JP2013528953A - オプトエレクトロニクス半導体チップの製造方法、および、オプトエレクトロニクス半導体チップ - Google Patents
オプトエレクトロニクス半導体チップの製造方法、および、オプトエレクトロニクス半導体チップ Download PDFInfo
- Publication number
- JP2013528953A JP2013528953A JP2013514620A JP2013514620A JP2013528953A JP 2013528953 A JP2013528953 A JP 2013528953A JP 2013514620 A JP2013514620 A JP 2013514620A JP 2013514620 A JP2013514620 A JP 2013514620A JP 2013528953 A JP2013528953 A JP 2013528953A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- semiconductor chip
- type conductive
- optoelectronic semiconductor
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 137
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 102
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 119
- 239000002184 metal Substances 0.000 claims abstract description 119
- 238000000034 method Methods 0.000 claims abstract description 46
- 230000000903 blocking effect Effects 0.000 claims abstract description 26
- 230000003472 neutralizing effect Effects 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 435
- 238000002161 passivation Methods 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 22
- 239000002344 surface layer Substances 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000000059 patterning Methods 0.000 description 28
- 230000003014 reinforcing effect Effects 0.000 description 14
- 239000000758 substrate Substances 0.000 description 10
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- 238000000231 atomic layer deposition Methods 0.000 description 8
- 230000005670 electromagnetic radiation Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000006386 neutralization reaction Methods 0.000 description 5
- -1 argon ions Chemical class 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910017121 AlSiO Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/0008—Devices characterised by their operation having p-n or hi-lo junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
Claims (15)
- オプトエレクトロニクス半導体チップの製造方法であって、
n型導電層(2)を用意するステップと、
前記n型導電層(2)上にp型導電層(4)を設けるステップと、
前記p型導電層(4)上に金属層列(5)を設けるステップと、
前記金属層列(5)のうち前記p型導電層(4)とは反対の側にマスク(6)を配置するステップと、
前記マスク(6)を用いて部分的に前記金属層列(5)を除去し、前記p型導電層(4)を露出させるステップと、
前記マスク(6)を用いて前記p型導電層(4)の露出領域(4a)を前記n型導電層(2)にいたるまで部分的に中性化もしくは除去するステップと
を含み、
前記金属層列(5)は少なくとも1つの鏡面層(51)および阻止層(52)を含み、前記金属層列(5)の前記鏡面層(52)は前記p型導電層(4)に面している
ことを特徴とするオプトエレクトロニクス半導体チップの製造方法。 - オプトエレクトロニクス半導体チップであって、
少なくとも1つの鏡面層(51)および阻止層(52)を含む金属層列(5)と、
p型導電層(4)と
を含み、
前記p型導電層(4)は前記金属層列(5)の前記鏡面層(51)に面しており、
前記p型導電層(4)は側方で前記鏡面層(51)から突出しており、
前記p型導電層(4)が側方で前記鏡面層(51)から突出する距離(d3)は最大で5μmである
ことを特徴とするオプトエレクトロニクス半導体チップ。 - n型導電層(2)および前記p型導電層(4)を貫通する開口(10)が形成されており、前記開口(10)の底面(10a)において前記金属層列(5)の1つの層が露出しており、前記オプトエレクトロニクス半導体チップの電気的コンタクトのための端子面(54)が前記底面(10a)に形成されている、請求項2記載のオプトエレクトロニクス半導体チップまたは方法。
- 前記開口(10)は少なくとも部分的に前記金属層列(5)の前記鏡面層(51)を通っており、少なくとも前記鏡面層(51)の領域内の前記開口(10)の側面(10b)はパシベーション層(11)によって完全に覆われている、請求項3記載のオプトエレクトロニクス半導体チップまたは方法。
- 前記p型導電層(4)は前記開口(10)内の側方で前記鏡面層(51)から突出している、請求項1から4までのいずれか1項記載のオプトエレクトロニクス半導体チップまたは方法。
- 前記鏡面層(51)の領域内の前記開口(10)の側面(10b)は、前記オプトエレクトロニクス半導体チップの支持体(9)のうち前記鏡面層(51)に面する表面に対して、前記p型導電層(4)の領域内の前記開口(10)の側面(10b)とは異なる角度をなしている、請求項5記載のオプトエレクトロニクス半導体チップまたは方法。
- 前記パシベーション層(11)はALDプロセスによって形成される、請求項1から6までのいずれか1項記載のオプトエレクトロニクス半導体チップまたは方法。
- 少なくとも2つの開口(101,102)が形成されており、一方の開口(102)に前記オプトエレクトロニクス半導体チップのn側コンタクトのための端子面が形成されており、他方の開口(101)に前記オプトエレクトロニクス半導体チップのp側コンタクトのための端子面が形成されている、請求項1から7までのいずれか1項記載のオプトエレクトロニクス半導体チップまたは方法。
