WO2011039071A3 - Elektronisches, insbesondere optisches oder optoelektronisches, bauelement und verfahren zu dessen herstellung - Google Patents

Elektronisches, insbesondere optisches oder optoelektronisches, bauelement und verfahren zu dessen herstellung Download PDF

Info

Publication number
WO2011039071A3
WO2011039071A3 PCT/EP2010/063813 EP2010063813W WO2011039071A3 WO 2011039071 A3 WO2011039071 A3 WO 2011039071A3 EP 2010063813 W EP2010063813 W EP 2010063813W WO 2011039071 A3 WO2011039071 A3 WO 2011039071A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic
optoelectronic component
production
especially optical
core
Prior art date
Application number
PCT/EP2010/063813
Other languages
English (en)
French (fr)
Other versions
WO2011039071A2 (de
Inventor
Klaus Hoehn
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Priority to EP10759851A priority Critical patent/EP2483938A2/de
Priority to US13/499,632 priority patent/US20120241694A1/en
Priority to CN2010800439894A priority patent/CN102549784A/zh
Priority to JP2012531324A priority patent/JP2013506977A/ja
Publication of WO2011039071A2 publication Critical patent/WO2011039071A2/de
Publication of WO2011039071A3 publication Critical patent/WO2011039071A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Micro-Capsules (AREA)

Abstract

Elektronisches, insbesondere optisches oder optoelektronisches, Bauelement umfassend ein Bauteil (6), welches einen Thermoplasten (5) umfasst, welcher Partikel (1) aufweist, welche einen Kern und eine Hülle umfassen, wobei die Hülle auf der Oberfläche des Kerns angeordnet ist, und wobei der Kern Aluminium umfasst.
PCT/EP2010/063813 2009-09-30 2010-09-20 Elektronisches, insbesondere optisches oder optoelektronisches, bauelement und verfahren zu dessen herstellung WO2011039071A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP10759851A EP2483938A2 (de) 2009-09-30 2010-09-20 Elektronisches, insbesondere optisches oder optoelektronisches, bauelement und verfahren zu dessen herstellung
US13/499,632 US20120241694A1 (en) 2009-09-30 2010-09-20 Electronic, Especially Optical or Optoelectronic Component, and Method for the Production Thereof
CN2010800439894A CN102549784A (zh) 2009-09-30 2010-09-20 电子器件、尤其是光学或光电子器件及其制造方法
JP2012531324A JP2013506977A (ja) 2009-09-30 2010-09-20 電子デバイスたとえば光学デバイスまたはオプトエレクトロニクスデバイスおよび該デバイスの製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102009047877 2009-09-30
DE102009047877.9 2009-09-30
DE102009055765A DE102009055765A1 (de) 2009-09-30 2009-11-25 Optisches oder optoelektronisches Bauelement und Verfahren zu dessen Herstellung
DE102009055765.2 2009-11-25

Publications (2)

Publication Number Publication Date
WO2011039071A2 WO2011039071A2 (de) 2011-04-07
WO2011039071A3 true WO2011039071A3 (de) 2011-08-25

Family

ID=43662662

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/063813 WO2011039071A2 (de) 2009-09-30 2010-09-20 Elektronisches, insbesondere optisches oder optoelektronisches, bauelement und verfahren zu dessen herstellung

Country Status (7)

Country Link
US (1) US20120241694A1 (de)
EP (1) EP2483938A2 (de)
JP (1) JP2013506977A (de)
KR (1) KR20120091175A (de)
CN (1) CN102549784A (de)
DE (1) DE102009055765A1 (de)
WO (1) WO2011039071A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6418200B2 (ja) 2016-05-31 2018-11-07 日亜化学工業株式会社 発光装置及びその製造方法
DE102017210200A1 (de) * 2017-06-19 2018-12-20 Osram Gmbh Substrat zum aufnehmen eines optoelektronischen bauelements, optoelektronische baugruppe, verfahren zum herstellen eines substrats und verfahren zum herstellen einer optoelektronischen baugruppe
JP7078863B2 (ja) 2020-04-01 2022-06-01 日亜化学工業株式会社 発光装置及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5298328A (en) * 1990-08-10 1994-03-29 Toshiba Ceramics Co., Ltd. Packing material and method of making same
US5601874A (en) * 1994-12-08 1997-02-11 The Dow Chemical Company Method of making moisture resistant aluminum nitride powder and powder produced thereby
US5627107A (en) * 1992-06-08 1997-05-06 The Dow Chemical Company Semiconductor devices encapsulated with aluminum nitride-filled resins and process for preparing same
WO2006019751A1 (en) * 2004-07-27 2006-02-23 3M Innovative Properties Company Thermally conductive composition

