JP2013226625A - Grinding method and grinding device - Google Patents

Grinding method and grinding device Download PDF

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JP2013226625A
JP2013226625A JP2012100859A JP2012100859A JP2013226625A JP 2013226625 A JP2013226625 A JP 2013226625A JP 2012100859 A JP2012100859 A JP 2012100859A JP 2012100859 A JP2012100859 A JP 2012100859A JP 2013226625 A JP2013226625 A JP 2013226625A
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grinding
load
workpiece
plate
feed
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JP5886680B2 (en
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Yukiko Kikawa
有希子 木川
Osamu Miura
修 三浦
Masaaki Nagashima
政明 長嶋
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Disco Corp
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Disco Corp
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Abstract

PROBLEM TO BE SOLVED: To control a grinding feed means so that a grinding wheel does not lose its spontaneous edge-sharpening action in case a plate-like workpiece formed of hard-to-be-ground material is subjected to grinding.SOLUTION: A grinding method including use of a grinding device 1 includes: a first grinding feed step, in which, when a loading value of a grinding wheel 15 acting on a plate-like workpiece W has reached a predetermined threshold value, a control section 7 brings a grinding feed means 20 to raise a grinding means 10 at a prescribed grinding feed velocity; and a second grinding feed step in which, when, due to the raise, the loading value of the grinding wheel 15 acting on the plate-like workpiece W is found to have no load, the control section 7 brings the grinding feed means 20 to lower the grinding means 10 at a predetermined grinding feed velocity. The first grinding feed step and the second grinding feed step are alternately repeatedly performed. Consequently, even if the plate-like workpiece W formed of a hard-to-be-ground material is put to grinding, the grinding wheel 15 is free from losing its spontaneous edge-sharpening action, with the resultant continuation of grinding being performed on the plate-like workpiece W.

Description

本発明は、難研削材料により形成される被加工物に対して研削加工を施す研削方法及び当該研削方法を実施することができる研削装置に関する。   The present invention relates to a grinding method for grinding a workpiece formed of a difficult-to-grind material and a grinding apparatus capable of performing the grinding method.

板状ワークを研削する研削装置では、保持テーブルにおいて板状ワークを保持し、板状ワークに研削砥石を接触させて板状ワークを所定の厚みに研削している。板状ワークの研削中は、保持テーブルが回転するとともに、研削砥石を備えた研削手段が回転しながら所定の速度で保持テーブルに向かう方向に研削送りされる。   In a grinding apparatus for grinding a plate-like workpiece, the plate-like workpiece is held on a holding table, and a grinding wheel is brought into contact with the plate-like workpiece to grind the plate-like workpiece to a predetermined thickness. During the grinding of the plate-like workpiece, the holding table rotates and the grinding means provided with the grinding wheel rotates and feeds in a direction toward the holding table at a predetermined speed.

被加工物である板状ワークが難研削材料(例えば、サファイア,シリコンカーバイトなど)により形成されている場合は、研削手段を所定の研削送り速度で研削送りして板状ワークを研削しても、板状ワークが希望どおりの厚みに減じられず、研削砥石が板状ワークを押し付けている状態となり、研削砥石を回転させるモータに過剰な回転負荷がかかることになる。このような問題に対応し、下記の特許文献1では、被加工物の加工時に生じる圧力をモータにかかる回転負荷として検知し、加工送り速度を制御する研磨装置が提案されている。また、下記の特許文献2では、スピンドルのラジアル方向あるいはスラスト方向におけるエアーの圧力差を検出して加工送り速度を制御する加工装置が提案されている。   When the plate-like workpiece, which is the workpiece, is formed of a difficult-to-grind material (for example, sapphire, silicon carbide, etc.), the grinding means is ground and fed at a predetermined grinding feed speed to grind the plate-like workpiece However, the plate-shaped workpiece is not reduced to a desired thickness, and the grinding wheel presses the plate-shaped workpiece, and an excessive rotational load is applied to the motor that rotates the grinding wheel. In response to such a problem, the following Patent Document 1 proposes a polishing apparatus that detects a pressure generated during processing of a workpiece as a rotational load applied to a motor and controls a processing feed rate. Patent Document 2 below proposes a machining apparatus that detects a pressure difference of air in a radial direction or a thrust direction of a spindle and controls a machining feed rate.

