JP2013516067A5 - - Google Patents

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Publication number
JP2013516067A5
JP2013516067A5 JP2012545943A JP2012545943A JP2013516067A5 JP 2013516067 A5 JP2013516067 A5 JP 2013516067A5 JP 2012545943 A JP2012545943 A JP 2012545943A JP 2012545943 A JP2012545943 A JP 2012545943A JP 2013516067 A5 JP2013516067 A5 JP 2013516067A5
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JP
Japan
Prior art keywords
processing
recipe
individual
laser
initial setting
Prior art date
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Application number
JP2012545943A
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English (en)
Japanese (ja)
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JP2013516067A (ja
JP5628935B2 (ja
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Priority claimed from US12/646,402 external-priority patent/US8461479B2/en
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Publication of JP2013516067A publication Critical patent/JP2013516067A/ja
Publication of JP2013516067A5 publication Critical patent/JP2013516067A5/ja
Application granted granted Critical
Publication of JP5628935B2 publication Critical patent/JP5628935B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012545943A 2009-12-23 2010-10-29 メモリ修正用の適応可能な処理制約 Expired - Fee Related JP5628935B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/646,402 US8461479B2 (en) 2009-12-23 2009-12-23 Adaptive processing constraints for memory repair
US12/646,402 2009-12-23
PCT/US2010/054633 WO2011087551A1 (en) 2009-12-23 2010-10-29 Adaptive processing constraints for memory repair

Publications (3)

Publication Number Publication Date
JP2013516067A JP2013516067A (ja) 2013-05-09
JP2013516067A5 true JP2013516067A5 (enExample) 2013-12-12
JP5628935B2 JP5628935B2 (ja) 2014-11-19

Family

ID=44149623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012545943A Expired - Fee Related JP5628935B2 (ja) 2009-12-23 2010-10-29 メモリ修正用の適応可能な処理制約

Country Status (6)

Country Link
US (1) US8461479B2 (enExample)
JP (1) JP5628935B2 (enExample)
KR (1) KR101630492B1 (enExample)
CN (1) CN102687263B (enExample)
TW (1) TWI511235B (enExample)
WO (1) WO2011087551A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI511820B (zh) * 2013-12-02 2015-12-11 Ardentec Corp 雷射製程機台的參數載入方法
TWI606531B (zh) * 2017-03-30 2017-11-21 義守大學 適用於三維晶片的缺陷測試方法及系統
CN111527348B (zh) * 2017-08-11 2023-03-07 布拉瓦家居公司 可配置的烹饪系统和方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5685995A (en) * 1994-11-22 1997-11-11 Electro Scientific Industries, Inc. Method for laser functional trimming of films and devices
DE10005618A1 (de) * 2000-02-09 2001-08-30 Infineon Technologies Ag Integrierter Halbleiterspeicher mit redundanter Einheit von Speicherzellen
DE10034062A1 (de) * 2000-07-13 2002-01-24 Infineon Technologies Ag Integrierter Halbleiterspeicher mit Speicherzellen in mehre-ren Speicherzellenfeldern und Verfahren zur Reparatur eines solchen Speichers
JP3774138B2 (ja) * 2000-11-13 2006-05-10 住友重機械工業株式会社 加工計画方法、装置、及び、加工方法、装置
US6591154B2 (en) 2000-12-15 2003-07-08 International Business Machines Corporation System and method for modifying enclosed areas for ion beam and laser beam bias effects
US7027155B2 (en) 2001-03-29 2006-04-11 Gsi Lumonics Corporation Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
JP2003266187A (ja) * 2002-03-12 2003-09-24 Sumitomo Heavy Ind Ltd 加工機の動作速度モデル化方法、装置、動作経路最適化方法、装置、及び、動作速度検定方法、装置
US7358157B2 (en) * 2002-03-27 2008-04-15 Gsi Group Corporation Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby
JP4281292B2 (ja) * 2002-04-23 2009-06-17 パナソニック電工株式会社 ３次元レーザ加工データ作成方法と同データ作成プログラム及び同データ作成プログラムを記録した媒体並びに同加工方法及び装置
US7119351B2 (en) * 2002-05-17 2006-10-10 Gsi Group Corporation Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
TW579525B (en) * 2002-05-30 2004-03-11 Samsung Electronics Co Ltd Semiconductor memory device post-repair circuit and method
JP2004142082A (ja) * 2002-10-28 2004-05-20 Sumitomo Heavy Ind Ltd 加工計画方法及び装置
US7085296B2 (en) * 2003-12-05 2006-08-01 Branson Ultrasonics Corporation Dual parameter laser optical feedback
US7687740B2 (en) 2004-06-18 2010-03-30 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
KR101257029B1 (ko) * 2004-06-18 2013-04-22 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 다중 레이저 빔 스폿을 이용하는 반도체 구조 가공
US8049135B2 (en) * 2004-06-18 2011-11-01 Electro Scientific Industries, Inc. Systems and methods for alignment of laser beam(s) for semiconductor link processing
DE502004001425D1 (de) 2004-07-08 2006-10-19 Trumpf Laser Gmbh & Co Kg Laserschweissverfahren und -vorrichtung
US8076605B2 (en) * 2007-06-25 2011-12-13 Electro Scientific Industries, Inc. Systems and methods for adapting parameters to increase throughput during laser-based wafer processing

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