- 前記金属層列(5)の各側面(5a)は、前記開口(10,101,102)を除いて、前記n型導電層(2)の半導体材料に電気的に接続された金属層(8)に少なくとも間接的に接している、請求項1から8までのいずれか1項記載のオプトエレクトロニクス半導体チップまたは方法。
- 少なくとも1つの開口(10,101,102)は側方で活性ゾーン(3)によって完全に包囲されている、請求項1から9までのいずれか1項記載のオプトエレクトロニクス半導体チップまたは方法。
- 前記オプトエレクトロニクス半導体チップは、前記金属層列(5)および前記p型導電層(4)およびn型導電層(2)の各部分を含むESD部分領域(13)を有しており、該ESD部分領域は前記オプトエレクトロニクス半導体チップの残りの部分に対して電気的に逆並列に接続されており、前記ESD部分領域(13)は前記オプトエレクトロニクス半導体チップの残りの部分に対するESD保護ダイオードを形成する、請求項1から10までのいずれか1項記載のオプトエレクトロニクス半導体チップまたは方法。
- 前記ESD部分領域(13)は側方で前記活性ゾーン(3)によって完全に包囲されている、請求項11記載のオプトエレクトロニクス半導体チップまたは方法。
- 前記オプトエレクトロニクス半導体チップは、電気的に直列に接続された、少なくとも2つの活性部分領域(31)に分割されている、請求項1から12までのいずれか1項記載のオプトエレクトロニクス半導体チップまたは方法。
- 前記活性部分領域(31)間の電気的接続部(32)は前記オプトエレクトロニクス半導体チップの光出射面(22)の下方に配置されている、請求項13記載のオプトエレクトロニクス半導体チップまたは方法。
- 前記オプトエレクトロニクス半導体チップの動作時には各活性部分領域(31)で少なくとも2Vの電圧が降下する、請求項1から14までのいずれか1項記載のオプトエレクトロニクス半導体チップまたは方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010024079A DE102010024079A1 (de) | 2010-06-17 | 2010-06-17 | Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip |
DE102010024079.6 | 2010-06-17 | ||
PCT/EP2011/058653 WO2011157523A1 (de) | 2010-06-17 | 2011-05-26 | Verfahren zur herstellung eines optoelektronischen halbleiterchips und optoelektronischer halbleiterchip |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013528953A true JP2013528953A (ja) | 2013-07-11 |
JP5946446B2 JP5946446B2 (ja) | 2016-07-06 |
Family
ID=44486975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013514620A Active JP5946446B2 (ja) | 2010-06-17 | 2011-05-26 | オプトエレクトロニクス半導体チップの製造方法 |
Country Status (8)
Country | Link |
---|---|
US (2) | US9257612B2 (ja) |
EP (1) | EP2583305B1 (ja) |
JP (1) | JP5946446B2 (ja) |
KR (2) | KR101857426B1 (ja) |
CN (1) | CN102947936B (ja) |
DE (1) | DE102010024079A1 (ja) |
TW (1) | TWI524550B (ja) |
WO (1) | WO2011157523A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017034346A1 (ko) * | 2015-08-27 | 2017-03-02 | 엘지이노텍(주) | 발광소자 및 이를 포함하는 발광소자 패키지 |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010009717A1 (de) | 2010-03-01 | 2011-09-01 | Osram Opto Semiconductors Gmbh | Leuchtdiodenchip |
DE102010033137A1 (de) | 2010-08-03 | 2012-02-09 | Osram Opto Semiconductors Gmbh | Leuchtdiodenchip |
DE102011016302A1 (de) * | 2011-04-07 | 2012-10-11 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
DE102011112000B4 (de) | 2011-08-31 | 2023-11-30 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Leuchtdiodenchip |
DE102012107921A1 (de) * | 2012-08-28 | 2014-03-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
DE102012108627B4 (de) * | 2012-09-14 | 2021-06-10 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronische Halbleitervorrichtung und Trägerverbund |
DE102012108879B4 (de) * | 2012-09-20 | 2024-03-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip mit mehreren nebeneinander angeordneten aktiven Bereichen |
DE102012109905B4 (de) | 2012-10-17 | 2021-11-11 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterbauteilen |
DE102012110909A1 (de) * | 2012-11-13 | 2014-05-15 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip und Verfahren zum Betreiben eines Halbleiterchips |
DE102013100818B4 (de) * | 2013-01-28 | 2023-07-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