特開2001−138219号公報JP 2001-138219 A 特開2008−49445号公報JP 2008-49445 A

しかしながら、上記のように研削砥石にかかる圧力をモータにかかる回転負荷として検知する制御では、板状ワークに研削砥石を押し付け、板状ワークに荷重がかかった後に、研削砥石を回転させるモータの回転負荷として検知するため、荷重がかかってから回転負荷を検知するまでにタイムラグがある。そのため、荷重がかかった後も研削手段をさらに研削送りして板状ワークに研削砥石を押し付けてしまい、研削砥石に目つぶれが生じてしまう。その結果、研削砥石の自生発刃作用が失われて板状ワークを研削できなくなることがある。   However, in the control for detecting the pressure applied to the grinding wheel as a rotational load applied to the motor as described above, the rotation of the motor that rotates the grinding wheel after the grinding wheel is pressed against the plate-like work and the load is applied to the plate-like work. Since it is detected as a load, there is a time lag between when a load is applied and when a rotational load is detected. Therefore, even after the load is applied, the grinding means is further fed by grinding and the grinding wheel is pressed against the plate-like workpiece, and the grinding wheel is crushed. As a result, the self-sharpening action of the grinding wheel may be lost and the plate workpiece may not be ground.

本発明は、上記の事情にかんがみてなされたものであり、研削砥石によって難研削材料により形成される板状ワークを研削する際に、当該研削砥石が自生発刃作用を失わないよう研削送りを制御することに発明の解決すべき課題を有している。   The present invention has been made in view of the above circumstances, and when grinding a plate-like workpiece formed of a difficult-to-grind material with a grinding wheel, grinding feed is performed so that the grinding wheel does not lose its self-generated blade action. Control has problems to be solved by the invention.

第1の発明は、板状ワークを保持する保持テーブルと、保持テーブルに保持された板状ワークに研削砥石を接触させて板状ワークを研削する研削手段と、保持テーブルに接近する方向及び保持テーブルから離間する方向に研削手段を研削送りする研削送り手段とを備えた研削装置を用いる研削方法に関し、保持テーブルまたは研削手段には、研削手段を研削送り手段によって研削送りする際に板状ワークにかかる研削荷重を検出する荷重検出手段が配設され、研削送り手段が研削手段を下降させ研削砥石を保持テーブルに保持された板状ワークに接触させ、さらに研削手段を所定の研削送り速度で下降させることによって荷重検出手段が検出する荷重値が所定のしきい値に達したときに、研削送り手段によって研削手段を所定の速度で上昇させる第1の研削送り工程と、第1の研削送り工程において研削手段を上昇させることにより荷重検出手段が検出する荷重値が無負荷となったときには、研削送り手段によって該研削手段を所定の研削送り速度で下降させる第2の研削送り工程とを備え、第1の研削送り工程と該第2の研削送り工程とを交互に繰り返し行う。   The first invention is a holding table for holding a plate-like workpiece, a grinding means for grinding a plate-like workpiece by bringing a grinding wheel into contact with the plate-like workpiece held on the holding table, and a direction approaching and holding the holding table The present invention relates to a grinding method using a grinding apparatus including a grinding feed means for grinding and feeding a grinding means in a direction away from a table. The holding table or the grinding means includes a plate-like workpiece when the grinding means is ground and fed by the grinding feed means. Load detecting means for detecting the grinding load is disposed, the grinding feed means lowers the grinding means to bring the grinding wheel into contact with the plate-like workpiece held on the holding table, and the grinding means is moved at a predetermined grinding feed speed. When the load value detected by the load detecting means reaches a predetermined threshold value by lowering, the grinding means is raised at a predetermined speed by the grinding feed means. When the load value detected by the load detecting means becomes no load by raising the grinding means in the first grinding feed process and the first grinding feed process, the grinding means is used to perform predetermined grinding. A second grinding feed step for lowering the feed rate, and the first grinding feed step and the second grinding feed step are alternately repeated.

