JP2013532900A5 - - Google Patents
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- JP2013532900A5 JP2013532900A5 JP2013520021A JP2013520021A JP2013532900A5 JP 2013532900 A5 JP2013532900 A5 JP 2013532900A5 JP 2013520021 A JP2013520021 A JP 2013520021A JP 2013520021 A JP2013520021 A JP 2013520021A JP 2013532900 A5 JP2013532900 A5 JP 2013532900A5
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- JP
- Japan
- Prior art keywords
- conductivity type
- type region
- component according
- optoelectronic component
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010027679A DE102010027679A1 (de) | 2010-07-20 | 2010-07-20 | Optoelektronisches Bauelement |
| DE102010027679.0 | 2010-07-20 | ||
| PCT/EP2011/058573 WO2012010352A1 (de) | 2010-07-20 | 2011-05-25 | Optoelektronisches bauelement |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013532900A JP2013532900A (ja) | 2013-08-19 |
| JP2013532900A5 true JP2013532900A5 (https=) | 2014-07-10 |
| JP5850931B2 JP5850931B2 (ja) | 2016-02-03 |
Family
ID=44454661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013520021A Expired - Fee Related JP5850931B2 (ja) | 2010-07-20 | 2011-05-25 | オプトエレクトロニクス部品 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9000476B2 (https=) |
| EP (1) | EP2596532B1 (https=) |
| JP (1) | JP5850931B2 (https=) |
| KR (1) | KR101792678B1 (https=) |
| CN (1) | CN103003941B (https=) |
| DE (1) | DE102010027679A1 (https=) |
| WO (1) | WO2012010352A1 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010027679A1 (de) | 2010-07-20 | 2012-01-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| DE102010056056A1 (de) * | 2010-12-23 | 2012-06-28 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines elektrischen Anschlussträgers |
| DE102011015821B4 (de) * | 2011-04-01 | 2023-04-20 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip |
| US8816383B2 (en) * | 2012-07-06 | 2014-08-26 | Invensas Corporation | High performance light emitting diode with vias |
| DE102013105631A1 (de) * | 2013-05-31 | 2014-12-04 | Osram Opto Semiconductors Gmbh | Träger für einen optoelektronischen Halbleiterchip und optoelektronisches Bauteil |
| DE102013112881A1 (de) * | 2013-11-21 | 2015-05-21 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| DE102014103828A1 (de) * | 2014-03-20 | 2015-09-24 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung von optoelektronischen Halbleiterbauelementen |
| DE102014116935A1 (de) | 2014-11-19 | 2016-05-19 | Osram Opto Semiconductors Gmbh | Bauelement und Verfahren zur Herstellung eines Bauelements |
| DE102015100578A1 (de) * | 2015-01-15 | 2016-07-21 | Osram Opto Semiconductors Gmbh | Bauelement und Verfahren zur Herstellung eines Bauelements |
| DE102015108545A1 (de) * | 2015-05-29 | 2016-12-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| DE102015111487A1 (de) | 2015-07-15 | 2017-01-19 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip |
| DE102015111485A1 (de) * | 2015-07-15 | 2017-01-19 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
| DE102017102545B4 (de) * | 2017-02-09 | 2018-12-20 | Infineon Technologies Ag | Halbleitervorrichtung, Drucksensor, Mikrofon, Beschleunigungssensor und Verfahren zum Bilden einer Halbleitervorrichtung |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5477078A (en) * | 1994-02-18 | 1995-12-19 | Analog Devices, Incorporated | Integrated circuit (IC) with a two-terminal diode device to protect metal-oxide-metal capacitors from ESD damage |
| JPH08227941A (ja) * | 1995-02-17 | 1996-09-03 | Sanken Electric Co Ltd | 複合半導体素子 |
| WO1997021250A1 (en) | 1995-12-04 | 1997-06-12 | Lockheed-Martin Ir Imaging Systems, Inc. | Infrared radiation detector having a reduced active area |
| JP3787202B2 (ja) * | 1997-01-10 | 2006-06-21 | ローム株式会社 | 半導体発光素子 |
| US6784463B2 (en) | 1997-06-03 | 2004-08-31 | Lumileds Lighting U.S., Llc | III-Phospide and III-Arsenide flip chip light-emitting devices |
| JP2000208822A (ja) | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | 半導体発光装置 |
| JP4296644B2 (ja) * | 1999-01-29 | 2009-07-15 | 豊田合成株式会社 | 発光ダイオード |
| DE10006738C2 (de) | 2000-02-15 | 2002-01-17 | Osram Opto Semiconductors Gmbh | Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung und Verfahren zu seiner Herstellung |
