TWI597859B - 用於封裝一入射輻射檢測器的方法及封裝的入射輻射檢測器 - Google Patents

用於封裝一入射輻射檢測器的方法及封裝的入射輻射檢測器 Download PDF

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TWI597859B
TWI597859B TW100138076A TW100138076A TWI597859B TW I597859 B TWI597859 B TW I597859B TW 100138076 A TW100138076 A TW 100138076A TW 100138076 A TW100138076 A TW 100138076A TW I597859 B TWI597859 B TW I597859B
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detector
opaque
layer
cover
seal ring
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TW100138076A
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Chinese (zh)
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TW201234633A (en
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羅蘭德W 葛奇
史帝芬H 布萊克
湯瑪斯A 柯席恩
布 迪柏
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雷神公司
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/804Containers or encapsulations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/04Casings
    • G01J5/041Mountings in enclosures or in a particular environment
    • G01J5/045Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
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    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
TW100138076A 2010-10-21 2011-10-20 用於封裝一入射輻射檢測器的方法及封裝的入射輻射檢測器 TWI597859B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40562110P 2010-10-21 2010-10-21
US13/275,635 US8809784B2 (en) 2010-10-21 2011-10-18 Incident radiation detector packaging

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