KR20120091175A - 전자, 특히 광학 또는 광전자 소자 그리고 상기 소자를 제조하기 위한 방법 - Google Patents
전자, 특히 광학 또는 광전자 소자 그리고 상기 소자를 제조하기 위한 방법 Download PDFInfo
- Publication number
- KR20120091175A KR20120091175A KR1020127011312A KR20127011312A KR20120091175A KR 20120091175 A KR20120091175 A KR 20120091175A KR 1020127011312 A KR1020127011312 A KR 1020127011312A KR 20127011312 A KR20127011312 A KR 20127011312A KR 20120091175 A KR20120091175 A KR 20120091175A
- Authority
- KR
- South Korea
- Prior art keywords
- particles
- core
- shell
- electronics
- optoelectronic devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8581—Means for heat extraction or cooling characterised by their material
Landscapes
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing Of Micro-Capsules (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009047877.9 | 2009-09-30 | ||
| DE102009047877 | 2009-09-30 | ||
| DE102009055765.2 | 2009-11-25 | ||
| DE102009055765A DE102009055765A1 (de) | 2009-09-30 | 2009-11-25 | Optisches oder optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20120091175A true KR20120091175A (ko) | 2012-08-17 |
Family
ID=43662662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127011312A Withdrawn KR20120091175A (ko) | 2009-09-30 | 2010-09-20 | 전자, 특히 광학 또는 광전자 소자 그리고 상기 소자를 제조하기 위한 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20120241694A1 (enExample) |
| EP (1) | EP2483938A2 (enExample) |
| JP (1) | JP2013506977A (enExample) |
| KR (1) | KR20120091175A (enExample) |
| CN (1) | CN102549784A (enExample) |
| DE (1) | DE102009055765A1 (enExample) |
| WO (1) | WO2011039071A2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6418200B2 (ja) | 2016-05-31 | 2018-11-07 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| DE102017210200A1 (de) * | 2017-06-19 | 2018-12-20 | Osram Gmbh | Substrat zum aufnehmen eines optoelektronischen bauelements, optoelektronische baugruppe, verfahren zum herstellen eines substrats und verfahren zum herstellen einer optoelektronischen baugruppe |
| JP7471663B2 (ja) * | 2019-08-23 | 2024-04-22 | 国立大学法人北海道大学 | 潜熱蓄熱材用マイクロカプセル及びその製造方法、並びに、潜熱蓄熱材用マイクロカプセルを含む粉末、及び当該粉末を含む蓄熱装置 |
| JP7078863B2 (ja) * | 2020-04-01 | 2022-06-01 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52149282A (en) * | 1976-06-08 | 1977-12-12 | Asahi Chem Ind Co Ltd | Aq. aluminium paste compositions |
| JPH0493362A (ja) * | 1990-08-10 | 1992-03-26 | Toshiba Ceramics Co Ltd | 電子部品封止用充填剤およびその製造方法 |
| US5627107A (en) * | 1992-06-08 | 1997-05-06 | The Dow Chemical Company | Semiconductor devices encapsulated with aluminum nitride-filled resins and process for preparing same |
| DE69514201T2 (de) * | 1994-11-24 | 2000-08-03 | Dow Corning Toray Silicone Co., Ltd. | Verfahren zur Herstellung eines Halbleiterbauelements |
| US5601874A (en) * | 1994-12-08 | 1997-02-11 | The Dow Chemical Company | Method of making moisture resistant aluminum nitride powder and powder produced thereby |
| DE69708362T2 (de) * | 1996-03-29 | 2002-08-22 | Hitachi Metals, Ltd. | Verfahren zur Herstellung von Aluminium-Verbundmaterial mit niedrigem thermischen Ausdehnungskoeffizient und hoher Wärmeleitfähigkeit |
| US6737681B2 (en) * | 2001-08-22 | 2004-05-18 | Nichia Corporation | Light emitting device with fluorescent member excited by semiconductor light emitting element |
