JP2013516764A5 - - Google Patents

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Publication number
JP2013516764A5
JP2013516764A5 JP2012547120A JP2012547120A JP2013516764A5 JP 2013516764 A5 JP2013516764 A5 JP 2013516764A5 JP 2012547120 A JP2012547120 A JP 2012547120A JP 2012547120 A JP2012547120 A JP 2012547120A JP 2013516764 A5 JP2013516764 A5 JP 2013516764A5
Authority
JP
Japan
Prior art keywords
transfer layer
substrate
structured mold
mold
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012547120A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013516764A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2010/061195 external-priority patent/WO2011090641A2/en
Publication of JP2013516764A publication Critical patent/JP2013516764A/ja
Publication of JP2013516764A5 publication Critical patent/JP2013516764A5/ja
Pending legal-status Critical Current

Links

JP2012547120A 2009-12-30 2010-12-20 マスクを使用してパターン化基板を提供する方法 Pending JP2013516764A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29105309P 2009-12-30 2009-12-30
US61/291,053 2009-12-30
PCT/US2010/061195 WO2011090641A2 (en) 2009-12-30 2010-12-20 Method of using a mask to provide a patterned substrate

Publications (2)

Publication Number Publication Date
JP2013516764A JP2013516764A (ja) 2013-05-13
JP2013516764A5 true JP2013516764A5 (enExample) 2014-01-09

Family

ID=44307459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012547120A Pending JP2013516764A (ja) 2009-12-30 2010-12-20 マスクを使用してパターン化基板を提供する方法

Country Status (8)

Country Link
US (1) US20130068723A1 (enExample)
EP (1) EP2519964A2 (enExample)
JP (1) JP2013516764A (enExample)
KR (1) KR20120097413A (enExample)
CN (1) CN102687241A (enExample)
BR (1) BR112012016099A2 (enExample)
SG (1) SG181954A1 (enExample)
WO (1) WO2011090641A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10081174B2 (en) 2012-12-31 2018-09-25 3M Innovative Properties Company Re-inking roller for microcontact printing in a roll-to-roll process
WO2015069538A1 (en) * 2013-11-06 2015-05-14 3M Innovative Properties Company Microcontact printing stamps with functional features
JP2015159277A (ja) 2014-01-23 2015-09-03 パナソニック株式会社 電子デバイスの製造方法
EP3519894B1 (en) * 2016-09-27 2024-04-17 Illumina, Inc. Imprinted substrates
KR101851713B1 (ko) * 2017-06-20 2018-04-24 창원대학교 산학협력단 패턴의 제조방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5265535A (en) * 1991-12-28 1993-11-30 Kabushiki Kaisha Isowa Printing machine for corrugated board sheet
US6309580B1 (en) * 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US6680214B1 (en) * 1998-06-08 2004-01-20 Borealis Technical Limited Artificial band gap
NO311797B1 (no) * 1999-05-12 2002-01-28 Thin Film Electronics Asa Fremgangsmåter til mönstring av polymerfilmer og anvendelse av fremgangsmåtene
TWI298341B (enExample) * 2001-05-31 2008-07-01 Mitsubishi Rayon Co
GB0323295D0 (en) * 2003-10-04 2003-11-05 Dow Corning Deposition of thin films
JP2006156735A (ja) * 2004-11-30 2006-06-15 Nippon Telegr & Teleph Corp <Ntt> パターン形成方法及びモールド
US7374968B2 (en) * 2005-01-28 2008-05-20 Hewlett-Packard Development Company, L.P. Method of utilizing a contact printing stamp
JP4622626B2 (ja) * 2005-03-30 2011-02-02 凸版印刷株式会社 導電性パターンの形成方法
EP1892076A4 (en) * 2005-06-16 2012-08-29 Dainippon Printing Co Ltd PATTERN COPYING DEVICE, PATTERN COPYING METHOD AND PEELING ROLLER
EP2040115A1 (en) * 2006-07-12 2009-03-25 Konica Minolta Holdings, Inc. Electrochromic display device
BRPI0718766A2 (pt) * 2006-11-15 2014-01-21 3M Innovative Properties Co Impressão flexográfica com cura durante a transferência para o substrato
US8608972B2 (en) * 2006-12-05 2013-12-17 Nano Terra Inc. Method for patterning a surface
US20080230773A1 (en) * 2007-03-20 2008-09-25 Nano Terra Inc. Polymer Composition for Preparing Electronic Devices by Microcontact Printing Processes and Products Prepared by the Processes
JP4448868B2 (ja) * 2007-06-29 2010-04-14 株式会社日立産機システム インプリント用スタンパとその製造方法
JP5065880B2 (ja) * 2007-12-27 2012-11-07 株式会社日立産機システム 微細構造転写装置および微細構造転写方法
JP5033192B2 (ja) * 2008-09-30 2012-09-26 イビデン株式会社 多層プリント配線板、及び、多層プリント配線板の製造方法
CN101477304B (zh) * 2008-11-04 2011-08-17 南京大学 在复杂形状表面复制高分辨率纳米结构的压印方法

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