DE102013103079A1 (de) * | 2013-03-26 | 2014-10-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
DE102014202424A1 (de) * | 2014-02-11 | 2015-08-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einer reflektierenden Schichtenfolge und Verfahren zum Erzeugen einer reflektierenden Schichtenfolge |
DE102014102029A1 (de) * | 2014-02-18 | 2015-08-20 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von Halbleiterbauelementen und Halbleiterbauelement |
JP6265032B2 (ja) * | 2014-04-28 | 2018-01-24 | 住友電気工業株式会社 | 半導体受光素子 |
DE102015102374A1 (de) | 2015-02-19 | 2016-08-25 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Halbleiterkörpers |
DE102015102378B4 (de) | 2015-02-19 | 2022-09-15 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Halbleiterkörpers |
KR20160141301A (ko) * | 2015-05-29 | 2016-12-08 | 삼성전자주식회사 | 반도체 발광 소자 패키지 |
DE102015112538B4 (de) | 2015-07-30 | 2023-08-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und ein Verfahren zur Herstellung eines optoelektronischen Bauelements |
DE102015116495A1 (de) * | 2015-09-29 | 2017-03-30 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zum Herstellen eines optoelektronischen Halbleiterchips |
DE102015116865A1 (de) | 2015-10-05 | 2017-04-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Halbleiterchips und Halbleiterchip |
DE102016104965A1 (de) * | 2016-03-17 | 2017-09-21 | Osram Opto Semiconductors Gmbh | Lichtemittierender Halbleiterchip und Verfahren zur Herstellung eines lichtemittierenden Halbleiterchips |
DE102016106928A1 (de) * | 2016-04-14 | 2017-10-19 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
DE102016111113A1 (de) | 2016-06-17 | 2017-12-21 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
DE102016112291A1 (de) * | 2016-07-05 | 2018-01-11 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
US20180315894A1 (en) * | 2017-04-26 | 2018-11-01 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and a method of manufacturing the same |
KR102430500B1 (ko) * | 2017-05-30 | 2022-08-08 | 삼성전자주식회사 | 반도체 발광소자 및 이를 이용한 led 모듈 |
TWI706552B (zh) * | 2019-08-28 | 2020-10-01 | 世界先進積體電路股份有限公司 | 光學感測器及其形成方法 |
US11217708B2 (en) | 2020-06-02 | 2022-01-04 | Vanguard International Semiconductor Corporation | Optical sensor and method for forming the same |
CN113764979A (zh) * | 2021-10-11 | 2021-12-07 | 中国科学院半导体研究所 | 双层钝化薄膜材料及其制备方法 |
DE102021130159A1 (de) * | 2021-11-18 | 2023-05-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauteil und verfahren zur herstellung eines optoelektronischen bauteils |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002359402A (ja) * | 2001-03-29 | 2002-12-13 | Lumileds Lighting Us Llc | 高抵抗性基層の上に形成されたモノリシック直列/並列ledアレイ |
JP2005327847A (ja) * | 2004-05-13 | 2005-11-24 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2005340849A (ja) * | 2004-05-26 | 2005-12-08 | Lumileds Lighting Us Llc | Esd防護用の高速スイッチング・ダイオード内臓ledチップ |
JP2006135229A (ja) * | 2004-11-09 | 2006-05-25 | Elpida Memory Inc | 絶縁膜の成膜方法及びその絶縁膜を備えた半導体装置 |
JP2007221175A (ja) * | 2007-06-04 | 2007-08-30 | Toshiba Corp | 半導体発光素子及び半導体発光装置 |
JP2007287849A (ja) * | 2006-04-14 | 2007-11-01 | Nichia Chem Ind Ltd | 半導体発光素子 |
JP2009188240A (ja) * | 2008-02-07 | 2009-08-20 | Sharp Corp | 半導体発光素子の製造方法および半導体発光素子 |
