WO2009092361A3 - Mems-bauelement, verfahren zur herstellung eines mems-bauelements und verfahren zur handhabung eines mems-bauelements - Google Patents
Mems-bauelement, verfahren zur herstellung eines mems-bauelements und verfahren zur handhabung eines mems-bauelements Download PDFInfo
- Publication number
- WO2009092361A3 WO2009092361A3 PCT/DE2009/000073 DE2009000073W WO2009092361A3 WO 2009092361 A3 WO2009092361 A3 WO 2009092361A3 DE 2009000073 W DE2009000073 W DE 2009000073W WO 2009092361 A3 WO2009092361 A3 WO 2009092361A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mems component
- substrate
- producing
- cavities
- handling
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
- B81C1/00896—Temporary protection during separation into individual elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/05—Temporary protection of devices or parts of the devices during manufacturing
- B81C2201/053—Depositing a protective layers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010543373A JP2011512260A (ja) | 2008-01-23 | 2009-01-21 | Mems部品、mems部品の製造方法、及びmems部品の取り扱い方法 |
US12/842,677 US8674464B2 (en) | 2008-01-23 | 2010-07-23 | MEMS component, method for producing a MEMS component, and method for handling a MEMS component |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008005686.3A DE102008005686B9 (de) | 2008-01-23 | 2008-01-23 | MEMS-Bauelement und Verfahren zur Herstellung eines MEMS-Bauelements |
DE102008005686.3 | 2008-01-23 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/842,677 Continuation US8674464B2 (en) | 2008-01-23 | 2010-07-23 | MEMS component, method for producing a MEMS component, and method for handling a MEMS component |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009092361A2 WO2009092361A2 (de) | 2009-07-30 |
WO2009092361A3 true WO2009092361A3 (de) | 2010-03-25 |
Family
ID=40794311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2009/000073 WO2009092361A2 (de) | 2008-01-23 | 2009-01-21 | Mems-bauelement, verfahren zur herstellung eines mems-bauelements und verfahren zur handhabung eines mems-bauelements |
Country Status (5)
Country | Link |
---|---|
US (1) | US8674464B2 (de) |
JP (1) | JP2011512260A (de) |
KR (1) | KR101561316B1 (de) |
DE (1) | DE102008005686B9 (de) |
WO (1) | WO2009092361A2 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2015046A1 (de) * | 2007-06-06 | 2009-01-14 | Infineon Technologies SensoNor AS | Vakuumsensor |
DE102010022204B4 (de) | 2010-05-20 | 2016-03-31 | Epcos Ag | Elektrisches Bauelement mit flacher Bauform und Herstellungsverfahren |
US9688533B2 (en) * | 2011-01-31 | 2017-06-27 | The Regents Of The University Of California | Using millisecond pulsed laser welding in MEMS packaging |
DE102011086765A1 (de) * | 2011-11-22 | 2013-05-23 | Robert Bosch Gmbh | Chip mit mikro-elektromechanischer Struktur und Verfahren zum Herstellen eines Chips mit mikro-elektromechanischer Struktur |
DE102012101505B4 (de) | 2012-02-24 | 2016-03-03 | Epcos Ag | Verfahren zur Herstellung eines Sensors |
WO2013156113A1 (en) * | 2012-04-20 | 2013-10-24 | Merck Patent Gmbh | Liquid crystal medium and liquid crystal display |
DE102013106353B4 (de) | 2013-06-18 | 2018-06-28 | Tdk Corporation | Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement |
EP2871152B1 (de) * | 2013-11-06 | 2017-05-24 | Sensirion AG | Sensorvorrichtung |
KR101407914B1 (ko) | 2013-11-21 | 2014-06-17 | 한국기계연구원 | 1칩형 mems 마이크로폰의 제작 방법 및 그에 의하여 만들어진 1칩형 mems 마이크로폰 |
DE102014100464B4 (de) | 2014-01-16 | 2022-02-17 | Tdk Corporation | Multi-MEMS-Modul |
EP3032227B1 (de) | 2014-12-08 | 2020-10-21 | Sensirion AG | Flusssensorpaket |
GB2568633B (en) | 2016-09-21 | 2022-06-29 | Sensirion Ag | Gas sensor |
KR101995228B1 (ko) * | 2017-07-14 | 2019-07-02 | 엑센도 주식회사 | 멤스 웨이퍼의 쏘잉 방법 |
JP7067891B2 (ja) * | 2017-10-18 | 2022-05-16 | Mmiセミコンダクター株式会社 | トランスデューサ |
