JP2013535098A5 - - Google Patents

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Publication number
JP2013535098A5
JP2013535098A5 JP2013514230A JP2013514230A JP2013535098A5 JP 2013535098 A5 JP2013535098 A5 JP 2013535098A5 JP 2013514230 A JP2013514230 A JP 2013514230A JP 2013514230 A JP2013514230 A JP 2013514230A JP 2013535098 A5 JP2013535098 A5 JP 2013535098A5
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JP
Japan
Prior art keywords
coating composition
semiconductor wafer
resin
composition
pulsed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2013514230A
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English (en)
Japanese (ja)
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JP5654672B2 (ja
JP2013535098A (ja
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Publication date
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Priority claimed from PCT/US2011/039044 external-priority patent/WO2011156221A2/en
Publication of JP2013535098A publication Critical patent/JP2013535098A/ja
Publication of JP2013535098A5 publication Critical patent/JP2013535098A5/ja
Application granted granted Critical
Publication of JP5654672B2 publication Critical patent/JP5654672B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013514230A 2010-06-08 2011-06-03 パルスｕｖ光源によるウエハ裏面被覆方法 Expired - Fee Related JP5654672B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US35258410P 2010-06-08 2010-06-08
US61/352,584 2010-06-08
PCT/US2011/039044 WO2011156221A2 (en) 2010-06-08 2011-06-03 Wafer backside coating process with pulsed uv light source

Publications (3)

Publication Number Publication Date
JP2013535098A JP2013535098A (ja) 2013-09-09
JP2013535098A5 true JP2013535098A5 (enExample) 2014-08-21
JP5654672B2 JP5654672B2 (ja) 2015-01-14

Family

ID=45098589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013514230A Expired - Fee Related JP5654672B2 (ja) 2010-06-08 2011-06-03 パルスｕｖ光源によるウエハ裏面被覆方法

Country Status (7)

Country Link
US (1) US8791033B2 (enExample)
EP (1) EP2580777A4 (enExample)
JP (1) JP5654672B2 (enExample)
KR (1) KR20130079478A (enExample)
CN (1) CN103003936A (enExample)
TW (1) TWI456012B (enExample)
WO (1) WO2011156221A2 (enExample)

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US9230888B2 (en) * 2013-02-11 2016-01-05 Henkel IP & Holding GmbH Wafer back side coating as dicing tape adhesive
CN104162502A (zh) * 2013-05-16 2014-11-26 展晶科技(深圳)有限公司 光固化涂层的方法
CN112837844B (zh) * 2021-03-01 2022-07-15 佛山市瑞纳新材科技有限公司 一种有双重固化性能的hjt低温固化银浆及其制备方法

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