第2の発明は、板状ワークを保持する保持テーブルと、保持テーブルに保持された板状ワークを研削する研削手段と、保持テーブルに接近する方向及び保持テーブルから離間する方向に研削手段を研削送りする研削送り手段とを備える研削装置に関し、保持テーブルまたは研削手段に配設され、研削手段を研削送り手段によって研削送りする際に板状ワークにかかる研削荷重を検出する荷重検出手段と、荷重検出手段が検出する荷重値が所定のしきい値に達したときに、研削送り手段により研削手段を所定の速度で上昇させ、研削手段の上昇によって荷重検出手段が検出する荷重値が無負荷となったときに、研削送り手段により研削手段を所定の速度で下降させ、研削送り手段による研削手段の上昇と下降とを交互に繰り返す制御を行う制御部とを備える。   According to a second aspect of the present invention, there is provided a holding table for holding a plate-like work, a grinding means for grinding the plate-like work held by the holding table, and a grinding means in a direction approaching the holding table and a direction away from the holding table. A load detecting means for detecting a grinding load applied to a plate-like workpiece when the grinding means is ground and fed by the grinding feed means; When the load value detected by the detecting means reaches a predetermined threshold value, the grinding means is raised at a predetermined speed by the grinding feed means, and the load value detected by the load detecting means by the rising of the grinding means is no load. Control when the grinding means is lowered at a predetermined speed by the grinding feed means and the grinding means is lifted and lowered alternately by the grinding feed means. Provided with a door.

第1の発明は、保持テーブルと、板状ワークを研削する研削手段と、研削手段を研削送りする研削送り手段とを備えた研削装置を用いる研削方法であって、保持テーブルまたは研削手段に、研削手段に装着される研削砥石により板状ワークを研削する際に板状ワークにかかる研削荷重を検出する荷重検出手段が配設されており、研削手段が所定の研削送り速度で下降することによって荷重検出手段が検出する荷重値が所定のしきい値に達したときに研削送り手段によって研削手段を所定の速度で上昇させる第1の研削送り工程と、該第1の研削送り工程において該研削手段を上昇させることにより該荷重検出手段が検出する荷重値が無負荷であるときに該研削送り手段によって該研削手段を所定の研削送り速度で下降させる第2の研削送り工程とを備えているため、板状ワークにかかる研削荷重に応じて研削送り手段による研削手段の研削送りを制御することができ、荷重がかかってから研削手段が上昇するまでにタイムラグがないため、研削砥石に目つぶれが発生して研削砥石の自生発刃作用が失われることがない。また、第1の研削送り工程と第2の研削送り工程とを交互に繰り返して板状ワークを研削するため、研削砥石の自生発刃作用を確保しながら研削を行うことができ、被加工物が難研削材料により形成される板状ワークであったとしても、継続して研削を行うことができる。   A first invention is a grinding method using a grinding apparatus comprising a holding table, a grinding means for grinding a plate-like workpiece, and a grinding feed means for grinding and feeding the grinding means, and the holding table or the grinding means includes: A load detecting means for detecting a grinding load applied to the plate-like workpiece when the plate-like workpiece is ground by the grinding wheel mounted on the grinding means is provided, and the grinding means is lowered at a predetermined grinding feed speed. A first grinding feed step of raising the grinding means at a predetermined speed by the grinding feed means when the load value detected by the load detection means reaches a predetermined threshold, and the grinding in the first grinding feed step A second grinding feeder that lowers the grinding means at a predetermined grinding feed speed by the grinding feed means when the load value detected by the load detection means is unloaded by raising the means Therefore, the grinding feed of the grinding means by the grinding feed means can be controlled according to the grinding load applied to the plate-like workpiece, and there is no time lag until the grinding means rises after the load is applied. The grinding wheel is not clogged and the self-generated blade action of the grinding wheel is not lost. Further, since the plate-like workpiece is ground by alternately repeating the first grinding feed step and the second grinding feed step, grinding can be performed while ensuring the self-generated blade action of the grinding wheel. Even if it is a plate-like workpiece formed of a difficult-to-grind material, grinding can be continued.

