JP2013506977A5 - - Google Patents

Download PDF

Info

Publication number
JP2013506977A5
JP2013506977A5 JP2012531324A JP2012531324A JP2013506977A5 JP 2013506977 A5 JP2013506977 A5 JP 2013506977A5 JP 2012531324 A JP2012531324 A JP 2012531324A JP 2012531324 A JP2012531324 A JP 2012531324A JP 2013506977 A5 JP2013506977 A5 JP 2013506977A5
Authority
JP
Japan
Prior art keywords
core
shell
particles
thermoplastic resin
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012531324A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013506977A (ja
Filing date
Publication date
Priority claimed from DE102009055765A external-priority patent/DE102009055765A1/de
Application filed filed Critical
Publication of JP2013506977A publication Critical patent/JP2013506977A/ja
Publication of JP2013506977A5 publication Critical patent/JP2013506977A5/ja
Pending legal-status Critical Current

Links

JP2012531324A 2009-09-30 2010-09-20 電子デバイスたとえば光学デバイスまたはオプトエレクトロニクスデバイスおよび該デバイスの製造方法 Pending JP2013506977A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102009047877.9 2009-09-30
DE102009047877 2009-09-30
DE102009055765.2 2009-11-25
DE102009055765A DE102009055765A1 (de) 2009-09-30 2009-11-25 Optisches oder optoelektronisches Bauelement und Verfahren zu dessen Herstellung
PCT/EP2010/063813 WO2011039071A2 (de) 2009-09-30 2010-09-20 Elektronisches, insbesondere optisches oder optoelektronisches, bauelement und verfahren zu dessen herstellung

Publications (2)

Publication Number Publication Date
JP2013506977A JP2013506977A (ja) 2013-02-28
JP2013506977A5 true JP2013506977A5 (enExample) 2013-07-11

Family

ID=43662662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012531324A Pending JP2013506977A (ja) 2009-09-30 2010-09-20 電子デバイスたとえば光学デバイスまたはオプトエレクトロニクスデバイスおよび該デバイスの製造方法

Country Status (7)

Country Link
US (1) US20120241694A1 (enExample)
EP (1) EP2483938A2 (enExample)
JP (1) JP2013506977A (enExample)
KR (1) KR20120091175A (enExample)
CN (1) CN102549784A (enExample)
DE (1) DE102009055765A1 (enExample)
WO (1) WO2011039071A2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6418200B2 (ja) 2016-05-31 2018-11-07 日亜化学工業株式会社 発光装置及びその製造方法
DE102017210200A1 (de) * 2017-06-19 2018-12-20 Osram Gmbh Substrat zum aufnehmen eines optoelektronischen bauelements, optoelektronische baugruppe, verfahren zum herstellen eines substrats und verfahren zum herstellen einer optoelektronischen baugruppe
JP7471663B2 (ja) * 2019-08-23 2024-04-22 国立大学法人北海道大学 潜熱蓄熱材用マイクロカプセル及びその製造方法、並びに、潜熱蓄熱材用マイクロカプセルを含む粉末、及び当該粉末を含む蓄熱装置
JP7078863B2 (ja) * 2020-04-01 2022-06-01 日亜化学工業株式会社 発光装置及びその製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52149282A (en) * 1976-06-08 1977-12-12 Asahi Chem Ind Co Ltd Aq. aluminium paste compositions
JPH0493362A (ja) * 1990-08-10 1992-03-26 Toshiba Ceramics Co Ltd 電子部品封止用充填剤およびその製造方法
US5627107A (en) * 1992-06-08 1997-05-06 The Dow Chemical Company Semiconductor devices encapsulated with aluminum nitride-filled resins and process for preparing same
DE69514201T2 (de) * 1994-11-24 2000-08-03 Dow Corning Toray Silicone Co., Ltd. Verfahren zur Herstellung eines Halbleiterbauelements
US5601874A (en) * 1994-12-08 1997-02-11 The Dow Chemical Company Method of making moisture resistant aluminum nitride powder and powder produced thereby
DE69708362T2 (de) * 1996-03-29 2002-08-22 Hitachi Metals, Ltd. Verfahren zur Herstellung von Aluminium-Verbundmaterial mit niedrigem thermischen Ausdehnungskoeffizient und hoher Wärmeleitfähigkeit
US6737681B2 (en) * 2001-08-22 2004-05-18 Nichia Corporation Light emitting device with fluorescent member excited by semiconductor light emitting element
DE10310844B4 (de) * 2003-03-10 2021-06-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement mit einem Gehäusekörper aus Kunststoff
EP1735845A2 (de) * 2004-04-16 2006-12-27 Lucea AG Gehäuse für led-chip und lichtquelle
DE102004031391B4 (de) * 2004-06-29 2009-06-04 Osram Opto Semiconductors Gmbh Elektronisches Bauteil mit Gehäuse zum ESD-Schutz
JP2006036931A (ja) * 2004-07-27 2006-02-09 Three M Innovative Properties Co 熱伝導性組成物
JP4991173B2 (ja) * 2005-04-27 2012-08-01 京セラ株式会社 発光素子搭載用基体ならびにこれを用いた発光装置
JP2009135484A (ja) * 2007-11-09 2009-06-18 Hitachi Chem Co Ltd 光半導体装置
JP2009263640A (ja) * 2008-04-04 2009-11-12 Sumitomo Chemical Co Ltd 熱伝導性樹脂組成物及びその用途

Similar Documents

Publication Publication Date Title
JP2010532586A5 (enExample)
JP2013506977A5 (enExample)
CN103862039B (zh) 核壳结构铜纳米微粒及其制备方法
JP2013112314A5 (enExample)
JP2013083960A5 (enExample)
JP2014528983A5 (enExample)
JP2011501420A5 (enExample)
JP2010185023A5 (enExample)
JP2015156395A5 (enExample)
JP2013051033A5 (enExample)
JP2012052282A5 (enExample)
JP2013151755A5 (enExample)
JP2010531044A5 (enExample)
JP2010278425A5 (enExample)
JP2015153918A5 (enExample)
JP2015522683A5 (enExample)
JP2011236418A5 (enExample)
JP2009246940A5 (enExample)
TWI577544B (zh) 包覆有矽膠的外殼及使用該外殼的電子裝置
JP2015010200A5 (enExample)
JP2018063817A5 (enExample)
JP2011222129A5 (enExample)
JP2017097974A5 (enExample)
JP2013231197A5 (enExample)
JP2006202604A5 (enExample)