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52149282A (en) * 1976-06-08 1977-12-12 Asahi Chem Ind Co Ltd Aq. aluminium paste compositions
US5907190A (en) * 1994-11-24 1999-05-25 Dow Corning Toray Silicone Co., Ltd. Semiconductor device having a cured silicone coating with non uniformly dispersed filler
EP0798393B1 (de) * 1996-03-29 2001-11-21 Hitachi Metals, Ltd. Verfahren zur Herstellung von Aluminium-Verbundmaterial mit niedrigem thermischen Ausdehnungskoeffizient und hoher Wärmeleitfähigkeit
US6737681B2 (en) * 2001-08-22 2004-05-18 Nichia Corporation Light emitting device with fluorescent member excited by semiconductor light emitting element
DE10310844B4 (de) * 2003-03-10 2021-06-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement mit einem Gehäusekörper aus Kunststoff
EP1735845A2 (de) * 2004-04-16 2006-12-27 Lucea AG Gehäuse für led-chip und lichtquelle
DE102004064150B4 (de) * 2004-06-29 2010-04-29 Osram Opto Semiconductors Gmbh Elektronisches Bauteil mit Gehäuse mit leitfähiger Beschichtung zum ESD-Schutz
JP4991173B2 (ja) * 2005-04-27 2012-08-01 京セラ株式会社 発光素子搭載用基体ならびにこれを用いた発光装置
JP2009135484A (ja) * 2007-11-09 2009-06-18 Hitachi Chem Co Ltd 光半導体装置
JP2009263640A (ja) * 2008-04-04 2009-11-12 Sumitomo Chemical Co Ltd 熱伝導性樹脂組成物及びその用途

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5298328A (en) * 1990-08-10 1994-03-29 Toshiba Ceramics Co., Ltd. Packing material and method of making same
US5627107A (en) * 1992-06-08 1997-05-06 The Dow Chemical Company Semiconductor devices encapsulated with aluminum nitride-filled resins and process for preparing same
US5601874A (en) * 1994-12-08 1997-02-11 The Dow Chemical Company Method of making moisture resistant aluminum nitride powder and powder produced thereby
WO2006019751A1 (en) * 2004-07-27 2006-02-23 3M Innovative Properties Company Thermally conductive composition

Also Published As

Publication number Publication date
EP2483938A2 (de) 2012-08-08
DE102009055765A1 (de) 2011-03-31
JP2013506977A (ja) 2013-02-28
WO2011039071A2 (de) 2011-04-07
US20120241694A1 (en) 2012-09-27
CN102549784A (zh) 2012-07-04
KR20120091175A (ko) 2012-08-17

Similar Documents

Publication Publication Date Title
WO2011004198A3 (en) Patterning
EP2283081B8 (de) Verfahren zur oberflächenmodifizierung von partikeln
WO2005080096A3 (de) Dekorpapier mit elektrisch geladenen fasern
WO2010059736A3 (en) Near-field transducers for focusing light
WO2010117875A3 (en) Composite thermoelectric material and method for producing the same
EP2133200A4 (de) Eine leitende substanz aufnehmender harzfilm, verfahren zur herstellung eines eine leitende substanz aufnehmenden harzfilms, mit einer metallschicht überzogener, daraus hergestellter harzfilm und verfahren zur herstellung eines mit einer metallschicht überzogenen harzfilms
TW200611062A (en) Apparatus, system and method to vary dimensions of a substrate during nano-scale manufacturing
WO2009100189A3 (en) Device and method for repairing pipe
WO2009064832A3 (en) Method for making an assured image
EP1921061A4 (de) Metallhaltige verbindung, verfahren zu dessen herstellung, metallhaltiger dünner film und verfahren zu dessen bildung
ZA201007902B (en) A process for the production of an olefin oxide,a 1,2-diol,a 1,2-diol ether,a 1,2-carbonate,or an alkanolamine
EP2116888A4 (de) Kontaktlinse und herstellungsverfahren dafür
TWI319492B (en) Optical waveguide film and the manufacturing method thereof,and optical/electronic circuit film and electronic machine including that
WO2009116012A3 (en) A directional linear light source
EP1951498A4 (de) Verfahren zur herstellung einer zelluloseharzfolie
WO2012107263A3 (de) Optoelektronisches bauelement mit lichtdurchlässiger abdeckung und verfahren zu dessen herstellung
WO2007014197A3 (en) Yeast expression vectors for production of itf
EP1857810A4 (de) Optischer sensor und verfahren zur herstellung davon
GB0706128D0 (en) A method for the manufacture of nanoparticles on a carbon surface and products therefrom
EP2094412B8 (de) Bauteil aus einem flachmaterial und verfahren zu seiner herstellung
TW200735137A (en) Composite magnetic sheet and production method thereof
EP1909855B8 (de) Radioaktive oberflächenquelle und verfahren zu ihrer herstellung
EP2220698A4 (de) Substratherstellungsverfahren für sensoranwendungen mittels optischer eigenschaften und das substrat daraus
ZA200907567B (en) A process for the production of an olefin oxide, a 1,2-diol, a 1,2-diol ether, a 1,2-carbonate, or an alkanolamine
WO2011011129A3 (en) Coated tooling

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201080043989.4

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10759851

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2010759851

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2012531324

Country of ref document: JP

ENP Entry into the national phase

Ref document number: 20127011312

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 13499632

Country of ref document: US