JP2013541176A5 - - Google Patents

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Publication number
JP2013541176A5
JP2013541176A5 JP2013521130A JP2013521130A JP2013541176A5 JP 2013541176 A5 JP2013541176 A5 JP 2013541176A5 JP 2013521130 A JP2013521130 A JP 2013521130A JP 2013521130 A JP2013521130 A JP 2013521130A JP 2013541176 A5 JP2013541176 A5 JP 2013541176A5
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JP
Japan
Prior art keywords
substrate
heating
processing system
vacuum processing
motomeko
Prior art date
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Application number
JP2013521130A
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English (en)
Japanese (ja)
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JP6088970B2 (ja
JP2013541176A (ja
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Priority claimed from PCT/EP2011/062912 external-priority patent/WO2012013707A1/en
Publication of JP2013541176A publication Critical patent/JP2013541176A/ja
Publication of JP2013541176A5 publication Critical patent/JP2013541176A5/ja
Application granted granted Critical
Publication of JP6088970B2 publication Critical patent/JP6088970B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013521130A 2010-07-27 2011-07-27 加熱配置構成及び基板を加熱するための方法 Expired - Fee Related JP6088970B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36791010P 2010-07-27 2010-07-27
US61/367,910 2010-07-27
PCT/EP2011/062912 WO2012013707A1 (en) 2010-07-27 2011-07-27 Heating arrangement and method for heating substrates

Publications (3)

Publication Number Publication Date
JP2013541176A JP2013541176A (ja) 2013-11-07
JP2013541176A5 true JP2013541176A5 (enExample) 2014-09-18
JP6088970B2 JP6088970B2 (ja) 2017-03-01

Family

ID=44681074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013521130A Expired - Fee Related JP6088970B2 (ja) 2010-07-27 2011-07-27 加熱配置構成及び基板を加熱するための方法

Country Status (6)

Country Link
US (1) US10276412B2 (enExample)
EP (1) EP2599115B1 (enExample)
JP (1) JP6088970B2 (enExample)
KR (2) KR102121794B1 (enExample)
CN (1) CN103222041B (enExample)
WO (1) WO2012013707A1 (enExample)

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US20130074358A1 (en) * 2011-09-24 2013-03-28 Quantum Technology Holdings Limited Heated body with high heat transfer rate material and its use
EP2896065A1 (en) * 2012-08-27 2015-07-22 Oerlikon Advanced Technologies AG Processing arrangement with temperature conditioning arrangement and method of processing a substrate
US10208381B2 (en) 2014-12-23 2019-02-19 Rec Silicon Inc Apparatus and method for managing a temperature profile using reflective energy in a thermal decomposition reactor
WO2016106337A1 (en) * 2014-12-23 2016-06-30 Rec Silicon Inc Apparatus and method for managing a temperature profile using reflective energy in a thermal decomposition reactor
KR102592972B1 (ko) * 2016-02-12 2023-10-24 삼성전자주식회사 센싱 모듈 기판 및 이를 포함하는 센싱 모듈
DE102016015502A1 (de) * 2016-12-23 2018-06-28 Singulus Technologies Ag Verfahren und Vorrichtung zur thermischen Behandlung beschichteter Substrate, insbesondere von Dünnschicht-Solarsubstraten
DE102018128243A1 (de) * 2018-11-12 2020-05-14 AM Metals GmbH Herstellvorrichtung zur additiven Fertigung dreidimensionaler Bauteile
JP7398935B2 (ja) * 2019-11-25 2023-12-15 東京エレクトロン株式会社 載置台、及び、検査装置
CN115461491B (zh) * 2020-07-01 2024-08-23 应用材料公司 用于操作腔室的方法、用于处理基板的装置和基板处理系统
DE102020130339A1 (de) * 2020-11-17 2022-05-19 Aixtron Se Heizeinrichtung für einen CVD-Reaktor
WO2024201683A1 (ja) * 2023-03-27 2024-10-03 株式会社日立ハイテク プラズマ処理装置

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