JP2013524011A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013524011A5 JP2013524011A5 JP2013501914A JP2013501914A JP2013524011A5 JP 2013524011 A5 JP2013524011 A5 JP 2013524011A5 JP 2013501914 A JP2013501914 A JP 2013501914A JP 2013501914 A JP2013501914 A JP 2013501914A JP 2013524011 A5 JP2013524011 A5 JP 2013524011A5
- Authority
- JP
- Japan
- Prior art keywords
- bath
- sample
- current
- cathode
- samples
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 description 69
- 229910052751 metal Inorganic materials 0.000 description 37
- 239000011248 coating agent Substances 0.000 description 36
- 238000000576 coating method Methods 0.000 description 36
- 239000002184 metal Substances 0.000 description 36
- 238000009713 electroplating Methods 0.000 description 16
- 230000000875 corresponding Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 229910001338 liquidmetal Inorganic materials 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1052373 | 2010-03-31 | ||
| FR1052373A FR2958300B1 (fr) | 2010-03-31 | 2010-03-31 | Dispositif pour controler des caracteristiques physiques d'un bain d'electrodeposition metallique. |
| PCT/FR2011/050715 WO2011121240A1 (fr) | 2010-03-31 | 2011-03-30 | Dispositif et procede pour controler l'efficacite d'un bain d'electrodeposition metallique |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013524011A JP2013524011A (ja) | 2013-06-17 |
| JP2013524011A5 true JP2013524011A5 (de) | 2015-03-12 |
| JP5764650B2 JP5764650B2 (ja) | 2015-08-19 |
Family
ID=42751439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013501914A Active JP5764650B2 (ja) | 2010-03-31 | 2011-03-30 | 金属電着浴の効率を制御するための装置および方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20130008797A1 (de) |
| EP (1) | EP2553148B1 (de) |
| JP (1) | JP5764650B2 (de) |
| CN (1) | CN102822393B (de) |
| BR (1) | BR112012024387A2 (de) |
| CA (1) | CA2794579A1 (de) |
| FR (1) | FR2958300B1 (de) |
| RU (1) | RU2553161C2 (de) |
| WO (1) | WO2011121240A1 (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020012144A (ja) * | 2018-07-17 | 2020-01-23 | 株式会社ファシリティ | 電解処理装置 |
| JP7576490B2 (ja) | 2021-03-03 | 2024-10-31 | Tdk株式会社 | 電子部品の製造方法、及び、電子部品の製造装置 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2149344A (en) * | 1935-03-22 | 1939-03-07 | Du Pont | Apparatus and process for the study of plating solutions |
| FR863312A (fr) * | 1939-02-20 | 1941-03-29 | Procédé et appareil pour le dépôt électrolytique d'alliages d'étain | |
| SU127339A1 (ru) * | 1953-04-02 | 1959-11-30 | М.А. Гинцбург | Линейный ускоритель элементарных частиц и ионов |
| US3132080A (en) * | 1960-10-26 | 1964-05-05 | Thompson Ramo Wooldridge Inc | Electroplating method and apparatus |
| US3470082A (en) * | 1965-09-22 | 1969-09-30 | Louis W Raymond | Electroplating method and system |
| DE2537256C3 (de) * | 1975-08-21 | 1979-05-17 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Vorrichtung zum galvanischen Abscheiden von Aluminium |
| JPS5954568U (ja) * | 1982-09-30 | 1984-04-10 | 富士通株式会社 | 電着めつき装置 |
| SU1108130A1 (ru) * | 1983-04-15 | 1984-08-15 | Предприятие П/Я Г-4733 | Устройство дл контрол травильной способности растворов |
| US4721551A (en) * | 1986-11-06 | 1988-01-26 | The Regents Of The University Of California | Iridium treatment of neuro-stimulating electrodes |
| JPS63138246A (ja) * | 1986-11-29 | 1988-06-10 | Oki Electric Ind Co Ltd | メツキ液撹拌状態試験方法 |
| GB8821005D0 (en) * | 1988-09-07 | 1988-10-05 | Johnson Matthey Plc | Improvements in plating |
| JPH0737680B2 (ja) * | 1990-07-09 | 1995-04-26 | 株式会社アルメックス | 給電方法 |
| JPH04114566A (ja) * | 1990-09-04 | 1992-04-15 | Sharp Corp | テレビドアホン装置 |
| JPH04114566U (ja) * | 1991-03-20 | 1992-10-08 | アイシン精機株式会社 | メツキ処理装置 |
| JPH0741998A (ja) * | 1993-07-29 | 1995-02-10 | Kawasaki Steel Corp | 鉄系電気めっき方法 |
| US7153410B2 (en) * | 2000-08-30 | 2006-12-26 | Micron Technology, Inc. | Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| US6582570B2 (en) * | 2001-02-06 | 2003-06-24 | Danny Wu | Electroplating apparatus for wheel disk |
