JP2013500394A5 - - Google Patents
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- Publication number
- JP2013500394A5 JP2013500394A5 JP2012522093A JP2012522093A JP2013500394A5 JP 2013500394 A5 JP2013500394 A5 JP 2013500394A5 JP 2012522093 A JP2012522093 A JP 2012522093A JP 2012522093 A JP2012522093 A JP 2012522093A JP 2013500394 A5 JP2013500394 A5 JP 2013500394A5
- Authority
- JP
- Japan
- Prior art keywords
- composition according
- condensate
- composition
- polyalcohol
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 17
- 150000005846 sugar alcohols Polymers 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 claims 5
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims 4
- 125000002947 alkylene group Chemical group 0.000 claims 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 3
- 239000000654 additive Substances 0.000 claims 3
- 230000000996 additive effect Effects 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims 2
- 125000002723 alicyclic group Chemical group 0.000 claims 2
- 125000001931 aliphatic group Chemical group 0.000 claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 230000005494 condensation Effects 0.000 claims 2
- 238000009833 condensation Methods 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229910001431 copper ion Inorganic materials 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 238000009499 grossing Methods 0.000 claims 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims 1
- 229920001281 polyalkylene Polymers 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 229920005604 random copolymer Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22980309P | 2009-07-30 | 2009-07-30 | |
| US61/229,803 | 2009-07-30 | ||
| PCT/EP2010/060276 WO2011012462A2 (en) | 2009-07-30 | 2010-07-16 | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013500394A JP2013500394A (ja) | 2013-01-07 |
| JP2013500394A5 true JP2013500394A5 (cg-RX-API-DMAC7.html) | 2013-08-29 |
| JP5714581B2 JP5714581B2 (ja) | 2015-05-07 |
Family
ID=43425023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012522093A Active JP5714581B2 (ja) | 2009-07-30 | 2010-07-16 | マイクロメーター以下の機構をボイドを形成することなく満たすための抑制剤を含む金属メッキ用組成物 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US9869029B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2459778B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5714581B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101752018B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN102597329B (cg-RX-API-DMAC7.html) |
| IL (1) | IL217536A (cg-RX-API-DMAC7.html) |
| MY (1) | MY157126A (cg-RX-API-DMAC7.html) |
| RU (1) | RU2539897C2 (cg-RX-API-DMAC7.html) |
| SG (2) | SG177685A1 (cg-RX-API-DMAC7.html) |
| TW (1) | TWI487813B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2011012462A2 (cg-RX-API-DMAC7.html) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY160150A (en) * | 2009-07-30 | 2017-02-28 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| US8790426B2 (en) | 2010-04-27 | 2014-07-29 | Basf Se | Quaternized terpolymer |
| JP5981938B2 (ja) | 2010-12-21 | 2016-08-31 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | レベリング剤を含有する金属電解めっき組成物 |
| ES2531397T3 (es) * | 2011-02-22 | 2015-03-13 | Basf Se | Polímeros basados en carbonato de glicerina |
| CN103384690B (zh) * | 2011-02-22 | 2016-11-23 | 巴斯夫欧洲公司 | 基于碳酸甘油酯和醇的聚合物 |
| US9631292B2 (en) | 2011-06-01 | 2017-04-25 | Basf Se | Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features |
| EP2530102A1 (en) | 2011-06-01 | 2012-12-05 | Basf Se | Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias |
| US20130133243A1 (en) | 2011-06-28 | 2013-05-30 | Basf Se | Quaternized nitrogen compounds and use thereof as additives in fuels and lubricants |
| CN104797633B (zh) | 2012-11-09 | 2018-04-24 | 巴斯夫欧洲公司 | 用于金属电镀的包含调平剂的组合物 |
| BR112015022373B1 (pt) * | 2013-03-13 | 2020-08-18 | Basf Se | Composição umectante e solo tratado |
| PL406197A1 (pl) * | 2013-11-22 | 2015-05-25 | Inphotech Spółka Z Ograniczoną Odpowiedzialnością | Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymi |
| CN105899715B (zh) * | 2013-12-09 | 2019-05-31 | 阿文尼公司 | 含有电化学惰性阳离子的铜电沉积浴 |
| US9617648B2 (en) * | 2015-03-04 | 2017-04-11 | Lam Research Corporation | Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias |
| WO2018015168A1 (en) * | 2016-07-18 | 2018-01-25 | Basf Se | Composition for cobalt plating comprising additive for void-free submicron feature filling |
| US11926918B2 (en) | 2016-12-20 | 2024-03-12 | Basf Se | Composition for metal plating comprising suppressing agent for void free filing |
| EP3679179B1 (en) | 2017-09-04 | 2023-10-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| WO2019097044A1 (en) * | 2017-11-20 | 2019-05-23 | Basf Se | Composition for cobalt electroplating comprising leveling agent |
| WO2019185468A1 (en) | 2018-03-29 | 2019-10-03 | Basf Se | Composition for tin-silver alloy electroplating comprising a complexing agent |
| US10529622B1 (en) | 2018-07-10 | 2020-01-07 | International Business Machines Corporation | Void-free metallic interconnect structures with self-formed diffusion barrier layers |
| US20220333262A1 (en) | 2019-09-27 | 2022-10-20 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| EP4034697A1 (en) | 2019-09-27 | 2022-08-03 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| EP4127025B1 (en) | 2020-04-03 | 2025-10-01 | Basf Se | Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent |
| EP3922662A1 (en) | 2020-06-10 | 2021-12-15 | Basf Se | Polyalkanolamine |
| US11384446B2 (en) | 2020-08-28 | 2022-07-12 | Macdermid Enthone Inc. | Compositions and methods for the electrodeposition of nanotwinned copper |
| WO2023052254A1 (en) | 2021-10-01 | 2023-04-06 | Basf Se | Composition for copper electrodeposition comprising a polyaminoamide type leveling agent |
| WO2024008562A1 (en) | 2022-07-07 | 2024-01-11 | Basf Se | Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition |
| WO2024132828A1 (en) | 2022-12-19 | 2024-06-27 | Basf Se | A composition for copper nanotwin electrodeposition |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2441555A (en) | 1943-10-12 | 1948-05-18 | Heyden Chemical Corp | Mixed esters of polyhydric alcohols |
| GB602591A (en) | 1945-02-12 | 1948-05-31 | Du Pont | Improvements in or relating to the electro-deposition of metals |
| US3956079A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4505839A (en) | 1981-05-18 | 1985-03-19 | Petrolite Corporation | Polyalkanolamines |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| SU1055781A1 (ru) * | 1982-03-22 | 1983-11-23 | Ленинградский ордена Трудового Красного Знамени технологический институт целлюлозно-бумажной промышленности | Водный электролит блест щего меднени |
| US4487853A (en) * | 1983-12-27 | 1984-12-11 | Basf Wyandotte Corporation | Low ethylene oxide/high primary hydroxyl content polyether-ester polyols and polyurethane foams based thereon |
| JPS62182295A (ja) * | 1985-08-07 | 1987-08-10 | Daiwa Tokushu Kk | 銅メツキ浴組成物 |
| DE4003243A1 (de) | 1990-02-03 | 1991-08-08 | Basf Ag | Verwendung von trialkanolaminpolyethern als demulgatoren von oel-in-wasser-emulsionen |
| US5888373A (en) * | 1997-06-23 | 1999-03-30 | Industrial Technology Research Institute | Method for repairing nickel-zinc-copper or nickel-zinc alloy electroplating solutions from acidic waste solutions containing nickel and zinc ions and electroplating thereof |
| DE10033433A1 (de) * | 2000-07-10 | 2002-01-24 | Basf Ag | Verfahren zur elektrolytischen Verzinkung aus alkansulfonsäurehaltigen Elektrolyten |
| KR100852636B1 (ko) | 2000-10-13 | 2008-08-18 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 | 시드 보충 및 전기도금조 |
| US20020074242A1 (en) * | 2000-10-13 | 2002-06-20 | Shipley Company, L.L.C. | Seed layer recovery |
| JP3899313B2 (ja) * | 2000-10-19 | 2007-03-28 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 銅浴および無光沢銅被膜の電着方法 |
| US6776893B1 (en) * | 2000-11-20 | 2004-08-17 | Enthone Inc. | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
| DE10107880B4 (de) | 2001-02-20 | 2007-12-06 | Clariant Produkte (Deutschland) Gmbh | Alkoxylierte Polyglycerine und ihre Verwendung als Emulsionsspalter |
| EP1422320A1 (en) | 2002-11-21 | 2004-05-26 | Shipley Company, L.L.C. | Copper electroplating bath |
| DE10325198B4 (de) | 2003-06-04 | 2007-10-25 | Clariant Produkte (Deutschland) Gmbh | Verwendung von alkoxylierten vernetzten Polyglycerinen als biologisch abbaubare Emulsionsspalter |
| US20050133376A1 (en) | 2003-12-19 | 2005-06-23 | Opaskar Vincent C. | Alkaline zinc-nickel alloy plating compositions, processes and articles therefrom |
| CN101080513A (zh) | 2004-11-29 | 2007-11-28 | 技术公司 | 近中性pH值的锡电镀溶液 |
| US20060213780A1 (en) | 2005-03-24 | 2006-09-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electroplating composition and method |
| RU2282682C1 (ru) * | 2005-04-28 | 2006-08-27 | Российский химико-технологический университет им. Д.И. Менделеева | Электролит и способ меднения |
| MY142392A (en) | 2005-10-26 | 2010-11-30 | Malaysian Palm Oil Board | A process for preparing polymers of polyhydric alcohols |
| US20070178697A1 (en) * | 2006-02-02 | 2007-08-02 | Enthone Inc. | Copper electrodeposition in microelectronics |
| RU2385366C1 (ru) * | 2008-12-15 | 2010-03-27 | Федеральное государственное образовательное учреждение высшего профессионального образования Российский государственный университет им. Иммануила Канта | Электролит меднения стальных подложек |
| SG174265A1 (en) | 2009-04-07 | 2011-10-28 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| SG174393A1 (en) | 2009-04-07 | 2011-11-28 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| WO2010115717A1 (en) | 2009-04-07 | 2010-10-14 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
-
2010
- 2010-07-16 WO PCT/EP2010/060276 patent/WO2011012462A2/en not_active Ceased
- 2010-07-16 JP JP2012522093A patent/JP5714581B2/ja active Active
- 2010-07-16 US US13/387,776 patent/US9869029B2/en active Active
- 2010-07-16 MY MYPI2012000302A patent/MY157126A/en unknown
- 2010-07-16 SG SG2012003315A patent/SG177685A1/en unknown
- 2010-07-16 KR KR1020127004870A patent/KR101752018B1/ko active Active
- 2010-07-16 SG SG10201404394QA patent/SG10201404394QA/en unknown
- 2010-07-16 EP EP10731757.0A patent/EP2459778B1/en active Active
- 2010-07-16 RU RU2012107133/02A patent/RU2539897C2/ru not_active IP Right Cessation
- 2010-07-16 CN CN201080033647.4A patent/CN102597329B/zh active Active
- 2010-07-30 TW TW099125535A patent/TWI487813B/zh active
-
2012
- 2012-01-15 IL IL217536A patent/IL217536A/en active IP Right Grant