第2の発明は、研削手段を研削送り手段によって研削送りする際に板状ワークにかかる研削荷重を検出する荷重検出手段と、荷重検出手段が検出する荷重値が所定のしきい値に達したときに、研削送り手段により研削手段を所定の速度で上昇させ、研削手段の上昇によって荷重検出手段が検出する荷重値が無負荷となったときに、研削送り手段により研削手段を所定の速度で下降させ、研削送り手段による研削手段の上昇と下降とを交互に繰り返す制御を行う制御部とを備えるため、荷重検出手段が検出する荷重値が所定のしきい値に達したときには研削手段を所定の研削送り速度で上昇させ、この上昇により荷重検出手段が検出する荷重値が無負荷となったときには研削手段を下降させることができ、かかる制御を繰り返し行うことができるため、難研削材料により形成される板状ワークについても、研削砥石の自生発刃作用を確保しながら継続して研削を行うことができる。   According to a second aspect of the present invention, there is provided a load detecting means for detecting a grinding load applied to the plate-like workpiece when the grinding means is fed by the grinding feed means, and the load value detected by the load detecting means has reached a predetermined threshold value. Sometimes, the grinding means is raised at a predetermined speed by the grinding feed means, and when the load value detected by the load detection means becomes no load due to the rising of the grinding means, the grinding means is moved at the predetermined speed by the grinding feed means. And a control unit that performs control to alternately and repeatedly raise and lower the grinding means by the grinding feed means. When the load value detected by the load detection means reaches a predetermined threshold value, the grinding means is predetermined. When the load value detected by the load detection means becomes no load due to this increase, the grinding means can be lowered, and such control can be repeated. Therefore, for the plate-shaped workpiece formed by the flame grinding material, it is possible to perform grinding continued while securing the self-sharpening action of the grinding wheel.

研削装置の構成を示す断面図である。It is sectional drawing which shows the structure of a grinding device. 研削方法の手順を示すフローチャートである。It is a flowchart which shows the procedure of the grinding method. 研削送りによる研削手段の高さ位置と研削荷重値との関係を示すグラフである。It is a graph which shows the relationship between the height position of the grinding means by grinding feed, and a grinding load value.

図1に示す研削装置1は、各種材料により形成される板状ワークWに研削を施す研削装置である。研削装置1は、Y軸方向にのびる基台100と、基台100の端部からZ軸方向にのびる立設基台101とを備えている。研削装置1には、板状ワークWを保持する保持テーブル2と、保持テーブル2に保持された板状ワークWを研削する研削手段10と、該保持テーブル2に接近する方向及び該保持テーブル2から離間する方向に研削手段10を研削送りする研削送り手段20とを備えている。   A grinding apparatus 1 shown in FIG. 1 is a grinding apparatus that performs grinding on a plate-like workpiece W formed of various materials. The grinding apparatus 1 includes a base 100 extending in the Y-axis direction and a standing base 101 extending from the end of the base 100 in the Z-axis direction. The grinding apparatus 1 includes a holding table 2 for holding the plate-like workpiece W, a grinding means 10 for grinding the plate-like workpiece W held on the holding table 2, a direction approaching the holding table 2, and the holding table 2 And a grinding feed means 20 that feeds the grinding means 10 in a direction away from the grinding means 10.