| US20040168925A1 (en) * | 2002-10-09 | 2004-09-02 | Uziel Landau | Electrochemical system for analyzing performance and properties of electrolytic solutions |
| JP2004149872A (ja) * | 2002-10-31 | 2004-05-27 | Renesas Technology Corp | メッキ処理装置およびメッキ処理方法 |
| DE10323638B4 (de) * | 2003-05-26 | 2006-11-23 | Robert Bosch Gmbh | Verfahren und Vorrichtung zur Entwicklung einer elektrochemischen Messanordnung |
| DE102004056158B3 (de) * | 2004-11-17 | 2006-03-30 | Siemens Ag | Verfahren zum Überwachen eines elektrochemischen Behandlungsprozesses und für dieses Verfahren geeignete Elektrodenanordnung |
| US20060289299A1 (en) * | 2005-06-22 | 2006-12-28 | 3M Innovative Properties Company | Multi-channel current probe |
| CN101502106A (zh) * | 2005-10-24 | 2009-08-05 | Nxp股份有限公司 | 运动矢量场重定时器 |
| JP2007262433A (ja) * | 2006-03-27 | 2007-10-11 | Teikoku Ion Kk | クロムめっき用ハイブリッド電極、それを用いたクロムメッキ方法及びクロムめっき装置 |
| JP5110269B2 (ja) * | 2007-08-09 | 2012-12-26 | 上村工業株式会社 | 電気銅めっき方法 |
| JP4942580B2 (ja) * | 2007-08-20 | 2012-05-30 | 株式会社荏原製作所 | アノードホルダ用通電ベルトおよびアノードホルダ |
| JP5293276B2 (ja) * | 2008-03-11 | 2013-09-18 | 上村工業株式会社 | 連続電気銅めっき方法 |
| US8062496B2 (en) * | 2008-04-18 | 2011-11-22 | Integran Technologies Inc. | Electroplating method and apparatus |
| US8366884B2 (en) * | 2008-04-30 | 2013-02-05 | Alcatel Lucent | Plating apparatus with direct electrolyte distribution system |
| US7776741B2 (en) * | 2008-08-18 | 2010-08-17 | Novellus Systems, Inc. | Process for through silicon via filing |
-
2010
- 2010-03-31 FR FR1052373A patent/FR2958300B1/fr active Active
-
2011
- 2011-03-30 CA CA2794579A patent/CA2794579A1/fr not_active Abandoned
- 2011-03-30 JP JP2013501914A patent/JP5764650B2/ja active Active
- 2011-03-30 WO PCT/FR2011/050715 patent/WO2011121240A1/fr active Application Filing
- 2011-03-30 US US13/637,854 patent/US20130008797A1/en not_active Abandoned
- 2011-03-30 BR BR112012024387A patent/BR112012024387A2/pt not_active IP Right Cessation
- 2011-03-30 CN CN201180016583.1A patent/CN102822393B/zh active Active
- 2011-03-30 EP EP11717696.6A patent/EP2553148B1/de active Active
- 2011-03-30 RU RU2012145547/02A patent/RU2553161C2/ru active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7098606B2 (ja) | ワークピース上に積層コーティングを提供するためのプロセス、およびそれから製造される物品 | |
| JP5238083B2 (ja) | 耐食性評価装置 | |
| Golubkov et al. | Automation of the micro-arc oxidation process | |
| JPS60187856A (ja) | 金属めつき浴中の金属イオン濃度を監視する方法 | |
| KR20110082545A (ko) | 금속 코팅 검사 방법 및 상기 금속 코팅의 증착을 실행하는 증착 전해질의 분석 제어 방법 | |
| JP5764650B2 (ja) | 金属電着浴の効率を制御するための装置および方法 | |
| JP2014505242A (ja) | 耐食性評価装置 | |
| JP2015206794A (ja) | 電気めっき浴分析 | |
| JP2013524011A5 (de) | ||
| Mariani et al. | A systematic study of pulse and pulse reverse plating on acid copper bath for decorative and functional applications | |
| JP2014500516A (ja) | 耐食性評価装置 | |
| WO2015137400A1 (ja) | 電気銅めっき液分析装置、及び電気銅めっき液分析方法 | |
| WO2005033655A2 (en) | Electrode assembly for analysis of metal electroplating solutions | |
| US7022212B2 (en) | Micro structured electrode and method for monitoring wafer electroplating baths | |
| JPS63138246A (ja) | メツキ液撹拌状態試験方法 | |
| Seleim et al. | Electroplating in steel in presence of isopropanol-water mixture | |
| US5425870A (en) | Multipurpose electrolytic meter | |
| RU129248U1 (ru) | Установка для определения площади отслаивания защитных покрытий при катодной поляризации | |
| JP6011874B2 (ja) | めっき液に含まれる抑制剤の評価方法 | |
| Tan et al. | Characterising nonuniform electrodeposition and electrodissolution using the novel wire beam electrode method | |
| EP0583057A1 (de) | Verfahren und Vorrichtung zum Messen des Streuvermögens eines Abscheidungselektrolyten mittels einer Drehelektrode | |
| JP2006022379A (ja) | 電解めっき装置 | |
| US20130331296A1 (en) | Method and System for Combinatorial Electroplating and Characterization | |
| RU92533U1 (ru) | Устройство для определения остаточных напряжений в пористых материалах и покрытиях | |
| Dibari | Evaluation of a simple, thin-film ductility tester & review of the ductility of nickel sulfamate deposits |