JP2013525606A5 - - Google Patents
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- Publication number
- JP2013525606A5 JP2013525606A5 JP2013505589A JP2013505589A JP2013525606A5 JP 2013525606 A5 JP2013525606 A5 JP 2013525606A5 JP 2013505589 A JP2013505589 A JP 2013505589A JP 2013505589 A JP2013505589 A JP 2013505589A JP 2013525606 A5 JP2013525606 A5 JP 2013525606A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- substrate
- ion
- method characterized
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 238000001465 metallisation Methods 0.000 claims description 2
- 239000000243 solution Substances 0.000 claims 8
- 229910021645 metal ion Inorganic materials 0.000 claims 6
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims 5
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 claims 5
- 239000002253 acid Substances 0.000 claims 4
- 150000002500 ions Chemical class 0.000 claims 4
- 239000007769 metal material Substances 0.000 claims 4
- 239000007800 oxidant agent Substances 0.000 claims 4
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 2
- 238000004140 cleaning Methods 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 1
- 239000012028 Fenton's reagent Substances 0.000 claims 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims 1
- 150000007513 acids Chemical class 0.000 claims 1
- 230000001476 alcoholic effect Effects 0.000 claims 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 1
- 229910021529 ammonia Inorganic materials 0.000 claims 1
- 239000003637 basic solution Substances 0.000 claims 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 claims 1
- 239000003153 chemical reaction reagent Substances 0.000 claims 1
- 239000003638 chemical reducing agent Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 239000011247 coating layer Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229910001429 cobalt ion Inorganic materials 0.000 claims 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 claims 1
- 230000000536 complexating effect Effects 0.000 claims 1
- 239000008139 complexing agent Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910001431 copper ion Inorganic materials 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910001453 nickel ion Inorganic materials 0.000 claims 1
- 229910017604 nitric acid Inorganic materials 0.000 claims 1
- 235000006408 oxalic acid Nutrition 0.000 claims 1
- 239000003002 pH adjusting agent Substances 0.000 claims 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 claims 1
- 230000000737 periodic effect Effects 0.000 claims 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 1
- -1 platinum ion Chemical class 0.000 claims 1
- 239000012286 potassium permanganate Substances 0.000 claims 1
- 239000012279 sodium borohydride Substances 0.000 claims 1
- 229910000033 sodium borohydride Inorganic materials 0.000 claims 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 238000001994 activation Methods 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28290610P | 2010-04-19 | 2010-04-19 | |
| FR10/01663 | 2010-04-19 | ||
| FR1001663A FR2958944B1 (fr) | 2010-04-19 | 2010-04-19 | Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique |
| US61/282,906 | 2010-04-19 | ||
| PCT/IB2011/051691 WO2011132144A1 (fr) | 2010-04-19 | 2011-04-19 | Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013525606A JP2013525606A (ja) | 2013-06-20 |
| JP2013525606A5 true JP2013525606A5 (enExample) | 2016-02-18 |
| JP5947284B2 JP5947284B2 (ja) | 2016-07-06 |
Family
ID=43034368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013505589A Active JP5947284B2 (ja) | 2010-04-19 | 2011-04-19 | 銅層を用いた非金属材料からなる基板の表面を被覆する方法 |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US8962086B2 (enExample) |
| EP (1) | EP2561117B1 (enExample) |
| JP (1) | JP5947284B2 (enExample) |
| KR (1) | KR101812641B1 (enExample) |
| CN (1) | CN102933745B (enExample) |
| ES (1) | ES2576278T3 (enExample) |
| FR (1) | FR2958944B1 (enExample) |
| PL (1) | PL2561117T3 (enExample) |
| PT (1) | PT2561117E (enExample) |
| WO (1) | WO2011132144A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2958944B1 (fr) * | 2010-04-19 | 2014-11-28 | Pegastech | Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique |
