JP2013526632A5 - - Google Patents

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Publication number
JP2013526632A5
JP2013526632A5 JP2013509577A JP2013509577A JP2013526632A5 JP 2013526632 A5 JP2013526632 A5 JP 2013526632A5 JP 2013509577 A JP2013509577 A JP 2013509577A JP 2013509577 A JP2013509577 A JP 2013509577A JP 2013526632 A5 JP2013526632 A5 JP 2013526632A5
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JP
Japan
Prior art keywords
group
alkyl
oligomer
polymer
heteroaryl
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Application number
JP2013509577A
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English (en)
Japanese (ja)
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JP5792800B2 (ja
JP2013526632A (ja
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Priority claimed from PCT/EP2011/057864 external-priority patent/WO2011141578A1/en
Publication of JP2013526632A publication Critical patent/JP2013526632A/ja
Publication of JP2013526632A5 publication Critical patent/JP2013526632A5/ja
Application granted granted Critical
Publication of JP5792800B2 publication Critical patent/JP5792800B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013509577A 2010-05-14 2011-05-16 架橋の触媒反応 Active JP5792800B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
SE1050475-1 2010-05-14
SE1050475 2010-05-14
SE1050631-9 2010-06-18
SE1050631 2010-06-18
PCT/EP2011/057864 WO2011141578A1 (en) 2010-05-14 2011-05-16 Catalysis of cross-linking

Publications (3)

Publication Number Publication Date
JP2013526632A JP2013526632A (ja) 2013-06-24
JP2013526632A5 true JP2013526632A5 (enExample) 2014-03-27
JP5792800B2 JP5792800B2 (ja) 2015-10-14

Family

ID=44343180

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013509577A Active JP5792800B2 (ja) 2010-05-14 2011-05-16 架橋の触媒反応

Country Status (5)

Country Link
US (1) US8697823B2 (enExample)
EP (1) EP2569343B1 (enExample)
JP (1) JP5792800B2 (enExample)
CN (1) CN102892800B (enExample)
WO (1) WO2011141578A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5746320B2 (ja) * 2010-04-16 2015-07-08 ネクサム ケミカル エイビー 新規な架橋剤
WO2012131063A1 (en) 2011-04-01 2012-10-04 Nexam Chemical Ab Improved oligo- and polyimides
TWI544843B (zh) * 2011-11-22 2016-08-01 松下知識產權經營股份有限公司 可撓性貼金屬基材、可撓性貼金屬基材之製造方法、印刷配線板、多層可撓印刷配線板、及軟硬複合印刷配線板
JP2013173820A (ja) * 2012-02-23 2013-09-05 Pi R & D Co Ltd 新規ポリイミド及びそれを含む印刷用組成物
EP2653467B1 (en) * 2012-04-20 2014-09-03 Nexam Chemical AB Process for producing (ethyne-1,2-diyl)bis(isobenzofuran-1,3- dione)
EP2899179A1 (en) 2014-01-24 2015-07-29 Nexam Chemical AB Combination of cross-linkers including carbon-carbon triple bonds
JP6750146B2 (ja) * 2015-10-13 2020-09-02 株式会社ピーアイ技術研究所 電着用ポリイミド及びそれを含む電着塗料組成物
US9892845B2 (en) 2016-01-13 2018-02-13 Martin Weinberg Polyamide electrical insulation for use in liquid filled transformers
CN113603662B (zh) * 2021-06-15 2023-06-06 陕西泰合利华工业有限公司 一种制备4-(1-酮-2-炔苯丙烷)苯酐的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5567800A (en) 1994-10-28 1996-10-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Imide oligomers endcapped with phenylethynyl phthalic anhydrides and polymers therefrom
DE19532316C1 (de) 1995-09-01 1997-05-22 Bayer Ag Vernetzbare Polysiloxan-Mischungen, ein Verfahren zur Herstellung und deren Verwendung
AUPO549397A0 (en) 1997-03-07 1997-03-27 Commonwealth Scientific And Industrial Research Organisation Reduced temperature curing of acetylenic polymers
EP1237015A1 (en) * 2000-08-09 2002-09-04 Mitsui Chemicals, Inc. Optical members made of polyimide resins
JP4206925B2 (ja) 2001-07-12 2009-01-14 旭硝子株式会社 含フッ素芳香族ポリマー及びその用途
JP4513956B2 (ja) * 2003-07-30 2010-07-28 日本電気株式会社 有機高分子膜及びその製造方法
JP4501391B2 (ja) 2003-09-30 2010-07-14 旭硝子株式会社 架橋性含フッ素芳香族プレポリマー及びその用途
EP1995635A4 (en) 2006-03-16 2011-03-30 Asahi Glass Co Ltd NEGATIVE LIGHT-SENSITIVE FLUORATED AROMATIC RESIN COMPOSITION
ATE518901T1 (de) 2006-06-02 2011-08-15 Asahi Glass Co Ltd Vernetzbares prepolymer, herstellungsverfahren dafür und verwendung davon
JP4400695B2 (ja) 2007-02-19 2010-01-20 住友ベークライト株式会社 感光性樹脂組成物、硬化膜、保護膜、絶縁膜およびそれを用いた半導体装置、表示体装置
JP2010077192A (ja) * 2008-09-24 2010-04-08 Fujifilm Corp 樹脂組成物、該樹脂組成物を用いた硬化物、フレキシブル銅張り積層板及びフレキシブルプリント基板

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