JP2015010200A5 - - Google Patents
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- Publication number
- JP2015010200A5 JP2015010200A5 JP2013137747A JP2013137747A JP2015010200A5 JP 2015010200 A5 JP2015010200 A5 JP 2015010200A5 JP 2013137747 A JP2013137747 A JP 2013137747A JP 2013137747 A JP2013137747 A JP 2013137747A JP 2015010200 A5 JP2015010200 A5 JP 2015010200A5
- Authority
- JP
- Japan
- Prior art keywords
- thermally conductive
- group
- resin composition
- heat conductive
- conductive member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011230 binding agent Substances 0.000 claims 8
- 239000011342 resin composition Substances 0.000 claims 8
- 239000011347 resin Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 125000000524 functional group Chemical group 0.000 claims 5
- 239000002904 solvent Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 125000002339 acetoacetyl group Chemical group O=C([*])C([H])([H])C(=O)C([H])([H])[H] 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 239000011164 primary particle Substances 0.000 claims 1
- 230000009257 reactivity Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013137747A JP6107479B2 (ja) | 2013-07-01 | 2013-07-01 | 熱伝導性変形性凝集体、熱伝導性樹脂組成物、熱伝導部材、及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013137747A JP6107479B2 (ja) | 2013-07-01 | 2013-07-01 | 熱伝導性変形性凝集体、熱伝導性樹脂組成物、熱伝導部材、及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015010200A JP2015010200A (ja) | 2015-01-19 |
| JP2015010200A5 true JP2015010200A5 (enExample) | 2016-07-07 |
| JP6107479B2 JP6107479B2 (ja) | 2017-04-05 |
Family
ID=52303642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013137747A Expired - Fee Related JP6107479B2 (ja) | 2013-07-01 | 2013-07-01 | 熱伝導性変形性凝集体、熱伝導性樹脂組成物、熱伝導部材、及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6107479B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017047452A1 (ja) | 2015-09-16 | 2017-03-23 | 大日精化工業株式会社 | アルミナ系熱伝導性酸化物及びその製造方法 |
| JP6897032B2 (ja) * | 2016-09-02 | 2021-06-30 | 富士フイルムビジネスイノベーション株式会社 | 成形物、部材、定着部材、定着装置、プロセスカートリッジ、及び画像形成装置 |
| JP6974302B2 (ja) * | 2017-01-30 | 2021-12-01 | 積水化学工業株式会社 | 樹脂材料及び積層体 |
| JP6209695B1 (ja) | 2017-03-02 | 2017-10-04 | 大日精化工業株式会社 | アルミナ系熱伝導性酸化物及びその製造方法 |
| CN115926755A (zh) * | 2022-12-16 | 2023-04-07 | 苏州博濬新材料科技有限公司 | 一种耐磨非硅导热组合物及其制备方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1797155B1 (en) * | 2004-08-23 | 2015-10-07 | General Electric Company | Thermally conductive composition and method for preparing the same |
| WO2012070289A1 (ja) * | 2010-11-26 | 2012-05-31 | 三菱電機株式会社 | 熱伝導性シート及びパワーモジュール |
| JP5263429B1 (ja) * | 2012-05-21 | 2013-08-14 | 東洋インキＳｃホールディングス株式会社 | 熱伝導性易変形性凝集体およびその製造方法 |
-
2013
- 2013-07-01 JP JP2013137747A patent/JP6107479B2/ja not_active Expired - Fee Related
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