JP2013523957A5 - - Google Patents
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- JP2013523957A5 JP2013523957A5 JP2013502673A JP2013502673A JP2013523957A5 JP 2013523957 A5 JP2013523957 A5 JP 2013523957A5 JP 2013502673 A JP2013502673 A JP 2013502673A JP 2013502673 A JP2013502673 A JP 2013502673A JP 2013523957 A5 JP2013523957 A5 JP 2013523957A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- curable epoxy
- item
- composition according
- items
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000203 mixture Substances 0.000 claims description 21
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 125000003262 carboxylic acid ester group Chemical group [H]C([H])([*:2])OC(=O)C([H])([H])[*:1] 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 3
- 125000001033 ether group Chemical group 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 18
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000000805 composite resin Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 2
- 229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- -1 phosphate ester Chemical class 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000962 poly(amidoamine) Polymers 0.000 description 1
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1005444.3 | 2010-03-31 | ||
GB201005444A GB201005444D0 (en) | 2010-03-31 | 2010-03-31 | Epoxy adhesive compositions comprising an adhesion promoter |
PCT/US2011/029979 WO2011123356A2 (en) | 2010-03-31 | 2011-03-25 | Epoxy adhesive compositions comprising an adhesion promoter |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013523957A JP2013523957A (ja) | 2013-06-17 |
JP2013523957A5 true JP2013523957A5 (US20080242721A1-20081002-C00053.png) | 2014-03-27 |
JP5778754B2 JP5778754B2 (ja) | 2015-09-16 |
Family
ID=42228698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013502673A Active JP5778754B2 (ja) | 2010-03-31 | 2011-03-25 | 硬化促進剤を含有するエポキシ接着剤組成物 |
Country Status (12)
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6107660B2 (ja) * | 2010-11-30 | 2017-04-05 | 艾達索高新材料蕪湖有限公司 | 再加工可能なエポキシ樹脂のための新規薬剤 |
EP2828321B1 (en) * | 2012-03-23 | 2016-04-27 | Dow Global Technologies LLC | Flame retardant structural epoxy resin adhesives and process for bonding metal members |
US8785694B2 (en) | 2012-06-05 | 2014-07-22 | Connora Technologies, Inc | Processes for the preparation of di-(2-aminoethyl) formal, di-(3-aminopropyl) formal, and related molecules |
MX2015003250A (es) * | 2012-09-17 | 2015-06-10 | 3M Innovative Properties Co | Composiciones de revestimiento de epoxi liquido, metodos y articulos. |
CN103146334B (zh) * | 2013-03-29 | 2014-08-20 | 黑龙江省科学院石油化学研究院 | 一种阻燃型的中温固化环氧胶膜及其制备方法 |
US20160087250A1 (en) * | 2013-05-13 | 2016-03-24 | Heesung Chemical Ltd. | Aluminium pouch film for secondary battery, packaging material comprising same, secondary battery comprising same, and manufacturing method therefor |
WO2015150848A1 (fr) | 2014-03-31 | 2015-10-08 | Arcelormittal Investigación Y Desarrollo Sl | Procede de fabrication a haute productivite de pieces d'acier revêtues et durcies a la presse |
KR101637714B1 (ko) * | 2014-10-31 | 2016-07-07 | 현대자동차주식회사 | 제진 실러용 충전제 및 이를 포함하는 에폭시계 제진 실러 조성물 |
DE102014226826A1 (de) * | 2014-12-22 | 2016-06-23 | Henkel Ag & Co. Kgaa | Epoxidharz-Zusammensetzung |
BR112017016240A2 (pt) * | 2015-01-30 | 2018-03-27 | Zephyros Inc | composição |
