JP2013516768A5 - - Google Patents

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Publication number
JP2013516768A5
JP2013516768A5 JP2012547231A JP2012547231A JP2013516768A5 JP 2013516768 A5 JP2013516768 A5 JP 2013516768A5 JP 2012547231 A JP2012547231 A JP 2012547231A JP 2012547231 A JP2012547231 A JP 2012547231A JP 2013516768 A5 JP2013516768 A5 JP 2013516768A5
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JP
Japan
Prior art keywords
main surface
polishing
polishing pad
polymer phase
polymer
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JP2012547231A
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English (en)
Japanese (ja)
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JP6004941B2 (ja
JP2013516768A (ja
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Priority claimed from PCT/US2010/062204 external-priority patent/WO2011082155A2/en
Publication of JP2013516768A publication Critical patent/JP2013516768A/ja
Publication of JP2013516768A5 publication Critical patent/JP2013516768A5/ja
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JP2012547231A 2009-12-30 2010-12-28 相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法 Active JP6004941B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29117609P 2009-12-30 2009-12-30
US61/291,176 2009-12-30
PCT/US2010/062204 WO2011082155A2 (en) 2009-12-30 2010-12-28 Polishing pads including phase-separated polymer blend and method of making and using the same

Publications (3)

Publication Number Publication Date
JP2013516768A JP2013516768A (ja) 2013-05-13
JP2013516768A5 true JP2013516768A5 (cg-RX-API-DMAC7.html) 2014-02-06
JP6004941B2 JP6004941B2 (ja) 2016-10-12

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JP2012547231A Active JP6004941B2 (ja) 2009-12-30 2010-12-28 相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法

Country Status (7)

Country Link
US (1) US9162340B2 (cg-RX-API-DMAC7.html)
JP (1) JP6004941B2 (cg-RX-API-DMAC7.html)
KR (1) KR20120125612A (cg-RX-API-DMAC7.html)
CN (1) CN102686362A (cg-RX-API-DMAC7.html)
SG (1) SG181678A1 (cg-RX-API-DMAC7.html)
TW (1) TWI552832B (cg-RX-API-DMAC7.html)
WO (1) WO2011082155A2 (cg-RX-API-DMAC7.html)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415711B (zh) * 2008-07-18 2013-11-21 3M Innovative Properties Co 具有浮動元件之研磨墊，及其製造與使用方法
US9554888B2 (en) * 2010-04-20 2017-01-31 University Of Utah Research Foundation Phase separation sprayed scaffold
US10022842B2 (en) * 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
WO2013151946A1 (en) 2012-04-02 2013-10-10 Thomas West Inc. Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods
US10722997B2 (en) * 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
US10252396B2 (en) 2014-04-03 2019-04-09 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
CN106575613B (zh) * 2014-05-07 2019-12-17 嘉柏微电子材料股份公司 用于化学机械抛光的多层抛光垫
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
TWI689406B (zh) 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10556316B2 (en) 2015-05-13 2020-02-11 3M Innovative Properties Company Polishing pads and systems for and methods of using same
KR101600393B1 (ko) * 2015-05-20 2016-03-07 에프엔에스테크 주식회사 연마 패드 및 이의 제조 방법
TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
CN108136568B (zh) * 2015-10-16 2020-10-09 应用材料公司 使用增材制造工艺形成先进抛光垫的方法和设备
US10618141B2 (en) 2015-10-30 2020-04-14 Applied Materials, Inc. Apparatus for forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
WO2017127221A1 (en) 2016-01-19 2017-07-27 Applied Materials, Inc. Porous chemical mechanical polishing pads
WO2017155969A1 (en) 2016-03-09 2017-09-14 Applied Materials, Inc. Pad structure and fabrication methods
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
CN111032284B (zh) * 2017-08-04 2022-11-04 3M创新有限公司 具有增强的共平面性的微复制型抛光表面
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN107866756B (zh) * 2017-12-05 2019-03-19 长沙理工大学 一种有序微槽结构多层超硬磨料电镀砂轮的制备方法
CN111684571A (zh) 2018-02-05 2020-09-18 应用材料公司 用于3d打印的cmp垫的压电终点指示
WO2019217012A1 (en) 2018-05-07 2019-11-14 Applied Materials, Inc. Hydrophilic and zeta potential tunable chemical mechanical polishing pads
WO2020006502A1 (en) * 2018-06-29 2020-01-02 Saint-Gobain Abrasives, Inc. Abrasive articles and methods for forming same
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
CN110776724B (zh) * 2019-10-23 2022-02-25 青岛科技大学 一种功能性弹性发泡材料及其制备方法和应用
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
WO2022014978A1 (ko) * 2020-07-16 2022-01-20 한국생산기술연구원 연마 패드, 이를 포함하는 연마 장치, 그리고 연마 패드의 제조 방법
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN118290810B (zh) * 2024-06-05 2024-08-13 浙江新恒泰新材料股份有限公司 一种微孔发泡热塑性聚氨酯基材及其制备方法与应用