基台100の上面には、回転可能なターンテーブル3が配設されている。ターンテーブル3の中央部分には、Z軸方向の軸心を有する回転軸4が配設されている。保持テーブル2は、テーブルベース2aと、テーブルベース2aの上面側に配設された保持部2bとを備え、保持部2bの表面は板状ワークWを吸引保持する保持面2cとなっている。保持テーブル2は、支持部2dの一端をターンテーブル3に連結し、他端をテーブルベース2aの下端に連結することによって、ターンテーブル3上において支持されている。そして、ターンテーブル3が回転すると、保持テーブル2を公転させることができる。   A rotatable turntable 3 is disposed on the upper surface of the base 100. A rotation shaft 4 having an axis in the Z-axis direction is disposed at the center portion of the turntable 3. The holding table 2 includes a table base 2a and a holding portion 2b disposed on the upper surface side of the table base 2a. The surface of the holding portion 2b is a holding surface 2c that holds the plate-like workpiece W by suction. The holding table 2 is supported on the turntable 3 by connecting one end of the support portion 2d to the turntable 3 and connecting the other end to the lower end of the table base 2a. And when the turntable 3 rotates, the holding table 2 can be revolved.

テーブルベース2aの中央部下端には、吸引源9に連通する吸引路が内部に形成された回転軸8が連結されている。回転軸8にはベルト30が巻回され、このベルト30は、モータ31の回転軸にも巻回されており、モータ31による駆動により、チャックテーブル2を、例えば矢印A方向に回転させることができる。   A rotary shaft 8 having a suction path communicating with the suction source 9 is connected to the lower end of the center of the table base 2a. A belt 30 is wound around the rotating shaft 8, and this belt 30 is also wound around the rotating shaft of the motor 31. By driving the motor 31, the chuck table 2 can be rotated in the direction of arrow A, for example. it can.

図1に示すように、立設基台101の側方において、研削送り手段20を介して研削手段10が配設されている。研削手段10は、Z軸方向の軸心Cを有するスピンドル11と、スピンドル11を回転可能に支持するスピンドルハウジング12と、スピンドル11の下端にマウンタ13を介して装着された研削ホイール14と、研削ホイール14の下部に環状に固着された複数の研削砥石15と、スピンドルハウジング12の内部においてスピンドル11に連結された図示していないモータとを備えている。そして、研削手段10においては、モータによって研削ホイール14を回転させることができる。   As shown in FIG. 1, the grinding means 10 is disposed on the side of the standing base 101 via the grinding feed means 20. The grinding means 10 includes a spindle 11 having an axis C in the Z-axis direction, a spindle housing 12 that rotatably supports the spindle 11, a grinding wheel 14 that is mounted on the lower end of the spindle 11 via a mounter 13, A plurality of grinding wheels 15 fixed in an annular shape to the lower part of the wheel 14 and a motor (not shown) connected to the spindle 11 inside the spindle housing 12 are provided. And in the grinding means 10, the grinding wheel 14 can be rotated with a motor.

研削手段10の側部には、研削手段10を昇降移動させる研削送り手段20が配設されている。研削送り手段20は、Z軸方向にのびる回動可能なボールネジ21と、ボールネジ21の上端に接続されたモータ22と、ボールネジ21を回動可能に支持する軸支部23と、スピンドルハウジング12の側部に取り付けられ研削手段10を昇降させる移動基台24とを備えている。研削送り手段20は、モータ22の駆動によりボールネジ21を回動させることにより移動基台24をZ軸方向に移動させ、研削手段10もZ軸方向に移動させることができる。   A grinding feed means 20 that moves the grinding means 10 up and down is disposed on the side of the grinding means 10. The grinding feed means 20 includes a rotatable ball screw 21 extending in the Z-axis direction, a motor 22 connected to the upper end of the ball screw 21, a shaft support 23 that rotatably supports the ball screw 21, and the spindle housing 12 side. And a moving base 24 that moves up and down the grinding means 10. The grinding feed means 20 can move the moving base 24 in the Z-axis direction by rotating the ball screw 21 by driving the motor 22, and can also move the grinding means 10 in the Z-axis direction.