CN107207936A (zh) * | 2015-02-03 | 2017-09-26 | 泽菲罗斯有限公司 | 单组分环氧基组合物 |
CN112480370A (zh) | 2015-03-19 | 2021-03-12 | 泽费罗斯股份有限公司 | 用于高分子材料的酯化酸 |
DE102015219280A1 (de) * | 2015-10-06 | 2017-04-06 | Robert Bosch Gmbh | Batteriesystem mit Vergussmasse |
EP3162829B1 (en) * | 2015-10-29 | 2018-08-15 | 3M Innovative Properties Company | Rapid curing and high thixotropy epoxy adhesive compositions |
KR101762340B1 (ko) * | 2015-12-09 | 2017-07-27 | 주식회사 포스코 | 수지 조성물 및 이를 이용한 흑색 수지 강판, 및 그 제조방법 |
AT518457B1 (de) * | 2016-04-04 | 2018-03-15 | Constantia Teich Gmbh | Verpackungslaminat mit einer Trägerschicht und einer Polyolefinschicht |
CA3020356A1 (en) | 2016-04-15 | 2017-10-19 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | Improved resin-rich mica tape |
KR101755296B1 (ko) * | 2016-05-24 | 2017-07-07 | 한국화학연구원 | 에폭시 접착제 조성물 |
EP3275914B1 (en) * | 2016-07-29 | 2022-05-11 | 3M Innovative Properties Company | Flame retardant adhesive composition |
EP3275915B1 (en) * | 2016-07-29 | 2022-11-30 | 3M Innovative Properties Company | Non-halogeneous fast curing two-component epoxy adhesive with flame retardant properties |
EP3507316A1 (en) | 2016-08-31 | 2019-07-10 | 3M Innovative Properties Company | Halogen and polyhalide mediated phenolic polymerization |
DE102016220092A1 (de) * | 2016-10-14 | 2018-04-19 | Robert Bosch Gmbh | Halbzeug zur Kontaktierung von Bauteilen |
US20200058416A1 (en) | 2016-11-01 | 2020-02-20 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | Electrical Insulation System Based on Epoxy Resins for Generators and Motors |
KR20180079034A (ko) * | 2016-12-30 | 2018-07-10 | 주식회사 동진쎄미켐 | 발수코팅 조성물 및 이로 코팅된 발수코팅 기재 |
US10919839B2 (en) | 2017-07-11 | 2021-02-16 | Aditya Birla Chemicals (Usa) Llc | Silicon-containing compositions and their methods of use |
US10899109B2 (en) | 2019-03-11 | 2021-01-26 | Honda Motor Co., Ltd. | Multi-material joint and method of making thereof |
WO2021087238A1 (en) * | 2019-11-01 | 2021-05-06 | Cytec Industries Inc. | Primer composition for adhesive bonding and method of using the same |
CN115427529A (zh) * | 2020-04-15 | 2022-12-02 | 汉高股份有限及两合公司 | 两部分导热性环氧粘合剂组合物 |
TW202224929A (zh) * | 2020-12-25 | 2022-07-01 | 律勝科技股份有限公司 | 積層板及其製造方法 |
EP4137526A1 (en) * | 2021-08-17 | 2023-02-22 | ThreeBond Co., Ltd. | Thermally conductive resin composition |
WO2023194099A1 (en) * | 2022-04-08 | 2023-10-12 | Henkel Ag & Co. Kgaa | A two-part, room temperature curable heat and fire retardant composition |
Family Cites Families (26)
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US4223115A (en) * | 1978-04-24 | 1980-09-16 | Lord Corporation | Structural adhesive formulations |
JPS54160456A (en) * | 1978-06-08 | 1979-12-19 | Semedain Kk | Heat-curing epoxy resin composition partly curable with moisture |
US4315085A (en) | 1980-07-25 | 1982-02-09 | Gaf Corporation | Core-shell composite polymers having high amounts of carboxylic acid units in the shell |
JPS63186786A (ja) * | 1987-01-29 | 1988-08-02 | Yokohama Rubber Co Ltd:The | 油面接着剤 |
JP2847311B2 (ja) * | 1989-03-23 | 1999-01-20 | 株式会社スリーボンド | セルフロッキング剤及び締め具 |
DE3930687A1 (de) * | 1989-09-14 | 1991-04-11 | Byk Chemie Gmbh | Phosphorsaeureester, verfahren zu deren herstellung und deren verwendung als dispergiermittel |
US5186993A (en) | 1991-10-11 | 1993-02-16 | Rohm And Haas Company | Polymer blends |
