TWI552832B - 包含相分離聚合物摻合物之拋光墊及其製造及使用方法 - Google Patents
包含相分離聚合物摻合物之拋光墊及其製造及使用方法 Download PDFInfo
- Publication number
- TWI552832B TWI552832B TW099146701A TW99146701A TWI552832B TW I552832 B TWI552832 B TW I552832B TW 099146701 A TW099146701 A TW 099146701A TW 99146701 A TW99146701 A TW 99146701A TW I552832 B TWI552832 B TW I552832B
- Authority
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- Prior art keywords
- polishing
- elements
- polishing pad
- major side
- polymer
- Prior art date
Links
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- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 10
- 229920000098 polyolefin Polymers 0.000 claims description 7
- 229920001169 thermoplastic Polymers 0.000 claims description 7
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- 244000043261 Hevea brasiliensis Species 0.000 claims description 4
- 229920002125 Sokalan® Polymers 0.000 claims description 4
- 229920003052 natural elastomer Polymers 0.000 claims description 4
- 229920001194 natural rubber Polymers 0.000 claims description 4
- 239000004584 polyacrylic acid Substances 0.000 claims description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
- 229920002845 Poly(methacrylic acid) Polymers 0.000 claims description 3
- 125000004122 cyclic group Chemical group 0.000 claims description 2
- 229920001973 fluoroelastomer Polymers 0.000 claims description 2
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- 229920003051 synthetic elastomer Polymers 0.000 claims description 2
- 239000005061 synthetic rubber Substances 0.000 claims description 2
- 229920003169 water-soluble polymer Polymers 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
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- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
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- 229910052782 aluminium Inorganic materials 0.000 description 2
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29117609P | 2009-12-30 | 2009-12-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201136710A TW201136710A (en) | 2011-11-01 |
| TWI552832B true TWI552832B (zh) | 2016-10-11 |
Family
ID=44227135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099146701A TWI552832B (zh) | 2009-12-30 | 2010-12-29 | 包含相分離聚合物摻合物之拋光墊及其製造及使用方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9162340B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6004941B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20120125612A (cg-RX-API-DMAC7.html) |
| CN (1) | CN102686362A (cg-RX-API-DMAC7.html) |
| SG (1) | SG181678A1 (cg-RX-API-DMAC7.html) |
| TW (1) | TWI552832B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2011082155A2 (cg-RX-API-DMAC7.html) |
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| TWI415711B (zh) * | 2008-07-18 | 2013-11-21 | 3M Innovative Properties Co | 具有浮動元件之研磨墊，及其製造與使用方法 |
| US9554888B2 (en) * | 2010-04-20 | 2017-01-31 | University Of Utah Research Foundation | Phase separation sprayed scaffold |
| US10022842B2 (en) * | 2012-04-02 | 2018-07-17 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
| WO2013151946A1 (en) | 2012-04-02 | 2013-10-10 | Thomas West Inc. | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods |
| US10722997B2 (en) * | 2012-04-02 | 2020-07-28 | Thomas West, Inc. | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads |
| US10252396B2 (en) | 2014-04-03 | 2019-04-09 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