DE102020103732B4 (de) * | 2020-02-13 | 2023-02-16 | Infineon Technologies Ag | Verfahren mit mechanischem Dicing-Prozess zur Herstellung von MEMS-Bauelementen |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4223215A1 (de) * | 1992-07-15 | 1994-01-20 | Bosch Gmbh Robert | Verfahren zur Bearbeitung von Siliziumwafern |
US20030189242A1 (en) * | 2002-04-03 | 2003-10-09 | Qing Ma | Packaging microelectromechanical structures |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3497722B2 (ja) * | 1998-02-27 | 2004-02-16 | 富士通株式会社 | 半導体装置及びその製造方法及びその搬送トレイ |
CA2375138A1 (en) * | 1999-06-03 | 2000-12-14 | The Penn State Research Foundation | Deposited thin film void-column network materials |
US6522762B1 (en) * | 1999-09-07 | 2003-02-18 | Microtronic A/S | Silicon-based sensor system |
KR100404904B1 (ko) * | 2001-06-09 | 2003-11-07 | 전자부품연구원 | 차동 용량형 압력센서 및 그 제조방법 |
JP2004017171A (ja) * | 2002-06-12 | 2004-01-22 | Murata Mfg Co Ltd | 電子部品およびその製造方法 |
US6713314B2 (en) * | 2002-08-14 | 2004-03-30 | Intel Corporation | Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator |
DE10344229A1 (de) | 2003-09-24 | 2005-05-19 | Steag Microparts Gmbh | Mikrostruktuierte Vorrichtung zum entnehmbaren Speichern von kleinen Flüssigkeitsmengen und Verfahren zum Entnehmen der in dieser Vorrichtung gespeicherten Flüssigkeit |
DE102004017944A1 (de) * | 2004-04-14 | 2005-11-03 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit einer Membran und Verfahren zur Herstellung eines solchen Bauelements |
US7280436B2 (en) * | 2004-05-07 | 2007-10-09 | Corporation For National Research Initiatives | Miniature acoustic detector based on electron surface tunneling |
JP2006173557A (ja) | 2004-11-22 | 2006-06-29 | Toshiba Corp | 中空型半導体装置とその製造方法 |
US20060125577A1 (en) * | 2004-12-13 | 2006-06-15 | International Semiconductor Techonology Ltd. | Acoustic resonator device and method for manufacturing the same |
US7181972B2 (en) * | 2004-12-27 | 2007-02-27 | General Electric Company | Static and dynamic pressure sensor |
US7373835B2 (en) * | 2005-01-31 | 2008-05-20 | Sanyo Electric Industries, Ltd. | Semiconductor sensor |
US7401525B2 (en) * | 2005-03-23 | 2008-07-22 | Honeywell International Inc. | Micro-machined pressure sensor with polymer diaphragm |
DE102005053765B4 (de) | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS-Package und Verfahren zur Herstellung |
US20080014720A1 (en) * | 2006-03-16 | 2008-01-17 | Dynatex International | Street smart wafer breaking mechanism |
DE102006022379A1 (de) | 2006-05-12 | 2007-11-22 | Robert Bosch Gmbh | Mikromechanischer Druckwandler und Verfahren zu seiner Herstellung |
DE102006046292B9 (de) * | 2006-09-29 | 2014-04-30 | Epcos Ag | Bauelement mit MEMS-Mikrofon und Verfahren zur Herstellung |
KR100831405B1 (ko) * | 2006-10-02 | 2008-05-21 | (주) 파이오닉스 | 웨이퍼 본딩 패키징 방법 |
US20090081828A1 (en) * | 2007-09-26 | 2009-03-26 | Northrop Grumman Systems Corporation | MEMS Fabrication Method |
-
2008
- 2008-01-23 DE DE102008005686.3A patent/DE102008005686B9/de active Active
-
2009
- 2009-01-21 KR KR1020107018704A patent/KR101561316B1/ko active IP Right Grant
- 2009-01-21 WO PCT/DE2009/000073 patent/WO2009092361A2/de active Application Filing
- 2009-01-21 JP JP2010543373A patent/JP2011512260A/ja active Pending
-
2010
- 2010-07-23 US US12/842,677 patent/US8674464B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4223215A1 (de) * | 1992-07-15 | 1994-01-20 | Bosch Gmbh Robert | Verfahren zur Bearbeitung von Siliziumwafern |
US20030189242A1 (en) * | 2002-04-03 | 2003-10-09 | Qing Ma | Packaging microelectromechanical structures |
Also Published As
Publication number | Publication date |
---|---|
KR20100110371A (ko) | 2010-10-12 |
DE102008005686B4 (de) | 2019-01-31 |
JP2011512260A (ja) | 2011-04-21 |
US8674464B2 (en) | 2014-03-18 |
WO2009092361A2 (de) | 2009-07-30 |
DE102008005686B9 (de) | 2019-06-27 |
DE102008005686A1 (de) | 2009-07-30 |
KR101561316B1 (ko) | 2015-10-16 |
US20110018076A1 (en) | 2011-01-27 |
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