図1に示すように、支持部2dの上端側には、保持テーブル2に保持された板状ワークWを研削する際に、板状ワークWにかかる研削荷重を検出する荷重検出手段5が取り付けられている。この荷重検出手段5は、テーブルベース2bの下端に接触しており、保持テーブル2が回転可能となるように接している。荷重検出手段5は、圧電方式の荷重測定に用いられる圧電素子を備えており、当該圧電素子は、研削砥石15により板状ワークWにかけられる圧力を受けると、電圧を発生することができる。荷重検出手段5は、この電圧を板状ワークWにかかる荷重値として検出することができる。例えば、保持テーブル2の下端の三箇所にそれぞれ荷重検出手段5を取り付けることができる。また、荷重検出手段5は、研削手段10の内部、例えばスピンドル11を支持するスピンドルハウジング12とスピンドル11との鉛直方向の間に配設する構成でもよい。   As shown in FIG. 1, a load detecting means 5 for detecting a grinding load applied to the plate-like workpiece W when the plate-like workpiece W held on the holding table 2 is ground is attached to the upper end side of the support portion 2d. It has been. The load detecting means 5 is in contact with the lower end of the table base 2b so that the holding table 2 can be rotated. The load detection means 5 includes a piezoelectric element used for piezoelectric load measurement. When the piezoelectric element receives pressure applied to the plate-like workpiece W by the grinding wheel 15, it can generate a voltage. The load detection means 5 can detect this voltage as a load value applied to the plate-like workpiece W. For example, the load detecting means 5 can be attached to three positions at the lower end of the holding table 2. Further, the load detecting means 5 may be arranged inside the grinding means 10, for example, between the spindle housing 12 supporting the spindle 11 and the spindle 11 in the vertical direction.

荷重検出手段5には、荷重検出手段5によって検出した荷重値が研削装置1にあらかじめ設定されたしきい値に達しているか否かを判断する判断部6が接続されている。さらに、判断部6の判断結果に基づき、研削送り手段20による研削手段10の昇降動作を交互に繰り返すように制御する制御部7が、判断部6と研削送り手段20とに接続されている。   A determination unit 6 is connected to the load detection unit 5 to determine whether or not the load value detected by the load detection unit 5 has reached a threshold value preset in the grinding device 1. Furthermore, based on the determination result of the determination unit 6, a control unit 7 that controls the grinding unit 10 to repeat the lifting and lowering operation of the grinding unit 10 alternately is connected to the determination unit 6 and the grinding feed unit 20.

以下においては、上記の如く構成される研削装置1を用い、図2に示すフローチャートに沿って、板状ワークWを研削する手順について説明する。研削対象となる板状ワークWは、例えば、サファイア,シリコンカーバイトなどの難研削材料により形成されている。   Below, the procedure which grinds the plate-shaped workpiece | work W using the grinding apparatus 1 comprised as mentioned above is demonstrated along the flowchart shown in FIG. The plate-like workpiece W to be ground is made of a difficult-to-grind material such as sapphire or silicon carbide.

図1に示す研削装置1においては、研削手段10により板状ワークWにかけられ荷重検出手段5によって検出される研削荷重のしきい値を、例えば100Nとして予め判断部6に設定しておく。そして、板状ワークWにかかる研削砥石15の荷重値がしきい値に達したときには、研削送り手段20が研削送り速度0.5mm/sで研削手段10を上昇させるように制御部7に予め設定しておく。また、板状ワークWにかかる研削砥石15の荷重値が無負荷(0N)となったときには、研削送り手段20が研削送り速度0.5mm/sで研削手段10を下降させるように制御部7に予め設定しておく。研削送り手段20の制御は、制御部7によって行われる。   In the grinding apparatus 1 shown in FIG. 1, the threshold value of the grinding load applied to the plate-like workpiece W by the grinding means 10 and detected by the load detection means 5 is set in the determination unit 6 in advance as 100 N, for example. Then, when the load value of the grinding wheel 15 applied to the plate-like workpiece W reaches a threshold value, the control unit 7 is previously set so that the grinding feed means 20 raises the grinding means 10 at a grinding feed speed of 0.5 mm / s. Set it. Further, when the load value of the grinding wheel 15 applied to the plate-like workpiece W becomes no load (0 N), the control unit 7 causes the grinding feed means 20 to lower the grinding means 10 at a grinding feed speed of 0.5 mm / s. Set in advance. The control of the grinding feed means 20 is performed by the control unit 7.