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5257478A (en) 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US5578098A (en) * 1990-10-09 1996-11-26 Minnesota Mining And Manufacturing Company Coated abrasive containing erodible agglomerates
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5489233A (en) 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5609517A (en) * 1995-11-20 1997-03-11 International Business Machines Corporation Composite polishing pad
JPH10156705A (ja) 1996-11-29 1998-06-16 Sumitomo Metal Ind Ltd 研磨装置および研磨方法
US6126532A (en) 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
JP4293480B2 (ja) 1999-01-12 2009-07-08 東洋ゴム工業株式会社 研磨パッドの製造方法
US6641463B1 (en) 1999-02-06 2003-11-04 Beaver Creek Concepts Inc Finishing components and elements
US6238592B1 (en) 1999-03-10 2001-05-29 3M Innovative Properties Company Working liquids and methods for modifying structured wafers suited for semiconductor fabrication
JP2000263423A (ja) 1999-03-16 2000-09-26 Toray Ind Inc 研磨パッドおよび研磨装置
US6491843B1 (en) 1999-12-08 2002-12-10 Eastman Kodak Company Slurry for chemical mechanical polishing silicon dioxide
US20020068516A1 (en) 1999-12-13 2002-06-06 Applied Materials, Inc Apparatus and method for controlled delivery of slurry to a region of a polishing device
US6702954B1 (en) 2000-10-19 2004-03-09 Ferro Corporation Chemical-mechanical polishing slurry and method
US20020072296A1 (en) 2000-11-29 2002-06-13 Muilenburg Michael J. Abrasive article having a window system for polishing wafers, and methods
JP3804064B2 (ja) 2001-12-04 2006-08-02 株式会社東京精密 ウェーハ研磨装置の研磨終点検出方法及び装置
JP2003136397A (ja) 2001-11-01 2003-05-14 Roki Techno Co Ltd 研磨パッド
US6722946B2 (en) 2002-01-17 2004-04-20 Nutool, Inc. Advanced chemical mechanical polishing system with smart endpoint detection
JP2003318140A (ja) * 2002-04-26 2003-11-07 Applied Materials Inc 研磨方法及び装置
US20050194681A1 (en) 2002-05-07 2005-09-08 Yongqi Hu Conductive pad with high abrasion
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US20040171339A1 (en) 2002-10-28 2004-09-02 Cabot Microelectronics Corporation Microporous polishing pads
KR100465649B1 (ko) * 2002-09-17 2005-01-13 한국포리올 주식회사 일체형 연마 패드 및 그 제조 방법
JP2004160573A (ja) 2002-11-11 2004-06-10 Ebara Corp 研磨装置
US6908366B2 (en) 2003-01-10 2005-06-21 3M Innovative Properties Company Method of using a soft subpad for chemical mechanical polishing
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
WO2005002794A2 (en) 2003-07-01 2005-01-13 Applied Materials, Inc. Cell, system and article for electrochemical mechanical processing (ecmp)
JP2007081322A (ja) 2005-09-16 2007-03-29 Jsr Corp 化学機械研磨パッドの製造方法
JP4697399B2 (ja) 2004-06-11 2011-06-08 Ｊｓｒ株式会社 化学機械研磨パッド及び化学機械研磨方法
US20060258276A1 (en) 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7523440B2 (en) 2004-11-16 2009-04-21 The Mathworks, Inc. Dynamic generation of formatted user interfaces in software environments
JP2006142439A (ja) 2004-11-22 2006-06-08 Sumitomo Bakelite Co Ltd 研磨パッドおよびこれを用いた研磨方法
WO2006057714A2 (en) 2004-11-29 2006-06-01 Rajeev Bajaj Method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
US7846008B2 (en) * 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
US20080318505A1 (en) * 2004-11-29 2008-12-25 Rajeev Bajaj Chemical mechanical planarization pad and method of use thereof
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
US7267610B1 (en) 2006-08-30 2007-09-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having unevenly spaced grooves
US20090062414A1 (en) * 2007-08-28 2009-03-05 David Picheng Huang System and method for producing damping polyurethane CMP pads
WO2009032768A2 (en) 2007-09-03 2009-03-12 Semiquest, Inc. Polishing pad
KR101618273B1 (ko) 2008-04-29 2016-05-04 세미퀘스트, 인코포레이티드 연마 패드 조성물, 및 이의 제조 방법 및 용도
TWI387508B (zh) 2008-05-15 2013-03-01 3M Innovative Properties Co 具有終點窗孔之拋光墊及使用其之系統及方法
WO2009158665A1 (en) 2008-06-26 2009-12-30 3M Innovative Properties Company Polishing pad with porous elements and method of making and using the same
TWI415711B (zh) * 2008-07-18 2013-11-21 3M Innovative Properties Co 具有浮動元件之研磨墊，及其製造與使用方法

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