JP2013524529A - 電界効果トランジスタを形成するための方法および電界効果トランジスタ・デバイス - Google Patents
電界効果トランジスタを形成するための方法および電界効果トランジスタ・デバイス Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 49
- 230000005669 field effect Effects 0.000 title claims abstract description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 35
- 239000010703 silicon Substances 0.000 claims abstract description 35
- 229910021332 silicide Inorganic materials 0.000 claims abstract description 29
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims abstract description 29
- 125000006850 spacer group Chemical group 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 4
- 150000004767 nitrides Chemical class 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 2
- 238000007517 polishing process Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 claims 2
- 238000005530 etching Methods 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910005881 NiSi 2 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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Abstract
【解決手段】 この方法は、ゲート・スタックと、ゲート・スタックの両側に隣接するスペーサと、スペーサの両側のシリサイド・ソース領域およびシリサイド・ドレイン領域と、ソース領域およびドレイン領域の上のエピタキシャル成長シリコンとを形成することと、ゲート・スタックおよびスペーサ上にライナ層を形成することと、ライナ層の一部分を除去して、ハードマスク層の一部分を露出することと、ハードマスク層の露出部分を除去して、ゲート・スタックのシリコン層を露出することと、露出したシリコンを除去して、ゲート・スタック、ソース領域、およびドレイン領域の金属層の一部分を露出することと、ゲート・スタック、シリサイド・ソース領域、およびシリサイド・ドレイン領域の金属層上に導電物質を付着させることを含む。
【選択図】 図8B
Description
Claims (20)
- 電界効果トランジスタを形成するための方法であって、前記方法が、
基板上にゲート・スタックを形成することと、
前記ゲート・スタックの両側に隣接して前記基板上にスペーサを形成することと、
前記ゲート・スタックの第1の側の前記スペーサに隣接して前記基板にシリサイド・ソース領域を形成することと、
前記ゲート・スタックの第2の側の前記スペーサに隣接して前記基板にシリサイド・ドレイン領域を形成することと、
露出する前記シリサイド・ソース領域および露出する前記シリサイド・ドレイン領域の上にシリコンをエピタキシャル成長させることと、
前記ゲート・スタックのハードマスク層および前記スペーサの上にライナ層を形成することと、
前記ライナ層の一部分を除去して、前記ハードマスク層の一部分を露出することと、
前記ハードマスク層の前記露出部分を除去して、前記ゲート・スタックのシリコン層を露出することと、
露出したシリコンを除去して、前記ゲート・スタック、前記シリサイド・ソース領域、および前記シリサイド・ドレイン領域の金属層の一部分を露出することと、
前記ゲート・スタック、前記露出したシリサイド・ソース領域、および前記露出したシリサイド・ドレイン領域の前記露出した金属層上に導電物質を付着させること
を含む、方法。 - 前記シリサイド・ソース領域および前記シリサイド・ドレイン領域が第1の軸上に位置合わせされ、前記第1の軸が前記ゲート・スタックと直交するように位置合わせされる、請求項1記載の方法。
- 前記ゲート・スタックの前記ハードマスク層の前記露出部分が第2の軸上に位置合わせされ、前記第2の軸が前記第1の軸に平行に位置合わせされる、請求項2記載の方法。
- 前記ゲート・スタックが、前記基板上に配置された誘電体層と、前記誘電体層上に配置された前記金属層と、前記誘電体層上に配置された前記シリコン層と、前記シリコン層上に配置された前記ハードマスク層とを含む、請求項1記載の方法。
- 前記スペーサが窒化物物質を含む、請求項1記載の方法。
- 前記スペーサが第1の窒化物層と第2の窒化物層とを含む、請求項1記載の方法。
- 前記ハードマスク層の一部分を露出するために前記ライナ層の前記一部分を除去することにより、前記ライナ層および前記ハードマスク層の前記露出部分によって定義される空洞が形成される、請求項1記載の方法。
- 前記露出したシリコンを除去することにより、前記ライナ層および前記シリサイド・ドレイン領域によって定義される空洞が形成される、請求項1記載の方法。
