JP2013508969A5 - - Google Patents
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- Publication number
- JP2013508969A5 JP2013508969A5 JP2012535203A JP2012535203A JP2013508969A5 JP 2013508969 A5 JP2013508969 A5 JP 2013508969A5 JP 2012535203 A JP2012535203 A JP 2012535203A JP 2012535203 A JP2012535203 A JP 2012535203A JP 2013508969 A5 JP2013508969 A5 JP 2013508969A5
- Authority
- JP
- Japan
- Prior art keywords
- axis
- conditioner
- brush box
- rollers
- cylindrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 244000185238 Lophostemon confertus Species 0.000 claims 18
- 230000003750 conditioning effect Effects 0.000 claims 7
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/603,771 | 2009-10-22 | ||
| US12/603,771 US8458843B2 (en) | 2009-10-22 | 2009-10-22 | Apparatus and methods for brush and pad conditioning |
| PCT/US2010/046599 WO2011049671A1 (en) | 2009-10-22 | 2010-08-25 | Apparatus and methods for brush and pad conditioning |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013508969A JP2013508969A (ja) | 2013-03-07 |
| JP2013508969A5 true JP2013508969A5 (enExample) | 2013-10-03 |
| JP5916617B2 JP5916617B2 (ja) | 2016-05-11 |
Family
ID=43897340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012535203A Active JP5916617B2 (ja) | 2009-10-22 | 2010-08-25 | ブラシコンディショニングおよびパッドコンディショニングのための装置および方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US8458843B2 (enExample) |
| JP (1) | JP5916617B2 (enExample) |
| TW (1) | TWI535529B (enExample) |
| WO (1) | WO2011049671A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8458843B2 (en) * | 2009-10-22 | 2013-06-11 | Applied Materials, Inc. | Apparatus and methods for brush and pad conditioning |
| US9646859B2 (en) * | 2010-04-30 | 2017-05-09 | Applied Materials, Inc. | Disk-brush cleaner module with fluid jet |
| US20130196572A1 (en) * | 2012-01-27 | 2013-08-01 | Sen-Hou Ko | Conditioning a pad in a cleaning module |
| CN102601736A (zh) * | 2012-03-22 | 2012-07-25 | 珠海镇东有限公司 | 一种背压辊、磨板机整刷系统及方法 |
| CN104289470B (zh) * | 2014-09-30 | 2017-11-14 | 重庆益新阳工贸有限公司 | 一种扫刷式纺织锭子超声波清洗机 |
| WO2018125821A1 (en) | 2016-12-30 | 2018-07-05 | Applied Materials, Inc. | Spray bar design for uniform liquid flow distribution on a substrate |
| US10410936B2 (en) * | 2017-05-19 | 2019-09-10 | Illinois Tool Works Inc. | Methods and apparatuses for effluent monitoring for brush conditioning |
| US11923208B2 (en) * | 2017-05-19 | 2024-03-05 | Illinois Tool Works Inc. | Methods and apparatuses for chemical delivery for brush conditioning |
| US10149135B1 (en) * | 2017-05-30 | 2018-12-04 | Illinois Tool Works Inc. | Methods and apparatuses for wireless communication with a brush |
| US10170343B1 (en) * | 2017-06-30 | 2019-01-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Post-CMP cleaning apparatus and method with brush self-cleaning function |
| CN107377441B (zh) * | 2017-07-31 | 2021-01-22 | 京东方科技集团股份有限公司 | 清洗装置、清洗设备及清洗方法 |
| CN108940939A (zh) * | 2018-06-14 | 2018-12-07 | 东莞市光纳光电科技有限公司 | 一种具备自清洁能力的指纹识别屏 |
| US11839907B2 (en) * | 2018-08-17 | 2023-12-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Breaking-in and cleaning method and apparatus for wafer-cleaning brush |
| NL2022059B1 (en) * | 2018-11-23 | 2020-06-09 | Gerald Jg Belemans | Cleaning device for a pair of spectacles having bar-shaped cleaning elements. |
| JP7161418B2 (ja) | 2019-01-30 | 2022-10-26 | 株式会社荏原製作所 | 基板洗浄装置、基板処理装置、洗浄部材のセルフクリーニング方法 |
| JP7274883B2 (ja) * | 2019-02-19 | 2023-05-17 | 株式会社荏原製作所 | 洗浄部材用洗浄装置及び基板処理装置 |
| JP7284514B2 (ja) * | 2020-05-11 | 2023-05-31 | アピックヤマダ株式会社 | 樹脂モールド装置及びクリーニング方法 |