US20090283787A1 (en) * | 2007-11-14 | 2009-11-19 | Matthew Donofrio | Semiconductor light emitting diodes having reflective structures and methods of fabricating same |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI292227B (en) | 2000-05-26 | 2008-01-01 | Osram Opto Semiconductors Gmbh | Light-emitting-dioed-chip with a light-emitting-epitaxy-layer-series based on gan |
DE10147791A1 (de) | 2001-09-27 | 2003-04-10 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Halbleiterbauelements auf der Basis eines Nitrid-Verbindungshalbleiters |
TWI223460B (en) * | 2003-09-23 | 2004-11-01 | United Epitaxy Co Ltd | Light emitting diodes in series connection and method of making the same |
KR101332771B1 (ko) | 2004-02-20 | 2013-11-25 | 오스람 옵토 세미컨덕터스 게엠베하 | 광전 소자, 다수의 광전 소자를 구비한 장치 및 광전 소자를 제조하기 위한 방법 |
CN100386891C (zh) * | 2004-07-02 | 2008-05-07 | 北京工业大学 | 高抗静电高效发光二极管及制作方法 |
TW200841393A (en) * | 2007-04-02 | 2008-10-16 | Miin-Jang Chen | Optoelectronic device and method of fabricating the same |
DE102007019775A1 (de) * | 2007-04-26 | 2008-10-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
DE102007022947B4 (de) | 2007-04-26 | 2022-05-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
DE102007057672A1 (de) * | 2007-11-30 | 2009-06-04 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper |
DE102008022942A1 (de) * | 2008-05-09 | 2009-11-12 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip |
KR20100030472A (ko) | 2008-09-10 | 2010-03-18 | 삼성전자주식회사 | 발광 소자 및 발광 장치의 제조 방법, 상기 방법을 이용하여 제조한 발광 소자 및 발광 장치 |
US8324083B2 (en) * | 2008-09-30 | 2012-12-04 | Toyoda Gosei Co., Ltd. | Method for producing group III nitride compound semiconductor element |
US8008683B2 (en) * | 2008-10-22 | 2011-08-30 | Samsung Led Co., Ltd. | Semiconductor light emitting device |
CN102217102B (zh) | 2008-11-14 | 2015-07-15 | 三星电子株式会社 | 半导体发光器件 |
DE102009006177A1 (de) | 2008-11-28 | 2010-06-02 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip |
JP5564890B2 (ja) * | 2008-12-16 | 2014-08-06 | 住友電気工業株式会社 | 接合型電界効果トランジスタおよびその製造方法 |
JP2011029574A (ja) * | 2009-03-31 | 2011-02-10 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体素子の製造方法 |
-
2010
- 2010-06-17 DE DE102010024079A patent/DE102010024079A1/de active Pending
-
2011
- 2011-05-26 KR KR1020137001059A patent/KR101857426B1/ko active IP Right Grant
- 2011-05-26 JP JP2013514620A patent/JP5946446B2/ja active Active
- 2011-05-26 KR KR1020187012757A patent/KR101996665B1/ko active IP Right Grant
- 2011-05-26 WO PCT/EP2011/058653 patent/WO2011157523A1/de active Application Filing
- 2011-05-26 US US13/704,600 patent/US9257612B2/en active Active
- 2011-05-26 EP EP11726078.6A patent/EP2583305B1/de active Active
- 2011-05-26 CN CN201180029852.8A patent/CN102947936B/zh active Active
- 2011-06-16 TW TW100121017A patent/TWI524550B/zh active
-
2016
- 2016-02-08 US US15/018,845 patent/US9627588B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002359402A (ja) * | 2001-03-29 | 2002-12-13 | Lumileds Lighting Us Llc | 高抵抗性基層の上に形成されたモノリシック直列/並列ledアレイ |
JP2005327847A (ja) * | 2004-05-13 | 2005-11-24 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2005340849A (ja) * | 2004-05-26 | 2005-12-08 | Lumileds Lighting Us Llc | Esd防護用の高速スイッチング・ダイオード内臓ledチップ |
JP2006135229A (ja) * | 2004-11-09 | 2006-05-25 | Elpida Memory Inc | 絶縁膜の成膜方法及びその絶縁膜を備えた半導体装置 |
JP2007287849A (ja) * | 2006-04-14 | 2007-11-01 | Nichia Chem Ind Ltd | 半導体発光素子 |
