JP2013532912A - 基板上の複数のゾーンを監視するための基準ライブラリの選択 - Google Patents

基板上の複数のゾーンを監視するための基準ライブラリの選択 Download PDF

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Publication number
JP2013532912A
JP2013532912A JP2013523190A JP2013523190A JP2013532912A JP 2013532912 A JP2013532912 A JP 2013532912A JP 2013523190 A JP2013523190 A JP 2013523190A JP 2013523190 A JP2013523190 A JP 2013523190A JP 2013532912 A JP2013532912 A JP 2013532912A
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library
libraries
zone
substrate
polishing
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Pending
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JP2013523190A
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Japanese (ja)
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JP2013532912A5 (cg-RX-API-DMAC7.html
Inventor
ジュン チェン
ボグスワフ エイ スヴェデク
ハリー キュー リー
ジェフリー ドルー ディヴィッド
シヴァクマール ダンダパニ
トーマス エイチ オスターヘルド
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2013532912A publication Critical patent/JP2013532912A/ja
Publication of JP2013532912A5 publication Critical patent/JP2013532912A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0208—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the configuration of the monitoring system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31459—Library with metrology plan for different type of workpieces
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45232—CMP chemical mechanical polishing of wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2013523190A 2010-07-30 2011-07-22 基板上の複数のゾーンを監視するための基準ライブラリの選択 Pending JP2013532912A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/847,721 2010-07-30
US12/847,721 US8954186B2 (en) 2010-07-30 2010-07-30 Selecting reference libraries for monitoring of multiple zones on a substrate
PCT/US2011/045096 WO2012015699A2 (en) 2010-07-30 2011-07-22 Selecting reference libraries for monitoring of multiple zones on a substrate

Publications (2)

Publication Number Publication Date
JP2013532912A true JP2013532912A (ja) 2013-08-19
JP2013532912A5 JP2013532912A5 (cg-RX-API-DMAC7.html) 2015-07-09

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JP2013523190A Pending JP2013532912A (ja) 2010-07-30 2011-07-22 基板上の複数のゾーンを監視するための基準ライブラリの選択

Country Status (5)

Country Link
US (1) US8954186B2 (cg-RX-API-DMAC7.html)
JP (1) JP2013532912A (cg-RX-API-DMAC7.html)
KR (1) KR101587008B1 (cg-RX-API-DMAC7.html)
TW (1) TWI518762B (cg-RX-API-DMAC7.html)
WO (1) WO2012015699A2 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015163164A1 (ja) * 2014-04-22 2015-10-29 株式会社 荏原製作所 研磨方法および研磨装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120034844A1 (en) * 2010-08-05 2012-02-09 Applied Materials, Inc. Spectrographic monitoring using index tracking after detection of layer clearing
US9296084B2 (en) * 2012-07-19 2016-03-29 Applied Materials, Inc. Polishing control using weighting with default sequence
WO2014078151A1 (en) 2012-11-16 2014-05-22 Applied Materials, Inc. Recording measurements by sensors for a carrier head
JP6107353B2 (ja) * 2013-04-12 2017-04-05 株式会社島津製作所 表面処理状況モニタリング装置
US10048748B2 (en) * 2013-11-12 2018-08-14 Excalibur Ip, Llc Audio-visual interaction with user devices

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015163164A1 (ja) * 2014-04-22 2015-10-29 株式会社 荏原製作所 研磨方法および研磨装置
KR20160147823A (ko) * 2014-04-22 2016-12-23 가부시키가이샤 에바라 세이사꾸쇼 연마 방법 및 연마 장치
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Also Published As

Publication number Publication date
US20120028813A1 (en) 2012-02-02
KR101587008B1 (ko) 2016-01-20
US8954186B2 (en) 2015-02-10
TWI518762B (zh) 2016-01-21
WO2012015699A3 (en) 2012-05-24
KR20130135237A (ko) 2013-12-10
WO2012015699A2 (en) 2012-02-02
TW201212114A (en) 2012-03-16

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