| US12224186B2 (en) * | 2023-04-03 | 2025-02-11 | Applied Materials, Inc. | Apparatus and method of brush cleaning using periodic chemical treatments |
| JP7699871B1 (ja) * | 2024-09-19 | 2025-06-30 | 齊藤精機株式会社 | ワーク研削装置における研削ユニットの防液ボックス |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4514156Y1 (enExample) * | 1965-12-29 | 1970-06-15 | ||
| US5775983A (en) * | 1995-05-01 | 1998-07-07 | Applied Materials, Inc. | Apparatus and method for conditioning a chemical mechanical polishing pad |
| US5639311A (en) | 1995-06-07 | 1997-06-17 | International Business Machines Corporation | Method of cleaning brushes used in post CMP semiconductor wafer cleaning operations |
| US5745945A (en) * | 1996-06-28 | 1998-05-05 | International Business Machines Corporation | Brush conditioner for a semiconductor cleaning brush |
| JPH10323631A (ja) * | 1997-05-23 | 1998-12-08 | Ebara Corp | 洗浄部材のセルフクリーニング装置 |
| WO1999049995A1 (en) * | 1998-03-27 | 1999-10-07 | Rippey Corporation | A microcleaning process for sponge or porous polymeric products |
| US6158448A (en) | 1998-03-27 | 2000-12-12 | Rippey Corporation | System for cleaning sponge or porous polymeric products |
| JP2001054765A (ja) * | 1999-08-19 | 2001-02-27 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置 |
| US20020006767A1 (en) * | 1999-12-22 | 2002-01-17 | Applied Materials, Inc. | Ion exchange pad or brush and method of regenerating the same |
| US6328640B1 (en) | 2000-03-31 | 2001-12-11 | Lam Research Corporation | Wafer preparation apparatus including rotatable wafer preparation assemblies |
| DE60126254T2 (de) * | 2000-03-31 | 2007-10-25 | Lam Research Corp., Fremont | Vorrichtung zur wafervorbereitung |
| US20020115283A1 (en) * | 2001-02-20 | 2002-08-22 | Chartered Semiconductor Manufacturing Ltd. | Planarization by selective electro-dissolution |
| US6620029B2 (en) * | 2002-01-30 | 2003-09-16 | International Business Machines Corporation | Apparatus and method for front side chemical mechanical planarization (CMP) of semiconductor workpieces |
| JP2003311536A (ja) * | 2002-04-23 | 2003-11-05 | Sony Corp | 研磨装置及び研磨方法 |
| TWI324789B (en) | 2003-10-28 | 2010-05-11 | Applied Materials Inc | Scrubber box and methods for using the same |
| KR20070119823A (ko) | 2006-06-16 | 2007-12-21 | 삼성전자주식회사 | 웨이퍼 세정장치 |
| KR20080024579A (ko) | 2006-09-14 | 2008-03-19 | 삼성전자주식회사 | 반도체 소자 제조장비에서의 패드 컨디셔닝 장치 |
| JP4934644B2 (ja) * | 2007-06-25 | 2012-05-16 | 株式会社日立ハイテクノロジーズ | ディスク洗浄機構およびディスク洗浄装置 |
| TW200914202A (en) | 2007-09-19 | 2009-04-01 | Powerchip Semiconductor Corp | Polishing pad conditioner and method for conditioning polishing pad |
| US8795035B2 (en) * | 2008-06-26 | 2014-08-05 | Saint-Gobain Abrasives, Inc. | Chemical mechanical planarization pad conditioner and method of forming |
| US8458843B2 (en) * | 2009-10-22 | 2013-06-11 | Applied Materials, Inc. | Apparatus and methods for brush and pad conditioning |
| US20130196572A1 (en) * | 2012-01-27 | 2013-08-01 | Sen-Hou Ko | Conditioning a pad in a cleaning module |
-
2009
- 2009-10-22 US US12/603,771 patent/US8458843B2/en active Active
-
2010
- 2010-08-25 WO PCT/US2010/046599 patent/WO2011049671A1/en not_active Ceased
- 2010-08-25 JP JP2012535203A patent/JP5916617B2/ja active Active
- 2010-08-31 TW TW099129282A patent/TWI535529B/zh active
-
2013
- 2013-05-17 US US13/897,008 patent/US8813293B2/en active Active
-
2014
- 2014-08-26 US US14/469,188 patent/US20140360976A1/en not_active Abandoned
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