JP2007221175A (ja) * | 2007-06-04 | 2007-08-30 | Toshiba Corp | 半導体発光素子及び半導体発光装置 |
US20090283787A1 (en) * | 2007-11-14 | 2009-11-19 | Matthew Donofrio | Semiconductor light emitting diodes having reflective structures and methods of fabricating same |
JP2009188240A (ja) * | 2008-02-07 | 2009-08-20 | Sharp Corp | 半導体発光素子の製造方法および半導体発光素子 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017034346A1 (ko) * | 2015-08-27 | 2017-03-02 | 엘지이노텍(주) | 발광소자 및 이를 포함하는 발광소자 패키지 |
JP2018525821A (ja) * | 2015-08-27 | 2018-09-06 | エルジー イノテック カンパニー リミテッド | 発光素子及びこれを含む発光素子パッケージ |
US10263154B2 (en) | 2015-08-27 | 2019-04-16 | Lg Innotek Co., Ltd. | Light-emitting device and light-emitting device package comprising same |
Also Published As
Publication number | Publication date |
---|---|
TW201208111A (en) | 2012-02-16 |
KR20180051667A (ko) | 2018-05-16 |
KR20130093075A (ko) | 2013-08-21 |
KR101996665B1 (ko) | 2019-07-04 |
US9627588B2 (en) | 2017-04-18 |
WO2011157523A1 (de) | 2011-12-22 |
US9257612B2 (en) | 2016-02-09 |
KR101857426B1 (ko) | 2018-05-14 |
CN102947936B (zh) | 2016-04-06 |
CN102947936A (zh) | 2013-02-27 |
EP2583305B1 (de) | 2017-08-09 |
EP2583305A1 (de) | 2013-04-24 |
TWI524550B (zh) | 2016-03-01 |
DE102010024079A1 (de) | 2011-12-22 |
US20160225957A1 (en) | 2016-08-04 |
US20130140598A1 (en) | 2013-06-06 |
JP5946446B2 (ja) | 2016-07-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5946446B2 (ja) | オプトエレクトロニクス半導体チップの製造方法 | |
JP5686900B2 (ja) | 発光ダイオードチップおよびその製造方法 | |
TWI505517B (zh) | 光電半導體晶片及光電半導體晶片之製造方法 | |
TWI472063B (zh) | 發光二極體晶片 | |
TWI452731B (zh) | 光電半導體晶片及其製造方法 | |
TWI451568B (zh) | 光電半導體晶片 | |
US20150129901A1 (en) | Optoelectronic Semiconductor Chip and Method for Producing an Optoelectronic Semiconductor Chip | |
JP5986217B2 (ja) | オプトエレクトロニクス半導体チップ | |
US20160005930A1 (en) | Optoelectronic semiconductor chip encapsulated with an ald layer and corresponding method of production | |
JP2017512380A (ja) | 半導体構成素子を製造する方法、及び、半導体構成素子 | |
TWI557944B (zh) | 光電半導體晶片 | |
TWI443856B (zh) | 半導體晶片及製造半導體晶片之方法 | |
EP3646382B1 (en) | Optoelectronic device with light-emitting diodes | |
US20230047118A1 (en) | Radiation-emitting semiconductor chip and method for producing a radiation-emitting semiconductor chip | |
KR20240046585A (ko) | 광전자 구성요소, 구성요소 유닛 및 이를 제조하는 방법 | |
KR20230058669A (ko) | 광전자 반도체 컴포넌트 및 하나 이상의 광전자 반도체 컴포넌트를 제조하기 위한 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130116 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130116 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20131129 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140212 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140430 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140509 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140811 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20150105 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150428 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20150511 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20150605 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160310 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160531 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5946446 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |