JP2013530307A - 混合結晶層を蒸着するためのpvdハイブリッド法 - Google Patents
混合結晶層を蒸着するためのpvdハイブリッド法 Download PDFInfo
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- 239000013078 crystal Substances 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000000151 deposition Methods 0.000 title claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims abstract description 50
- 239000002184 metal Substances 0.000 claims abstract description 50
- 230000008021 deposition Effects 0.000 claims abstract description 32
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 28
- 238000000168 high power impulse magnetron sputter deposition Methods 0.000 claims abstract description 23
- 238000005240 physical vapour deposition Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 230000009977 dual effect Effects 0.000 claims abstract description 19
- 150000002739 metals Chemical class 0.000 claims abstract description 13
- 238000004544 sputter deposition Methods 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 66
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 13
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 12
- 229910052804 chromium Inorganic materials 0.000 claims description 9
- 239000011651 chromium Substances 0.000 claims description 9
- RHBRWKIPYGZNMP-UHFFFAOYSA-N [O--].[O--].[O--].[Al+3].[Cr+3] Chemical compound [O--].[O--].[O--].[Al+3].[Cr+3] RHBRWKIPYGZNMP-UHFFFAOYSA-N 0.000 claims description 7
- 239000013077 target material Substances 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229910000997 High-speed steel Inorganic materials 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 5
- 150000004767 nitrides Chemical class 0.000 claims description 5
- 239000011195 cermet Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 238000005137 deposition process Methods 0.000 claims description 2
- 229910052744 lithium Inorganic materials 0.000 claims description 2
- 230000000737 periodic effect Effects 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 11
- 239000007921 spray Substances 0.000 abstract description 10
- 238000001704 evaporation Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 5
- QQHSIRTYSFLSRM-UHFFFAOYSA-N alumanylidynechromium Chemical compound [Al].[Cr] QQHSIRTYSFLSRM-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- -1 oxides Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/012—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of aluminium or an aluminium alloy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/08—Oxides
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C23C14/325—Electric arc evaporation
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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- C23C28/042—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/044—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material coatings specially adapted for cutting tools or wear applications
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Abstract
【解決手段】できるだけマクロ粒子(飛沫)のない且つできるだけ高い割合の望ましい結晶相を有し、且つ高結晶性である混合結晶層を蒸着する方法であって、前記混合結晶層の蒸着がi)デュアルマグネトロンスパッタリング又は高出力インパルスマグネトロンスパッタリング(HIPIMS)からなる陰極スパッタリングおよびii)アーク蒸着の同時適用によって達成される、前記方法。
【選択図】なし
