JP2013506977A - 電子デバイスたとえば光学デバイスまたはオプトエレクトロニクスデバイスおよび該デバイスの製造方法 - Google Patents

電子デバイスたとえば光学デバイスまたはオプトエレクトロニクスデバイスおよび該デバイスの製造方法 Download PDF

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JP2013506977A
JP2013506977A JP2012531324A JP2012531324A JP2013506977A JP 2013506977 A JP2013506977 A JP 2013506977A JP 2012531324 A JP2012531324 A JP 2012531324A JP 2012531324 A JP2012531324 A JP 2012531324A JP 2013506977 A JP2013506977 A JP 2013506977A
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core
particles
shell
thermoplastic resin
aluminum
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JP2012531324A
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Japanese (ja)
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JP2013506977A5 (enExample
Inventor
ヘーン クラウス
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of JP2013506977A publication Critical patent/JP2013506977A/ja
Publication of JP2013506977A5 publication Critical patent/JP2013506977A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material

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  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
JP2012531324A 2009-09-30 2010-09-20 電子デバイスたとえば光学デバイスまたはオプトエレクトロニクスデバイスおよび該デバイスの製造方法 Pending JP2013506977A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102009047877.9 2009-09-30
DE102009047877 2009-09-30
DE102009055765.2 2009-11-25
DE102009055765A DE102009055765A1 (de) 2009-09-30 2009-11-25 Optisches oder optoelektronisches Bauelement und Verfahren zu dessen Herstellung
PCT/EP2010/063813 WO2011039071A2 (de) 2009-09-30 2010-09-20 Elektronisches, insbesondere optisches oder optoelektronisches, bauelement und verfahren zu dessen herstellung

Publications (2)

Publication Number Publication Date
JP2013506977A true JP2013506977A (ja) 2013-02-28
JP2013506977A5 JP2013506977A5 (enExample) 2013-07-11

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ID=43662662

Family Applications (1)

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JP2012531324A Pending JP2013506977A (ja) 2009-09-30 2010-09-20 電子デバイスたとえば光学デバイスまたはオプトエレクトロニクスデバイスおよび該デバイスの製造方法

Country Status (7)

Country Link
US (1) US20120241694A1 (enExample)
EP (1) EP2483938A2 (enExample)
JP (1) JP2013506977A (enExample)
KR (1) KR20120091175A (enExample)
CN (1) CN102549784A (enExample)
DE (1) DE102009055765A1 (enExample)
WO (1) WO2011039071A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020107910A (ja) * 2020-04-01 2020-07-09 日亜化学工業株式会社 発光装置及びその製造方法
US11430928B2 (en) 2016-05-31 2022-08-30 Nichia Corporation Light-emitting device with exposed filter particles

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017210200A1 (de) * 2017-06-19 2018-12-20 Osram Gmbh Substrat zum aufnehmen eines optoelektronischen bauelements, optoelektronische baugruppe, verfahren zum herstellen eines substrats und verfahren zum herstellen einer optoelektronischen baugruppe
JP7471663B2 (ja) * 2019-08-23 2024-04-22 国立大学法人北海道大学 潜熱蓄熱材用マイクロカプセル及びその製造方法、並びに、潜熱蓄熱材用マイクロカプセルを含む粉末、及び当該粉末を含む蓄熱装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006036931A (ja) * 2004-07-27 2006-02-09 Three M Innovative Properties Co 熱伝導性組成物
JP2009135484A (ja) * 2007-11-09 2009-06-18 Hitachi Chem Co Ltd 光半導体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52149282A (en) * 1976-06-08 1977-12-12 Asahi Chem Ind Co Ltd Aq. aluminium paste compositions
JPH0493362A (ja) * 1990-08-10 1992-03-26 Toshiba Ceramics Co Ltd 電子部品封止用充填剤およびその製造方法
US5627107A (en) * 1992-06-08 1997-05-06 The Dow Chemical Company Semiconductor devices encapsulated with aluminum nitride-filled resins and process for preparing same
DE69514201T2 (de) * 1994-11-24 2000-08-03 Dow Corning Toray Silicone Co., Ltd. Verfahren zur Herstellung eines Halbleiterbauelements
US5601874A (en) * 1994-12-08 1997-02-11 The Dow Chemical Company Method of making moisture resistant aluminum nitride powder and powder produced thereby
DE69708362T2 (de) * 1996-03-29 2002-08-22 Hitachi Metals, Ltd. Verfahren zur Herstellung von Aluminium-Verbundmaterial mit niedrigem thermischen Ausdehnungskoeffizient und hoher Wärmeleitfähigkeit
US6737681B2 (en) * 2001-08-22 2004-05-18 Nichia Corporation Light emitting device with fluorescent member excited by semiconductor light emitting element
DE10310844B4 (de) * 2003-03-10 2021-06-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement mit einem Gehäusekörper aus Kunststoff
EP1735845A2 (de) * 2004-04-16 2006-12-27 Lucea AG Gehäuse für led-chip und lichtquelle
DE102004031391B4 (de) * 2004-06-29 2009-06-04 Osram Opto Semiconductors Gmbh Elektronisches Bauteil mit Gehäuse zum ESD-Schutz
JP4991173B2 (ja) * 2005-04-27 2012-08-01 京セラ株式会社 発光素子搭載用基体ならびにこれを用いた発光装置
JP2009263640A (ja) * 2008-04-04 2009-11-12 Sumitomo Chemical Co Ltd 熱伝導性樹脂組成物及びその用途

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006036931A (ja) * 2004-07-27 2006-02-09 Three M Innovative Properties Co 熱伝導性組成物
JP2009135484A (ja) * 2007-11-09 2009-06-18 Hitachi Chem Co Ltd 光半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11430928B2 (en) 2016-05-31 2022-08-30 Nichia Corporation Light-emitting device with exposed filter particles
JP2020107910A (ja) * 2020-04-01 2020-07-09 日亜化学工業株式会社 発光装置及びその製造方法
JP7078863B2 (ja) 2020-04-01 2022-06-01 日亜化学工業株式会社 発光装置及びその製造方法

Also Published As

Publication number Publication date
KR20120091175A (ko) 2012-08-17
EP2483938A2 (de) 2012-08-08
WO2011039071A2 (de) 2011-04-07
US20120241694A1 (en) 2012-09-27
DE102009055765A1 (de) 2011-03-31
CN102549784A (zh) 2012-07-04
WO2011039071A3 (de) 2011-08-25

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