| CN103436164B (zh) * | 2013-09-03 | 2015-12-02 | 丽水学院 | 用于abs工程塑料表面处理的混合溶液及处理方法 |
| KR101662759B1 (ko) * | 2015-01-09 | 2016-10-10 | 건국대학교 글로컬산학협력단 | 무전해 도금법 및 전해 도금법을 연속 적용한 금속 도금 섬유의 제조방법, 상기 방법에 의해 제조된 금속 도금 섬유 및 상기 섬유를 적용한 필터 |
| EP3216756A1 (en) | 2016-03-08 | 2017-09-13 | ATOTECH Deutschland GmbH | Method for recovering phosphoric acid from a spent phosphoric acid / alkali metal permanganate salt etching solution |
| FR3050215B1 (fr) * | 2016-04-15 | 2018-04-13 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de modification d'une surface en oxyde conducteur de l'electricite, utilisation pour l'electrodeposition de cuivre sur cette derniere |
| CN108624907A (zh) * | 2018-04-26 | 2018-10-09 | 复旦大学 | 非金属基体高效催化电极及其制备方法 |
| BR112021016763A2 (pt) * | 2019-04-04 | 2021-10-13 | Atotech Deutschland Gmbh | Método de ativação de uma superfície de um substrato contendo fibras não condutoras ou de carbono para metalização |
| WO2021030187A1 (en) * | 2019-08-09 | 2021-02-18 | Jnt Technologies, Llc | Antimicrobial common touch surfaces |
| CN113564569B (zh) * | 2021-03-18 | 2023-10-31 | 麦德美科技（苏州）有限公司 | Lcp塑料的化学粗化及金属化工艺方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3553085A (en) * | 1967-11-28 | 1971-01-05 | Schering Ag | Method of preparing surfaces of plastic for electro-deposition |
| US3598630A (en) | 1967-12-22 | 1971-08-10 | Gen Motors Corp | Method of conditioning the surface of acrylonitrile-butadiene-styrene |
| US4701351A (en) * | 1986-06-16 | 1987-10-20 | International Business Machines Corporation | Seeding process for electroless metal deposition |
| NO304746B1 (no) * | 1989-05-04 | 1999-02-08 | Ad Tech Holdings Ltd | Gjenstand som motstÕr mikrobiologisk vekst bestÕende av et ikke-ledende subtrat som er belagt med et trat som er belagt medfremgangsmate for a avsette |
| US4981715A (en) | 1989-08-10 | 1991-01-01 | Microelectronics And Computer Technology Corporation | Method of patterning electroless plated metal on a polymer substrate |
| US5160600A (en) * | 1990-03-05 | 1992-11-03 | Patel Gordhanbai N | Chromic acid free etching of polymers for electroless plating |
| JPH0715114A (ja) * | 1993-06-25 | 1995-01-17 | Hitachi Ltd | プリント回路板のパターン形成用表面処理槽 |
| JP3535418B2 (ja) * | 1999-07-14 | 2004-06-07 | 富士通株式会社 | 導体パターン形成方法 |
| DE10054544A1 (de) * | 2000-11-01 | 2002-05-08 | Atotech Deutschland Gmbh | Verfahren zum chemischen Metallisieren von Oberflächen |
| JP4670064B2 (ja) * | 2001-02-07 | 2011-04-13 | 奥野製薬工業株式会社 | 無電解めっき用触媒付与方法 |
| JP2003041375A (ja) * | 2001-07-31 | 2003-02-13 | Okuno Chem Ind Co Ltd | 無電解めっき用触媒付与方法 |
| JP4111922B2 (ja) * | 2002-04-25 | 2008-07-02 | ピーピージー・インダストリーズ・オハイオ・インコーポレイテッド | 保護性コーティングを有する被覆済み物品、及び被覆済み物品を製造するためのカソードターゲット |
| JP2004203014A (ja) * | 2002-10-31 | 2004-07-22 | Toyoda Gosei Co Ltd | めっき製品 |
| CN1329554C (zh) | 2004-01-13 | 2007-08-01 | 长沙力元新材料股份有限公司 | 非金属基材表面化学镀覆金属的方法及其采用的前处理体系 |
| EP2009142B8 (en) | 2006-04-18 | 2013-08-14 | Okuno Chemical Industries Co., Ltd. | Composition for etching treatment of resin molded article |
| CN100545305C (zh) | 2007-05-29 | 2009-09-30 | 南京工业大学 | 非金属基体化学镀的一种活化工艺 |
| ATE445667T1 (de) | 2007-08-10 | 2009-10-15 | Enthone | Chromfreie beize für kunststoffoberflächen |
| CN101381865B (zh) | 2008-10-23 | 2011-06-01 | 中国人民解放军第二炮兵工程学院 | 一种羧甲基纤维素钠螯合吸附镍的塑料基体表面无钯活化方法 |
| FR2958944B1 (fr) * | 2010-04-19 | 2014-11-28 | Pegastech | Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique |
-
2010
- 2010-04-19 FR FR1001663A patent/FR2958944B1/fr active Active
-
2011
- 2011-04-19 ES ES11723649.7T patent/ES2576278T3/es active Active
- 2011-04-19 WO PCT/IB2011/051691 patent/WO2011132144A1/fr not_active Ceased
- 2011-04-19 EP EP11723649.7A patent/EP2561117B1/fr active Active
- 2011-04-19 US US13/089,740 patent/US8962086B2/en active Active
- 2011-04-19 KR KR1020127030299A patent/KR101812641B1/ko not_active Expired - Fee Related
- 2011-04-19 PL PL11723649.7T patent/PL2561117T3/pl unknown
- 2011-04-19 JP JP2013505589A patent/JP5947284B2/ja active Active
- 2011-04-19 PT PT117236497T patent/PT2561117E/pt unknown
- 2011-04-19 CN CN201180019757.XA patent/CN102933745B/zh active Active
-
2014
- 2014-12-24 US US14/582,228 patent/US9249512B2/en active Active
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