Description
ヨーロッパ特許第030612号は、純陰極スパッタリングと比較して密度が高く且つコンパクトである層を得るために陰極スパッタリングとアーク蒸着とによる基板への被覆膜の生成を記載している。蒸着された層は通常混合相および不利益である多くのマクロ粒子を有している。
この適用に関連して、ターゲットが1種の金属又は複数の金属を含むことを述べているならば、それは純金属ターゲット、および1つの金属又は複数の金属が例えば酸化物、窒化物、炭化物又はホウ化物の形状で存在するセラミックターゲットをも含む。
本発明による方法のさらなる態様において、700℃より高い、好適には1000℃より高い、特に1500℃より高い融点を有するターゲット材料がアーク蒸着法(アークPVD)のために用いられる。アーク蒸着法における高融点を有するターゲット材料の使用は、低融点ターゲット材料と比較して大幅に少ないマクロ粒子(飛沫)が蒸着されるという利点を有している。
好適には、前記多層被覆膜のうちの前記少なくとも1つの混合結晶層は、完全に又は少なくとも90容量%がアルファ相で存在する酸化クロムアルミニウム混合結晶層である。
本発明に従って(実施例1および2)および従来通りに(比較例1および2)、デュアルマグネトロンスパッタリング単独(比較例)であるいはアーク蒸着と組み合わせて(実施例)、硬質金属基板をPVD装置内で被覆して、各々アルミニウムクロム混合酸化物層又は酸化アルミニウム層を得た。ビッカース硬度(VH)および単純化E−モジュール(EIT/(1−V2))を測定した。試験パラメーターおよび結果を表1、表2に示す。
Claims (11)
- PVD法によって基板に少なくとも2つの異なる金属(M1、M2)を含む混合結晶層を蒸着するための方法であって、前記混合結晶層の蒸着がi)デュアルマグネトロンスパッタリング又は高出力インパルスマグネトロンスパッタリング(HIPIMS)からなる陰極スパッタリング法およびii)アーク蒸着(アークPVD)の同時適用によって達成されることを特徴とする、前記方法。
- 前記混合結晶層が、少なくとも2つの異なる金属(M1、M2)の混合の、酸化物、炭化物、窒化物、炭窒化物、酸窒化物、酸炭化物、酸炭窒化物、ホウ化物、窒ホウ化物、炭ホウ化物、炭窒ホウ化物、酸窒ホウ化物、酸炭ホウ化物、酸炭窒ホウ化物および酸ホウ窒化物からなる単相の混合結晶層、好適には前記少なくとも2つの異なる金属(M1、M2)の混合酸化物からなる単相の混合結晶層であることを特徴とする請求項1に記載の方法。
- 前記第1の金属と第2の金属が、周期系の亜群IVa〜VIIaの元素、リチウム、ホウ素、アルミニウムおよびケイ素から選択されることを特徴とする請求項1又は2に記載の方法。
- 前記2つの異なる金属(M1、M2)が、アルミニウムおよびクロムであることを特徴とする請求項1〜3のいずれか1項に記載の方法。
- 少なくとも第1の金属(M1)と任意に追加的な第2の金属(M2)と任意にさらなる金属とを含む少なくとも1つのターゲットがデュアルマグネトロンスパッタリング又は高出力インパルスマグネトロンスパッタリング(HIPIMS)からなる陰極スパッタリング法の適用のために用いられ、且つ少なくとも第2の金属(M2)を含む少なくとも1つのターゲットがアーク蒸着法(アークPVD)の適用のために用いられることを特徴とする請求項1〜4のいずれか1項に記載の方法。
- 2つのアルミニウムターゲット又は1つのアルミニウムターゲットと混合アルミニウムクロムターゲットとがデュアルマグネトロンスパッタリング又は高出力インパルスマグネトロンスパッタリング(HIPIMS)からなる陰極スパッタリング法のために用いられ、且つ少なくとも1つのクロムターゲットがアーク蒸着法(アークPVD)のために用いられることを特徴とする請求項1〜5のいずれか1項に記載の方法。
- 前記混合結晶層が0.2nm〜10μm、好適には5nm〜1μm、特に10nm〜100nmの厚さで蒸着されることを特徴とする請求項1〜6のいずれか1項に記載の方法。
- 前記基板が、硬質金属、サーメット(陶性金属)、鋼鉄又は高速度鋼(HSS)でできていることを特徴とする請求項1〜7のいずれか1項に記載の方法。
- 700℃より高い、好適には1000℃より高い、特に1500℃より高い融点を有するターゲット材料がアーク蒸着法(アークPVD)のために用いられることを特徴とする請求項1〜8のいずれか1項に記載の方法。
- 基板とそれに適用された単層又は多層被覆膜とを含み、前記多層被覆膜の少なくとも1つの層が請求項1〜9のいずれか1項に記載の方法を用いて形成された混合結晶層である切削工具。
- 前記多層被覆膜の少なくとも1つの混合結晶層が、完全に又は少なくとも90容量%がアルファ相で存在する酸化クロムアルミニウム混合結晶層であることを特徴とする請求項10に記載の切削工具。
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PCT/EP2011/057064 WO2011138331A2 (de) | 2010-05-04 | 2011-05-03 | Pvd-hybridverfahren zum abscheiden von mischkristallschichten |
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JP2019507025A (ja) * | 2016-02-19 | 2019-03-14 | ヴァルター アーゲー | 切削装置 |
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DE102012013577A1 (de) | 2012-07-10 | 2014-01-16 | Oerlikon Trading Ag, Trübbach | Hochleistungsimpulsbeschichtungsmethode |
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WO2011138331A3 (de) | 2012-12-13 |
JP5856148B2 (ja) | 2016-02-09 |
CN102933737B (zh) | 2016-02-10 |
WO2011138331A2 (de) | 2011-11-10 |
EP2566997A2 (de) | 2013-03-13 |
EP2566997B1 (de) | 2019-02-20 |
KR20130097643A (ko) | 2013-09-03 |
KR101779634B1 (ko) | 2017-09-18 |
CN102933737A (zh) | 2013-02-13 |
DE102010028558A1 (de) | 2011-11-10 |
US8980446B2 (en) | 2015-03-17 |
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US20130209834A1 (en) | 2013-08-15 |
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