JP3020383B2 (ja) | 1993-05-24 | 2000-03-15 | 東芝セラミックス株式会社 | シリコン部材の接合方法およびシリコン接合構造体 |
GB9411791D0 (en) | 1994-06-13 | 1994-08-03 | Zeneca Ltd | Compound, preparation and use |
US5972423A (en) * | 1998-08-03 | 1999-10-26 | Lord Corporation | Primerless substrate repair with polyepoxide and polythiol |
US6313257B1 (en) * | 1999-03-23 | 2001-11-06 | Lord Corporation | Poly (mercaptopropylaryl) curatives |
US7108806B2 (en) * | 2003-02-28 | 2006-09-19 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability and good impact resistance for use in electronics devices |
JP4668788B2 (ja) | 2003-06-09 | 2011-04-13 | 株式会社カネカ | 変性エポキシ樹脂の製造方法 |
US20050137357A1 (en) * | 2003-12-18 | 2005-06-23 | Skoglund Michael J. | Epoxy adhesive composition method of preparing and using |
US7595416B2 (en) | 2004-03-08 | 2009-09-29 | Ciba Specialty Chemicals Corporation | Phosphoric acid esters and their use as wetting and dispersing agent |
CN101287794A (zh) * | 2005-08-24 | 2008-10-15 | 亨克尔两合股份公司 | 具有改进的耐冲击性的环氧组合物 |
US7981977B2 (en) * | 2005-12-08 | 2011-07-19 | Hitachi Chemical Co., Ltd. | Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler |
US20070293603A1 (en) * | 2006-06-19 | 2007-12-20 | Ashland Licensing And Intellectual Property Llc | Epoxy adhesive composition and use thereof |
EP2044138A1 (en) * | 2006-07-20 | 2009-04-08 | ABB Research Ltd | Hardenable epoxy resin composition |
EP2049611B1 (en) * | 2006-07-31 | 2018-09-05 | Henkel AG & Co. KGaA | Curable epoxy resin-based adhesive compositions |
JP5263705B2 (ja) * | 2007-02-07 | 2013-08-14 | 三菱瓦斯化学株式会社 | プリプレグ及び積層板 |
JP2009007424A (ja) * | 2007-06-27 | 2009-01-15 | Shin Etsu Chem Co Ltd | 接着剤組成物、並びにそれを用いた接着シート及びカバーレイフィルム |
EP2128210B1 (de) | 2008-05-28 | 2013-09-04 | Sika Technology AG | Epoxidharz enthaltende Haftvermittlerzusammensetzung |
WO2010011705A1 (en) * | 2008-07-23 | 2010-01-28 | 3M Innovative Properties Company | Two-part epoxy-based structural adhesives |
KR20120044969A (ko) * | 2009-07-10 | 2012-05-08 | 다우 글로벌 테크놀로지스 엘엘씨 | 전기 라미네이트 조성물에 사용하기 위한 코어/쉘 고무 |
WO2011031429A1 (en) * | 2009-09-11 | 2011-03-17 | 3M Innovative Properties Company | Curable and cured adhesive compositions |
-
2010
- 2010-03-31 GB GB201005444A patent/GB201005444D0/en not_active Ceased
-
2011
- 2011-03-25 EP EP11713132.6A patent/EP2552992B1/en active Active
- 2011-03-25 KR KR1020127027845A patent/KR101798680B1/ko active IP Right Grant
- 2011-03-25 CN CN201710264612.5A patent/CN107267099A/zh active Pending
- 2011-03-25 CA CA2794528A patent/CA2794528C/en not_active Expired - Fee Related
- 2011-03-25 ES ES11713132.6T patent/ES2629880T3/es active Active
- 2011-03-25 WO PCT/US2011/029979 patent/WO2011123356A2/en active Application Filing
- 2011-03-25 JP JP2013502673A patent/JP5778754B2/ja active Active
- 2011-03-25 CN CN2011800167343A patent/CN102822229A/zh active Pending
- 2011-03-25 BR BR112012025067A patent/BR112012025067A2/pt not_active Application Discontinuation
- 2011-03-25 PL PL11713132T patent/PL2552992T3/pl unknown
- 2011-03-25 PT PT117131326T patent/PT2552992T/pt unknown
- 2011-03-25 US US13/072,278 patent/US20110244245A1/en not_active Abandoned
-
2014
- 2014-09-12 US US14/485,254 patent/US20150004396A1/en not_active Abandoned
-
2016
- 2016-10-27 US US15/335,813 patent/US10106711B2/en active Active
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