2016-03-16 2018-01-30 中国电子科技集团公司第五十四研究所 一种lcp基材的rf mems开关制备方法
DE102016112200A1 (de) * 2016-07-04 2018-01-04 Endress+Hauser Gmbh+Co. Kg Druckaufnehmer
DE102016112198A1 (de) * 2016-07-04 2018-01-04 Endress+Hauser Gmbh+Co. Kg Druckaufnehmer
GB2575999A (en) * 2018-07-31 2020-02-05 Ucl Business Ltd Method of fabricating a fibre-optic pressure and temperature sensor
CN111010101A (zh) * 2019-03-12 2020-04-14 天津大学 带弧形结构的薄膜封装的mems器件组件及电子设备
DE102020205490A1 (de) * 2020-04-30 2021-11-04 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer Drucksensoreinrichtung und Drucksensoreinrichtung
CN116670067A (zh) * 2021-05-07 2023-08-29 华为技术有限公司 一种封装结构及其制作方法、电子设备
US20230067539A1 (en) * 2021-08-27 2023-03-02 Taiwan Semiconductor Manufacturing Company Limited Semiconductor structure and formation thereof
DE102022113498B3 (de) 2022-05-30 2023-09-14 Lisa Dräxlmaier GmbH Leiterplattenbaugruppe mit einer eine ausbuchtung aufweisenden elektrisch isolierenden decklage und verfahren zum herstellen einer leitplattenbaugruppe
CN115235299A (zh) * 2022-06-30 2022-10-25 四川航天川南火工技术有限公司 一种火工阵列微推进器封装结构及封装方法

Citations (6)

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US5410789A (en) * 1992-11-13 1995-05-02 Murata Manufacturing Co., Ltd. Method of manufacturing piezoelectric-resonator having vibrating spaces formed therein
US5831369A (en) * 1994-05-02 1998-11-03 Siemens Matsushita Components Gmbh & Co. Kg Encapsulation for electronic components and method for producing the encapsulation
US6429506B1 (en) * 1999-03-19 2002-08-06 Denso Corporation Semiconductor device produced by dicing
JP2003254988A (ja) * 2002-03-01 2003-09-10 Denso Corp 力学量センサおよびその製造方法
US20070007607A1 (en) * 2005-07-06 2007-01-11 Denso Corporation Semiconductor sensor and manufacturing mehtod therefor
DE102006019080B3 (de) * 2006-04-25 2007-08-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Herstellungsverfahren für ein gehäustes Bauelement

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DE10006446A1 (de) 2000-02-14 2001-08-23 Epcos Ag Verkapselung für ein elektrisches Bauelement und Verfahren zur Herstellung
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Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410789A (en) * 1992-11-13 1995-05-02 Murata Manufacturing Co., Ltd. Method of manufacturing piezoelectric-resonator having vibrating spaces formed therein
US5831369A (en) * 1994-05-02 1998-11-03 Siemens Matsushita Components Gmbh & Co. Kg Encapsulation for electronic components and method for producing the encapsulation
US6429506B1 (en) * 1999-03-19 2002-08-06 Denso Corporation Semiconductor device produced by dicing
JP2003254988A (ja) * 2002-03-01 2003-09-10 Denso Corp 力学量センサおよびその製造方法
US20070007607A1 (en) * 2005-07-06 2007-01-11 Denso Corporation Semiconductor sensor and manufacturing mehtod therefor
DE102006019080B3 (de) * 2006-04-25 2007-08-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Herstellungsverfahren für ein gehäustes Bauelement

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Title
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CHEN M J ET AL: "Multilayer Organic Multichip Module Implementing Hybrid Microelectromechanical Systems", IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, vol. 56, no. 4, 1 April 2008 (2008-04-01), pages 952 - 958, XP011205832, ISSN: 0018-9480 *
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Also Published As

Publication number Publication date
EP2303769A2 (de) 2011-04-06
WO2010012548A2 (de) 2010-02-04
US20110121414A1 (en) 2011-05-26
DE102008040775A1 (de) 2010-02-04
CN102105390A (zh) 2011-06-22
US8242569B2 (en) 2012-08-14
TW201012740A (en) 2010-04-01

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