図1に示すように、研削装置1では、板状ワークWが保持テーブル2に吸引保持されるともに、保持テーブル2が例えば、矢印A方向に回転する。また、これと同時にターンテーブル3が回転し、保持テーブル2を研削手段10の下方に位置づける。   As shown in FIG. 1, in the grinding apparatus 1, the plate-like workpiece W is sucked and held by the holding table 2, and the holding table 2 rotates in the direction of arrow A, for example. At the same time, the turntable 3 rotates to position the holding table 2 below the grinding means 10.

次に、研削送り手段20が研削手段10を保持テーブル2に保持された板状ワークWに向けて下降させる。このとき、制御部7は、例えば、研削送り速度10mm/sで研削手段10が下降するように研削送り手段20を制御する。そして、保持テーブル2に保持された板状ワークWに研削砥石15が接触した時点で板状ワークWの研削を開始する。図1に示した板状ワークWに研削砥石15が接触すると、荷重検出手段5が板状ワークWにかかる研削荷重の荷重値の検出を行う。   Next, the grinding feed means 20 lowers the grinding means 10 toward the plate-like workpiece W held on the holding table 2. At this time, the control unit 7 controls the grinding feed unit 20 so that the grinding unit 10 descends at a grinding feed rate of 10 mm / s, for example. Then, the grinding of the plate-like workpiece W is started when the grinding wheel 15 comes into contact with the plate-like workpiece W held on the holding table 2. When the grinding wheel 15 comes into contact with the plate-like workpiece W shown in FIG. 1, the load detection means 5 detects the load value of the grinding load applied to the plate-like workpiece W.

研削作業が開始されると、図1に示した判断部6は、荷重検出手段5の値を読み出し、板状ワークWにかかる研削荷重の荷重値が無負荷であるかどうかを判断する(ステップS1)。   When the grinding operation is started, the determination unit 6 shown in FIG. 1 reads the value of the load detection means 5 and determines whether or not the load value of the grinding load applied to the plate-like workpiece W is unloaded (step). S1).

そして、判断部6が荷重値が無負荷でないと判断すると、制御部7による制御の下で、研削送り手段20が研削手段10を所定速度で上昇させ、板状ワークWと研削砥石15とを非接触状態とする(ステップS4)。   When the determination unit 6 determines that the load value is not unloaded, under the control of the control unit 7, the grinding feed unit 20 raises the grinding unit 10 at a predetermined speed, and the plate-like workpiece W and the grinding wheel 15 are moved. A non-contact state is set (step S4).

一方、荷重値が無負荷であると判断すると、研削送り手段20が研削手段10を所定速度で下降させ、板状ワークWに研削砥石15を接触させて研削を行う(ステップS2、第2の研削送り工程)。そして、研削を行いながら、判断部6が荷重検出手段5の荷重値を読み続け、その荷重値が所定のしきい値に達するか否かを判断する(ステップS3)。   On the other hand, if it is determined that the load value is unloaded, the grinding feed means 20 lowers the grinding means 10 at a predetermined speed, and the grinding workpiece 15 is brought into contact with the plate workpiece W to perform grinding (step S2, second step). Grinding feed process). Then, while grinding, the determination unit 6 continues to read the load value of the load detection means 5 and determines whether or not the load value reaches a predetermined threshold value (step S3).