| DE10310844B4 (de) * | 2003-03-10 | 2021-06-10 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement mit einem Gehäusekörper aus Kunststoff |
| EP1735845A2 (de) * | 2004-04-16 | 2006-12-27 | Lucea AG | Gehäuse für led-chip und lichtquelle |
| DE102004031391B4 (de) * | 2004-06-29 | 2009-06-04 | Osram Opto Semiconductors Gmbh | Elektronisches Bauteil mit Gehäuse zum ESD-Schutz |
| JP2006036931A (ja) * | 2004-07-27 | 2006-02-09 | Three M Innovative Properties Co | 熱伝導性組成物 |
| JP4991173B2 (ja) * | 2005-04-27 | 2012-08-01 | 京セラ株式会社 | 発光素子搭載用基体ならびにこれを用いた発光装置 |
| JP2009135484A (ja) * | 2007-11-09 | 2009-06-18 | Hitachi Chem Co Ltd | 光半導体装置 |
| JP2009263640A (ja) * | 2008-04-04 | 2009-11-12 | Sumitomo Chemical Co Ltd | 熱伝導性樹脂組成物及びその用途 |
-
2009
- 2009-11-25 DE DE102009055765A patent/DE102009055765A1/de not_active Withdrawn
-
2010
- 2010-09-20 EP EP10759851A patent/EP2483938A2/de not_active Withdrawn
- 2010-09-20 JP JP2012531324A patent/JP2013506977A/ja active Pending
- 2010-09-20 WO PCT/EP2010/063813 patent/WO2011039071A2/de not_active Ceased
- 2010-09-20 KR KR1020127011312A patent/KR20120091175A/ko not_active Withdrawn
- 2010-09-20 US US13/499,632 patent/US20120241694A1/en not_active Abandoned
- 2010-09-20 CN CN2010800439894A patent/CN102549784A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP2483938A2 (de) | 2012-08-08 |
| WO2011039071A2 (de) | 2011-04-07 |
| US20120241694A1 (en) | 2012-09-27 |
| DE102009055765A1 (de) | 2011-03-31 |
| CN102549784A (zh) | 2012-07-04 |
| WO2011039071A3 (de) | 2011-08-25 |
| JP2013506977A (ja) | 2013-02-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5564121B2 (ja) | Ledベースのペデスタル型の照明構造 | |
| EP2317569B1 (en) | Light source for lighting | |
| TWI411659B (zh) | 從懸浮液中蒸發溶劑而塗層半導體發光元件之方法 | |
| EP2482348B1 (en) | Wavelength conversion particle, wavelength conversion member using same, and light emitting device | |
| US20080180018A1 (en) | Fluorescent substance containing glass sheet, method for manufacturing the glass sheet and light-emitting device | |
| CN101036238A (zh) | 发光设备、使用所述发光设备的照明设备和液晶显示装置 | |
| CN1754268A (zh) | 照明模块及其制造方法 | |
| WO2012131792A1 (ja) | 半導体発光装置 | |
| JP4654577B2 (ja) | 光電変換素子実装用セラミックス基板 | |
| KR101783755B1 (ko) | 발광 다이오드 | |
| KR102369932B1 (ko) | 불화물계 형광체, 발광장치, 불화물계 형광체 제조방법 및 발광장치 제조방법 | |
| KR20120091175A (ko) | 전자, 특히 광학 또는 광전자 소자 그리고 상기 소자를 제조하기 위한 방법 | |
| US9530951B2 (en) | Optoelectronic device | |
| US8502252B2 (en) | Optoelectronic component, and method for the production of an optoelectronic component | |
| WO2019003535A1 (ja) | 透明封止部材及びその製造方法 | |
| JP2006165029A (ja) | 発光素子実装用基板及び発光素子パッケージ体 | |
| CN101449392B (zh) | 发光元件安装用基板、发光元件封装体、显示装置及照明装置 | |
| KR101169209B1 (ko) | 복수의 방열 홀을 갖는 led 조명 장치 | |
| TWI590494B (zh) | Optical semiconductor device package, its manufacturing method, and optical semiconductor device and its manufacturing method | |
| KR101114108B1 (ko) | 에지형 발광 구성 요소 패키지 구조체 | |
| US20130256728A1 (en) | Light emitting device package | |
| JP6213993B2 (ja) | 電子部品実装用基板 | |
| JP2024028483A (ja) | 発光装置及び発光装置の製造方法 | |
| KR101831771B1 (ko) | 광원모듈, 광원모듈의 제조방법, 및 이를 포함하는 조명기기 | |
| JP2016092149A (ja) | 反射体、及びそれを用いた発光素子搭載用基板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20120430 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |