CN102687241A - 使用掩模提供图案化基底的方法 - Google Patents

使用掩模提供图案化基底的方法 Download PDF

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Publication number
CN102687241A
CN102687241A CN2010800602951A CN201080060295A CN102687241A CN 102687241 A CN102687241 A CN 102687241A CN 2010800602951 A CN2010800602951 A CN 2010800602951A CN 201080060295 A CN201080060295 A CN 201080060295A CN 102687241 A CN102687241 A CN 102687241A
Authority
CN
China
Prior art keywords
transfer layer
substrate
structuring
layer
instrument
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800602951A
Other languages
English (en)
Chinese (zh)
Inventor
马修·S·斯泰
米哈伊尔·L·佩库罗夫斯基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN102687241A publication Critical patent/CN102687241A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382—Contact thermal transfer or sublimation processes
    • B41M5/38207—Contact thermal transfer or sublimation processes characterised by aspects not provided for in groups B41M5/385 - B41M5/395
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1415—Applying catalyst after applying plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Laminated Bodies (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
CN2010800602951A 2009-12-30 2010-12-20 使用掩模提供图案化基底的方法 Pending CN102687241A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29105309P 2009-12-30 2009-12-30
US61/291,053 2009-12-30
PCT/US2010/061195 WO2011090641A2 (en) 2009-12-30 2010-12-20 Method of using a mask to provide a patterned substrate

Publications (1)

Publication Number Publication Date
CN102687241A true CN102687241A (zh) 2012-09-19

Family

ID=44307459

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800602951A Pending CN102687241A (zh) 2009-12-30 2010-12-20 使用掩模提供图案化基底的方法

Country Status (8)

Country Link
US (1) US20130068723A1 (enExample)
EP (1) EP2519964A2 (enExample)
JP (1) JP2013516764A (enExample)
KR (1) KR20120097413A (enExample)
CN (1) CN102687241A (enExample)
BR (1) BR112012016099A2 (enExample)
SG (1) SG181954A1 (enExample)
WO (1) WO2011090641A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10081174B2 (en) 2012-12-31 2018-09-25 3M Innovative Properties Company Re-inking roller for microcontact printing in a roll-to-roll process
WO2015069538A1 (en) * 2013-11-06 2015-05-14 3M Innovative Properties Company Microcontact printing stamps with functional features
JP2015159277A (ja) 2014-01-23 2015-09-03 パナソニック株式会社 電子デバイスの製造方法
EP3519894B1 (en) * 2016-09-27 2024-04-17 Illumina, Inc. Imprinted substrates
KR101851713B1 (ko) * 2017-06-20 2018-04-24 창원대학교 산학협력단 패턴의 제조방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1309784A (zh) * 1998-06-30 2001-08-22 明尼苏达大学董事会 具有脱模剂的表面
US6680214B1 (en) * 1998-06-08 2004-01-20 Borealis Technical Limited Artificial band gap
US20080191371A1 (en) * 2005-06-16 2008-08-14 Tetsuya Matsuyama Pattern Copying Apparatus, Pattern Copying Method and Peeling Roller
US20090166914A1 (en) * 2007-12-27 2009-07-02 Hitachi Industrial Equipment Systems, Co., Ltd. Imprint apparatus and method for fine structure lithography
CN101477304A (zh) * 2008-11-04 2009-07-08 南京大学 在复杂形状表面复制高分辨率纳米结构的压印方法及其应用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5265535A (en) * 1991-12-28 1993-11-30 Kabushiki Kaisha Isowa Printing machine for corrugated board sheet
NO311797B1 (no) * 1999-05-12 2002-01-28 Thin Film Electronics Asa Fremgangsmåter til mönstring av polymerfilmer og anvendelse av fremgangsmåtene
TWI298341B (enExample) * 2001-05-31 2008-07-01 Mitsubishi Rayon Co
GB0323295D0 (en) * 2003-10-04 2003-11-05 Dow Corning Deposition of thin films
JP2006156735A (ja) * 2004-11-30 2006-06-15 Nippon Telegr & Teleph Corp <Ntt> パターン形成方法及びモールド
US7374968B2 (en) * 2005-01-28 2008-05-20 Hewlett-Packard Development Company, L.P. Method of utilizing a contact printing stamp
JP4622626B2 (ja) * 2005-03-30 2011-02-02 凸版印刷株式会社 導電性パターンの形成方法
EP2040115A1 (en) * 2006-07-12 2009-03-25 Konica Minolta Holdings, Inc. Electrochromic display device
BRPI0718766A2 (pt) * 2006-11-15 2014-01-21 3M Innovative Properties Co Impressão flexográfica com cura durante a transferência para o substrato
US8608972B2 (en) * 2006-12-05 2013-12-17 Nano Terra Inc. Method for patterning a surface
US20080230773A1 (en) * 2007-03-20 2008-09-25 Nano Terra Inc. Polymer Composition for Preparing Electronic Devices by Microcontact Printing Processes and Products Prepared by the Processes
JP4448868B2 (ja) * 2007-06-29 2010-04-14 株式会社日立産機システム インプリント用スタンパとその製造方法
JP5033192B2 (ja) * 2008-09-30 2012-09-26 イビデン株式会社 多層プリント配線板、及び、多層プリント配線板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6680214B1 (en) * 1998-06-08 2004-01-20 Borealis Technical Limited Artificial band gap
CN1309784A (zh) * 1998-06-30 2001-08-22 明尼苏达大学董事会 具有脱模剂的表面
US20080191371A1 (en) * 2005-06-16 2008-08-14 Tetsuya Matsuyama Pattern Copying Apparatus, Pattern Copying Method and Peeling Roller
US20090166914A1 (en) * 2007-12-27 2009-07-02 Hitachi Industrial Equipment Systems, Co., Ltd. Imprint apparatus and method for fine structure lithography
CN101477304A (zh) * 2008-11-04 2009-07-08 南京大学 在复杂形状表面复制高分辨率纳米结构的压印方法及其应用

Also Published As

Publication number Publication date
EP2519964A2 (en) 2012-11-07
BR112012016099A2 (pt) 2016-05-31
US20130068723A1 (en) 2013-03-21
KR20120097413A (ko) 2012-09-03
JP2013516764A (ja) 2013-05-13
SG181954A1 (en) 2012-07-30
WO2011090641A2 (en) 2011-07-28
WO2011090641A3 (en) 2011-09-22

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120919