JP2013543268A5 - - Google Patents

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Publication number
JP2013543268A5
JP2013543268A5 JP2013535076A JP2013535076A JP2013543268A5 JP 2013543268 A5 JP2013543268 A5 JP 2013543268A5 JP 2013535076 A JP2013535076 A JP 2013535076A JP 2013535076 A JP2013535076 A JP 2013535076A JP 2013543268 A5 JP2013543268 A5 JP 2013543268A5
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JP
Japan
Prior art keywords
detector
opaque
lid
seal ring
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2013535076A
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English (en)
Japanese (ja)
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JP2013543268A (ja
JP5873094B2 (ja
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Publication date
Priority claimed from US13/275,635 external-priority patent/US8809784B2/en
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Publication of JP2013543268A publication Critical patent/JP2013543268A/ja
Publication of JP2013543268A5 publication Critical patent/JP2013543268A5/ja
Application granted granted Critical
Publication of JP5873094B2 publication Critical patent/JP5873094B2/ja
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JP2013535076A 2010-10-21 2011-10-20 入射放射線検出器パッケージング Active JP5873094B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US40562110P 2010-10-21 2010-10-21
US61/405,621 2010-10-21
US13/275,635 2011-10-18
US13/275,635 US8809784B2 (en) 2010-10-21 2011-10-18 Incident radiation detector packaging
PCT/US2011/057021 WO2012054687A1 (en) 2010-10-21 2011-10-20 Incident radiation detector packaging

Publications (3)

Publication Number Publication Date
JP2013543268A JP2013543268A (ja) 2013-11-28
JP2013543268A5 true JP2013543268A5 (enExample) 2014-08-14
JP5873094B2 JP5873094B2 (ja) 2016-03-01

Family

ID=45971785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013535076A Active JP5873094B2 (ja) 2010-10-21 2011-10-20 入射放射線検出器パッケージング

Country Status (6)

Country Link
US (1) US8809784B2 (enExample)
EP (1) EP2630660B1 (enExample)
JP (1) JP5873094B2 (enExample)
IL (1) IL225715A (enExample)
TW (1) TWI597859B (enExample)
WO (1) WO2012054687A1 (enExample)

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CN103728025A (zh) * 2012-10-10 2014-04-16 中国科学院微电子研究所 一种非制冷红外成像焦平面阵列探测器
US8736045B1 (en) * 2012-11-02 2014-05-27 Raytheon Company Integrated bondline spacers for wafer level packaged circuit devices
US9673169B2 (en) 2013-02-05 2017-06-06 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for a wafer seal ring
US9287188B2 (en) * 2013-02-05 2016-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for a seal ring structure
JP2014186006A (ja) * 2013-03-25 2014-10-02 Toshiba Corp 赤外線撮像装置および赤外線撮像モジュール
NO2944700T3 (enExample) 2013-07-11 2018-03-17
EP3051582B1 (en) * 2013-09-27 2020-01-22 Kyocera Corporation Lid body, package, and electronic apparatus
JP6344555B2 (ja) * 2014-05-28 2018-06-20 パナソニックＩｐマネジメント株式会社 固体撮像装置
US9334154B2 (en) 2014-08-11 2016-05-10 Raytheon Company Hermetically sealed package having stress reducing layer
JP6891202B2 (ja) * 2014-08-11 2021-06-18 レイセオン カンパニー 応力低減レイヤを有する密封されたパッケージ
JP6891203B2 (ja) * 2014-08-11 2021-06-18 レイセオン カンパニー 応力低減レイヤを有する密封されたパッケージ
CN106414309B (zh) * 2014-08-11 2020-02-28 雷声公司 具有应力减小层的气密性密封封装
US9508681B2 (en) * 2014-12-22 2016-11-29 Google Inc. Stacked semiconductor chip RGBZ sensor
US9756273B2 (en) * 2015-03-04 2017-09-05 Sensors Unlimited, Inc. Multi-tiered tamper-resistant assembly system and method
CN104779214A (zh) * 2015-04-16 2015-07-15 歌尔声学股份有限公司 集成传感器的封装结构
US9771258B2 (en) 2015-06-24 2017-09-26 Raytheon Company Wafer level MEMS package including dual seal ring
US20170081178A1 (en) * 2015-09-22 2017-03-23 Freescale Semiconductor, Inc. Semiconductor device package with seal structure
US9570321B1 (en) 2015-10-20 2017-02-14 Raytheon Company Use of an external getter to reduce package pressure
JP2018146263A (ja) 2017-03-01 2018-09-20 浜松ホトニクス株式会社 光検出器
CN107681017B (zh) * 2017-09-26 2019-04-09 中国科学院长春光学精密机械与物理研究所 一种自下而上生长AlGaN基紫外及深紫外探测器阵列的方法
JP7292077B2 (ja) * 2018-07-11 2023-06-16 三菱電機株式会社 パッケージ素子の製造方法およびパッケージ素子
US11515220B2 (en) * 2019-12-04 2022-11-29 Advanced Semiconductor Engineering, Inc. Semiconductor package structures and methods of manufacturing the same

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
US5962854A (en) * 1996-06-12 1999-10-05 Ishizuka Electronics Corporation Infrared sensor and infrared detector
KR20030023613A (ko) * 2000-02-02 2003-03-19 레이던 컴퍼니 집적회로 컴포넌트를 구비하는 마이크로전기기계 시스템의진공 패키징 방법 및 진공 패키지
US6521477B1 (en) * 2000-02-02 2003-02-18 Raytheon Company Vacuum package fabrication of integrated circuit components
US6876052B1 (en) * 2000-05-12 2005-04-05 National Semiconductor Corporation Package-ready light-sensitive integrated circuit and method for its preparation
US20040232535A1 (en) * 2003-05-22 2004-11-25 Terry Tarn Microelectromechanical device packages with integral heaters
KR101258864B1 (ko) 2004-12-07 2013-04-29 썬더버드 테크놀로지스, 인코포레이티드 긴장된 실리콘, 게이트 엔지니어링된 페르미－ｆｅｔ
US7262412B2 (en) 2004-12-10 2007-08-28 L-3 Communications Corporation Optically blocked reference pixels for focal plane arrays
US20060257785A1 (en) * 2005-05-13 2006-11-16 Johnson Donald W Method of forming a photoresist element
JP4937623B2 (ja) * 2006-03-29 2012-05-23 シチズンホールディングス株式会社 半導体装置の製造方法
US8115305B2 (en) * 2007-05-17 2012-02-14 Stats Chippac Ltd. Integrated circuit package system with thin profile
JP4665959B2 (ja) 2007-11-30 2011-04-06 日本電気株式会社 真空パッケージ
US8173471B2 (en) * 2008-04-29 2012-05-08 Solid State System Co., Ltd. Method for fabricating micro-electro-mechanical system (MEMS) device

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