JP2013508969A - ブラシコンディショニングおよびパッドコンディショニングのための装置および方法 - Google Patents
ブラシコンディショニングおよびパッドコンディショニングのための装置および方法 Download PDFInfo
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
- B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
- B08B1/54—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using mechanical tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
- B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B13/00—Brushes with driven brush bodies or carriers
- A46B13/001—Cylindrical or annular brush bodies
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B2200/00—Brushes characterized by their functions, uses or applications
- A46B2200/30—Brushes for cleaning or polishing
- A46B2200/3093—Brush with abrasive properties, e.g. wire bristles
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (15)
- 内部容積を有するタンクと、
前記内部容積の外部に配置されたそれぞれの支持体部材に連結された1対の円柱状ローラであって、前記円柱状ローラの各々が、前記内部容積内に少なくとも部分的に配置され、それぞれの軸の周りを回転可能である、1対の円柱状ローラと、
前記円柱状ローラが互いに近接している第1の位置と前記円柱状ローラが互いに間隔を空けて離れている第2の位置との間で前記それぞれの円柱状ローラを移動させるために、前記円柱状ローラの各々に連結されたアクチュエータアセンブリと、
前記円柱状ローラの各々のためのコンディショニング装置であって、各コンディショニング装置が前記内部容積内に配置されたコンディショナを含み、前記ローラが前記第2の位置にあるときに、前記コンディショナが前記円柱状ローラの各々の外側表面と接触する、コンディショニング装置と
を備えた、ブラシボックス。 - 前記コンディショナが、1つまたは複数の支持体部材によって前記タンクの側壁に連結される、請求項1に記載のブラシボックス。
- 前記コンディショナが、前記1つまたは複数の支持体部材によって前記タンクの前記側壁に回転できるように連結される、請求項2に記載のブラシボックス。
- 前記1つまたは複数の支持体部材が、アクチュエータに連結される、請求項3に記載のブラシボックス。
- 前記円柱状ローラが、第1の軸および第2の軸の周りを回転可能であり、前記第1の軸が、前記第2の軸とは異なり、前記第2の軸に平行である、請求項4に記載のブラシボックス。
- 前記アクチュエータが、前記第1の軸または前記第2の軸に実質的に平行である第3の軸の周りに前記コンディショナを回転させる、請求項5に記載のブラシボックス。
- 前記アクチュエータが、前記第1の軸または前記第2の軸に実質的に垂直である第4の軸の周りに前記コンディショナを回転させる、請求項5に記載のブラシボックス。
- 前記コンディショニング装置が、
前記コンディショナの周りに配置されたハウジングであって、前記ハウジングが真空ポンプに連結される、ハウジング
をさらに備えた、請求項1に記載のブラシボックス。 - 前記ハウジングが、前記第2の位置にある前記円柱状ローラの前記外側表面と接触するように適合した少なくとも1つのワイパを含む、請求項8に記載のブラシボックス。
- 内部容積を有するタンクと、
前記内部容積の外部に移動できるように配置されたそれぞれの支持部材に連結された1対の円柱状ローラであって、前記円柱状ローラの各々が、前記内部容積内に少なくとも部分的に配置され、それぞれの軸の周りを回転可能である、1対の円柱状ローラと、
前記ローラが互いに近接している第1の位置と前記ローラが互いに間隔を空けて離れている第2の位置との間で前記それぞれのローラを移動させるために、前記円柱状ローラの各々に連結されたアクチュエータアセンブリと、
前記ローラの各々のためのコンディショニング装置であって、各コンディショニング装置が前記内部容積内に配置されたコンディショナを含み、前記ローラが前記第2の位置にあるときに、各コンディショナが前記円柱状ローラの各々の外側表面と接触し、各コンディショナが前記第1の軸とは異なる第2の軸の周りを回転可能である、コンディショニング装置と
を備えた、ブラシボックス。 - 各コンディショナが、1つまたは複数の支持体部材によって前記タンクの側壁に回転できるように連結される、請求項10に記載のブラシボックス。
- 前記1つまたは複数の支持体部材が、アクチュエータに連結される、請求項11に記載のブラシボックス。
- 前記アクチュエータが、前記第2の軸の周りに前記コンディショナを回転させ、前記第2の軸が前記第1の軸に実質的に平行である、請求項12に記載のブラシボックス。
- 前記アクチュエータが、前記第2の軸の周りに前記コンディショナを回転させ、前記第2の軸が前記第1の軸に実質的に垂直である、請求項12に記載のブラシボックス。
- 前記コンディショニング装置が、
前記コンディショナの周りに配置されたハウジングであって、前記ハウジングが真空ポンプに連結される、ハウジング
をさらに備えた、請求項10に記載のブラシボックス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/603,771 US8458843B2 (en) | 2009-10-22 | 2009-10-22 | Apparatus and methods for brush and pad conditioning |
US12/603,771 | 2009-10-22 | ||
PCT/US2010/046599 WO2011049671A1 (en) | 2009-10-22 | 2010-08-25 | Apparatus and methods for brush and pad conditioning |
Publications (3)
Publication Number | Publication Date |
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JP2013508969A true JP2013508969A (ja) | 2013-03-07 |
JP2013508969A5 JP2013508969A5 (ja) | 2013-10-03 |
JP5916617B2 JP5916617B2 (ja) | 2016-05-11 |
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ID=43897340