| DE60141459D1 (de) | 2000-03-30 | 2010-04-15 | Nxp Bv | Halbleiterbauelement und dessen herstellungsverfahren |
| US20020017652A1 (en) | 2000-08-08 | 2002-02-14 | Stefan Illek | Semiconductor chip for optoelectronics |
| DE10148227B4 (de) | 2001-09-28 | 2015-03-05 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip, Verfahren zu dessen Herstellung und strahlungsemittierendes Bauelement |
| US6531328B1 (en) | 2001-10-11 | 2003-03-11 | Solidlite Corporation | Packaging of light-emitting diode |
| JP3776824B2 (ja) | 2002-04-05 | 2006-05-17 | 株式会社東芝 | 半導体発光素子およびその製造方法 |
| NL1023680C2 (nl) | 2003-06-17 | 2004-12-20 | Tno | Sensor met polymeren componenten. |
| US7291529B2 (en) | 2003-11-12 | 2007-11-06 | Cree, Inc. | Methods of processing semiconductor wafer backsides having light emitting devices (LEDs) thereon |
| US7518158B2 (en) * | 2003-12-09 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices and submounts |
| TWI256676B (en) * | 2004-03-26 | 2006-06-11 | Siliconix Inc | Termination for trench MIS device having implanted drain-drift region |
| US7208768B2 (en) | 2004-04-30 | 2007-04-24 | Sharp Laboratories Of America, Inc. | Electroluminescent device |
| JP4250576B2 (ja) | 2004-08-24 | 2009-04-08 | 株式会社東芝 | 半導体発光素子 |
| JP2006086300A (ja) | 2004-09-15 | 2006-03-30 | Sanken Electric Co Ltd | 保護素子を有する半導体発光装置及びその製造方法 |
| TW200637033A (en) * | 2004-11-22 | 2006-10-16 | Matsushita Electric Industrial Co Ltd | Light-emitting device, light-emitting module, display unit, lighting unit and method for manufacturing light-emitting device |
| JP4613709B2 (ja) | 2005-06-24 | 2011-01-19 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
| TWI422044B (zh) | 2005-06-30 | 2014-01-01 | 克立公司 | 封裝發光裝置之晶片尺度方法及經晶片尺度封裝之發光裝置 |
| US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
| DE102006015788A1 (de) | 2006-01-27 | 2007-09-13 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| JP4978014B2 (ja) * | 2006-01-30 | 2012-07-18 | サンケン電気株式会社 | 半導体発光装置及びその製造方法 |
| KR100746783B1 (ko) | 2006-02-28 | 2007-08-06 | 엘지전자 주식회사 | 발광소자 패키지 및 그 제조방법 |
| KR100854328B1 (ko) | 2006-07-07 | 2008-08-28 | 엘지전자 주식회사 | 발광 소자 패키지 및 그 제조방법 |
| FR2909984B1 (fr) * | 2006-12-18 | 2010-12-10 | Degremont | Silo pour le stockage de produits en vrac, notamment des boues sechees de stations d'epuration. |
| DE102007022947B4 (de) | 2007-04-26 | 2022-05-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
| US8436371B2 (en) | 2007-05-24 | 2013-05-07 | Cree, Inc. | Microscale optoelectronic device packages |
| TWI372478B (en) | 2008-01-08 | 2012-09-11 | Epistar Corp | Light-emitting device |
| US8643034B2 (en) | 2008-02-29 | 2014-02-04 | Osram Opto Semiconductors Gmbh | Monolithic, optoelectronic semiconductor body and method for the production thereof |
| DE102008022793B4 (de) | 2008-05-08 | 2010-12-16 | Universität Ulm | Vollständig selbstjustierter oberflächenemittierender Halbleiterlaser für die Oberflächenmontage mit optimierten Eigenschaften |
| DE102008034560B4 (de) * | 2008-07-24 | 2022-10-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterchips |
| KR101332794B1 (ko) | 2008-08-05 | 2013-11-25 | 삼성전자주식회사 | 발광 장치, 이를 포함하는 발광 시스템, 상기 발광 장치 및발광 시스템의 제조 방법 |
| CN101345235B (zh) * | 2008-08-25 | 2011-08-17 | 广州南科集成电子有限公司 | 带静电保护功能的led芯片的制造方法 |
| JP2010135488A (ja) * | 2008-12-03 | 2010-06-17 | Toshiba Corp | 発光装置及びその製造方法 |
| DE102009013085A1 (de) * | 2009-03-13 | 2010-09-16 | Siemens Aktiengesellschaft | Metallisierte Durchführungen eines Wafers mit integrierten Dioden |
| DE102009032486A1 (de) * | 2009-07-09 | 2011-01-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| DE102010027679A1 (de) | 2010-07-20 | 2012-01-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
-
2010
- 2010-07-20 DE DE102010027679A patent/DE102010027679A1/de not_active Withdrawn
-
2011
- 2011-05-25 US US13/810,335 patent/US9000476B2/en active Active
- 2011-05-25 CN CN201180035714.0A patent/CN103003941B/zh active Active
- 2011-05-25 EP EP11726077.8A patent/EP2596532B1/de active Active
- 2011-05-25 JP JP2013520021A patent/JP5850931B2/ja not_active Expired - Fee Related
- 2011-05-25 WO PCT/EP2011/058573 patent/WO2012010352A1/de not_active Ceased
- 2011-05-25 KR KR1020137004119A patent/KR101792678B1/ko active Active
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