- 前記基板がシリコン領域とシリコン・オン・インシュレータ・トレンチ領域(SOI)とを含む、請求項1記載の方法。
- 前記ソース領域および前記ドレイン領域が前記基板のシリコン領域上にあり、前記ゲート・スタックの前記露出した金属層が前記基板のSOI領域上にある、請求項1記載の方法。
- 前記ライナ層が前記エピタキシャル成長させたシリコン上に形成され、前記方法が、前記ライナ層の一部分を除去して前記ハードマスク層の一部分を露出する前に、前記ライナ層の一部分および前記エピタキシャル成長させたシリコンを除去することをさらに含む、請求項1記載の方法。
- 前記ライナ層の前記一部分および前記エピタキシャル成長させたシリコンが化学的機械的研磨プロセスによって除去される、請求項11記載の方法。
- 前記露出したシリコンが反応性イオン・エッチング・プロセスによって除去される、請求項1記載の方法。
- 前記ハードマスク層の前記露出部分が反応性イオン・エッチング・プロセスによって除去される、請求項1記載の方法。
- 電界効果トランジスタ・デバイスであって、
基板上に配置されたゲート・スタックと、
前記ゲート・スタックの第1の遠位端に配置された第1の接点部分と、
前記ゲート・スタックの第2の遠位端に配置された第2の接点部分であって、前記第2の接点部分から距離(d)に第1の接点部分が配置される第2の接点部分と、
前記デバイスのソース領域内に配置され、幅(w)を有する第3の接点部分であって、前記距離(d)が前記幅(w)より大きい第3の接点と
を含む、電界効果トランジスタ・デバイス。 - 前記第1の接点部分および前記第2の接点部分が前記ゲート・スタックの金属層に接触する、請求項15記載のデバイス。
- 前記デバイスが、前記デバイスのドレイン領域内に配置され、幅(w)を有する第4の接点部分を含む、請求項15記載のデバイス。
- 前記ソース領域がシリサイド物質を含む、請求項15記載のデバイス。
- 前記第3の接点部分が、前記ゲート・スタックの中央横軸と位置合わせされた横軸によって配列される、請求項15記載のデバイス。
- 前記ゲート・スタックが、前記基板上に配置された誘電体層と、前記誘電体層上に配置された金属層と、前記誘電体層上に配置されたシリコン層と、前記シリコン層上に配置されたハードマスク層とを含む、請求項15記載のデバイス。
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US12/757,201 US8367508B2 (en) | 2010-04-09 | 2010-04-09 | Self-aligned contacts for field effect transistor devices |
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PCT/US2011/028464 WO2011126682A1 (en) | 2010-04-09 | 2011-03-15 | Self-aligned contacts for field effect transistor devices |
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US9324709B2 (en) * | 2013-08-19 | 2016-04-26 | Globalfoundries Inc. | Self-aligned gate contact structure |
US9337284B2 (en) * | 2014-04-07 | 2016-05-10 | Alpha And Omega Semiconductor Incorporated | Closed cell lateral MOSFET using silicide source and body regions |
CN108987261B (zh) | 2017-06-01 | 2022-05-17 | 联华电子股份有限公司 | 半导体结构及其制造方法 |
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GB2492514A (en) | 2013-01-02 |
DE112011100421T5 (de) | 2012-11-22 |
CN102822976B (zh) | 2016-09-07 |
US20110248321A1 (en) | 2011-10-13 |
US8901626B2 (en) | 2014-12-02 |
TWI538064B (zh) | 2016-06-11 |
GB201219007D0 (en) | 2012-12-05 |
JP5764198B2 (ja) | 2015-08-12 |
GB2492514C (en) | 2014-06-18 |
DE112011100421B4 (de) | 2013-09-05 |
TW201203384A (en) | 2012-01-16 |
TWI527124B (zh) | 2016-03-21 |
US8367508B2 (en) | 2013-02-05 |
CN102822976A (zh) | 2012-12-12 |
GB2492514B (en) | 2014-06-11 |
TW201545241A (zh) | 2015-12-01 |
WO2011126682A1 (en) | 2011-10-13 |
US20120280322A1 (en) | 2012-11-08 |
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