| CN106575613B (zh) * | 2014-05-07 | 2019-12-17 | 嘉柏微电子材料股份公司 | 用于化学机械抛光的多层抛光垫 |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| TWI689406B (zh) | 2014-10-17 | 2020-04-01 | 美商應用材料股份有限公司 | 研磨墊及製造其之方法 |
| SG11201703114QA (en) | 2014-10-17 | 2017-06-29 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US10556316B2 (en) | 2015-05-13 | 2020-02-11 | 3M Innovative Properties Company | Polishing pads and systems for and methods of using same |
| KR101600393B1 (ko) * | 2015-05-20 | 2016-03-07 | 에프엔에스테크 주식회사 | 연마 패드 및 이의 제조 방법 |
| TWI769988B (zh) * | 2015-10-07 | 2022-07-11 | 美商3M新設資產公司 | 拋光墊與系統及其製造與使用方法 |
| CN108136568B (zh) * | 2015-10-16 | 2020-10-09 | 应用材料公司 | 使用增材制造工艺形成先进抛光垫的方法和设备 |
| US10618141B2 (en) | 2015-10-30 | 2020-04-14 | Applied Materials, Inc. | Apparatus for forming a polishing article that has a desired zeta potential |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| WO2017127221A1 (en) | 2016-01-19 | 2017-07-27 | Applied Materials, Inc. | Porous chemical mechanical polishing pads |
| WO2017155969A1 (en) | 2016-03-09 | 2017-09-14 | Applied Materials, Inc. | Pad structure and fabrication methods |
| US10596763B2 (en) | 2017-04-21 | 2020-03-24 | Applied Materials, Inc. | Additive manufacturing with array of energy sources |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| CN111032284B (zh) * | 2017-08-04 | 2022-11-04 | 3M创新有限公司 | 具有增强的共平面性的微复制型抛光表面 |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| CN107866756B (zh) * | 2017-12-05 | 2019-03-19 | 长沙理工大学 | 一种有序微槽结构多层超硬磨料电镀砂轮的制备方法 |
| CN111684571A (zh) | 2018-02-05 | 2020-09-18 | 应用材料公司 | 用于3d打印的cmp垫的压电终点指示 |
| WO2019217012A1 (en) | 2018-05-07 | 2019-11-14 | Applied Materials, Inc. | Hydrophilic and zeta potential tunable chemical mechanical polishing pads |
| WO2020006502A1 (en) * | 2018-06-29 | 2020-01-02 | Saint-Gobain Abrasives, Inc. | Abrasive articles and methods for forming same |
| CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
| US11331767B2 (en) | 2019-02-01 | 2022-05-17 | Micron Technology, Inc. | Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods |
| US11851570B2 (en) | 2019-04-12 | 2023-12-26 | Applied Materials, Inc. | Anionic polishing pads formed by printing processes |
| CN110776724B (zh) * | 2019-10-23 | 2022-02-25 | 青岛科技大学 | 一种功能性弹性发泡材料及其制备方法和应用 |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| WO2022014978A1 (ko) * | 2020-07-16 | 2022-01-20 | 한국생산기술연구원 | 연마 패드, 이를 포함하는 연마 장치, 그리고 연마 패드의 제조 방법 |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| CN118290810B (zh) * | 2024-06-05 | 2024-08-13 | 浙江新恒泰新材料股份有限公司 | 一种微孔发泡热塑性聚氨酯基材及其制备方法与应用 |
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2010
- 2010-12-28 KR KR1020127019847A patent/KR20120125612A/ko not_active Ceased
- 2010-12-28 US US13/514,741 patent/US9162340B2/en active Active
- 2010-12-28 CN CN2010800603140A patent/CN102686362A/zh active Pending
- 2010-12-28 JP JP2012547231A patent/JP6004941B2/ja active Active
- 2010-12-28 SG SG2012043568A patent/SG181678A1/en unknown
- 2010-12-28 WO PCT/US2010/062204 patent/WO2011082155A2/en not_active Ceased
- 2010-12-29 TW TW099146701A patent/TWI552832B/zh not_active IP Right Cessation
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6004941B2 (ja) | 2016-10-12 |
| WO2011082155A3 (en) | 2011-11-17 |
| TW201136710A (en) | 2011-11-01 |
| KR20120125612A (ko) | 2012-11-16 |
| CN102686362A (zh) | 2012-09-19 |
| SG181678A1 (en) | 2012-07-30 |
| US20120315830A1 (en) | 2012-12-13 |
| US9162340B2 (en) | 2015-10-20 |
| JP2013516768A (ja) | 2013-05-13 |
| WO2011082155A2 (en) | 2011-07-07 |
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