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Application Number | Title | Priority Date | Filing Date |
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JP2012535203A Active JP5916617B2 (ja) | 2009-10-22 | 2010-08-25 | ブラシコンディショニングおよびパッドコンディショニングのための装置および方法 |
Country Status (4)
Country | Link |
---|---|
US (3) | US8458843B2 (ja) |
JP (1) | JP5916617B2 (ja) |
TW (1) | TWI535529B (ja) |
WO (1) | WO2011049671A1 (ja) |
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KR20200014323A (ko) * | 2017-05-30 | 2020-02-10 | 일리노이즈 툴 워크스 인코포레이티드 | 브러시와의 무선 통신을 위한 방법 및 장치 |
JP2020136488A (ja) * | 2019-02-19 | 2020-08-31 | 株式会社荏原製作所 | 洗浄部材用洗浄装置及び基板処理装置 |
US11367629B2 (en) | 2019-01-30 | 2022-06-21 | Ebara Corporation | Cleaning apparatus of cleaning tool, substrate processing apparatus, and cleaning method of cleaning tool |
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US8458843B2 (en) * | 2009-10-22 | 2013-06-11 | Applied Materials, Inc. | Apparatus and methods for brush and pad conditioning |
US9646859B2 (en) * | 2010-04-30 | 2017-05-09 | Applied Materials, Inc. | Disk-brush cleaner module with fluid jet |
US20130196572A1 (en) * | 2012-01-27 | 2013-08-01 | Sen-Hou Ko | Conditioning a pad in a cleaning module |
CN102601736A (zh) * | 2012-03-22 | 2012-07-25 | 珠海镇东有限公司 | 一种背压辊、磨板机整刷系统及方法 |
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US10410936B2 (en) * | 2017-05-19 | 2019-09-10 | Illinois Tool Works Inc. | Methods and apparatuses for effluent monitoring for brush conditioning |
US10170343B1 (en) * | 2017-06-30 | 2019-01-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Post-CMP cleaning apparatus and method with brush self-cleaning function |
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CN108940939A (zh) * | 2018-06-14 | 2018-12-07 | 东莞市光纳光电科技有限公司 | 一种具备自清洁能力的指纹识别屏 |
US11839907B2 (en) * | 2018-08-17 | 2023-12-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Breaking-in and cleaning method and apparatus for wafer-cleaning brush |
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KR20200010314A (ko) * | 2017-05-19 | 2020-01-30 | 일리노이즈 툴 워크스 인코포레이티드 | 브러시 컨디셔닝을 위한 화학물 이송 방법 및 장치 |
KR102528122B1 (ko) * | 2017-05-19 | 2023-05-02 | 일리노이즈 툴 워크스 인코포레이티드 | 브러시 컨디셔닝을 위한 화학물 이송 방법 및 장치 |
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JP2020522888A (ja) * | 2017-05-30 | 2020-07-30 | イリノイ トゥール ワークス インコーポレイティド | ブラシとの無線通信方法および装置 |
JP7197512B2 (ja) | 2017-05-30 | 2022-12-27 | イリノイ トゥール ワークス インコーポレイティド | ブラシとの無線通信方法および装置 |
KR102538815B1 (ko) | 2017-05-30 | 2023-05-31 | 일리노이즈 툴 워크스 인코포레이티드 | 브러시와의 무선 통신을 위한 방법 및 장치 |
TWI812082B (zh) * | 2017-05-30 | 2023-08-11 | 美商伊利諾工具工程公司 | 用於與刷子進行無線通訊的方法及裝置 |
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JP2020136488A (ja) * | 2019-02-19 | 2020-08-31 | 株式会社荏原製作所 | 洗浄部材用洗浄装置及び基板処理装置 |
JP7274883B2 (ja) | 2019-02-19 | 2023-05-17 | 株式会社荏原製作所 | 洗浄部材用洗浄装置及び基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201114548A (en) | 2011-05-01 |
US20110094537A1 (en) | 2011-04-28 |
JP5916617B2 (ja) | 2016-05-11 |
US20130247314A1 (en) | 2013-09-26 |
US8458843B2 (en) | 2013-06-11 |
US20140360976A1 (en) | 2014-12-11 |
TWI535529B (zh) | 2016-06-01 |
WO2011049671A1 (en) | 2011-04-28 |
WO2011049671A4 (en) | 2011-07-07 |
US8813293B2 (en) | 2014-08-26 |
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