読み出した荷重値が所定のしきい値に達していないときは、研削送り手段20が研削手段10をさらに下降させ、板状ワークWの研削を続行する(ステップS2)。   When the read load value does not reach the predetermined threshold value, the grinding feed means 20 further lowers the grinding means 10 and continues grinding the plate-like workpiece W (step S2).

一方、読み出した荷重値が所定のしきい値に達したときは、研削送り手段20が研削手段10を所定の速度で上昇させる(ステップS4、第1の研削送り工程)。そして、判断部6が、第1の研削送り工程における研削手段10の上昇と第2の研削送り工程における研削手段10の下降とを繰り返すための時間があるかないかを判断する(ステップS5)。   On the other hand, when the read load value reaches a predetermined threshold value, the grinding feed means 20 raises the grinding means 10 at a predetermined speed (step S4, first grinding feed process). Then, the determination unit 6 determines whether or not there is time to repeat the raising of the grinding means 10 in the first grinding feed process and the lowering of the grinding means 10 in the second grinding feed process (step S5).

判断部6により、繰り返すための時間がないと判断されると、制御部7は、研削送り手段20に研削手段10を上昇させ研削を終了する。   When the determination unit 6 determines that there is no time to repeat, the control unit 7 raises the grinding unit 10 to the grinding feed unit 20 and ends the grinding.

一方、判断部6が、繰り返すための時間があると判断すると、ステップS1に戻り、板状ワークWにかかる研削荷重の荷重値が無負荷であれば研削手段10を下降させ(ステップS2、第2の研削送り工程)、荷重値が無負荷でなければ研削手段10を上昇させる(ステップS4、第1の研削送り工程)。このようにして、制御部7による制御の下で、研削荷重の値に基づき、第1の研削送り工程と第2の研削送り工程とを交互に繰り返す。   On the other hand, when the determination unit 6 determines that there is a time to repeat, the process returns to step S1 and if the load value of the grinding load applied to the plate-like workpiece W is no load, the grinding means 10 is lowered (step S2, first step). 2), if the load value is no load, the grinding means 10 is raised (step S4, first grinding feed step). In this manner, the first grinding feed process and the second grinding feed process are alternately repeated based on the value of the grinding load under the control of the control unit 7.

このような手順にて板状ワークWを研削すると、研削手段10の高さ位置と研削荷重値とは、例えば図3に示す関係の下で推移する。   When the plate-like workpiece W is ground in such a procedure, the height position of the grinding means 10 and the grinding load value change under the relationship shown in FIG. 3, for example.

図3に沿って説明すると、制御開始時t0から研削送り手段20が研削手段10を下降させていき、研削砥石15が板状ワークWに接触して研削開始時t1において研削が開始されると、さらに研削手段10が下降していく(フェーズZ0)。研削を行いながら研削手段10が下降するフェーズZ0においては、研削荷重の値は徐々に上昇していく(フェーズL0)。   Explaining along FIG. 3, when the grinding feed means 20 lowers the grinding means 10 from the control start time t0, and when the grinding wheel 15 comes into contact with the plate-like workpiece W and grinding starts at the grinding start time t1. Further, the grinding means 10 descends (phase Z0). In phase Z0 in which the grinding means 10 descends while grinding, the value of the grinding load gradually increases (phase L0).

こうして研削荷重の値が上昇していくことにより、切替え時t2において研削荷重の値が所定のしきい値に達する。そうすると、研削手段10が上昇に転じ(フェーズZ1、第1の研削送り工程)、研削荷重の値が下がっていく(フェーズL1)。   As the grinding load value increases in this way, the grinding load value reaches a predetermined threshold value at the time of switching t2. Then, the grinding means 10 starts to rise (phase Z1, first grinding feed step), and the grinding load value decreases (phase L1).

フェーズZ1において研削手段10が上昇していき、研削砥石15が板状ワークWに接触しなくなると、研削荷重は、切替え時t3において0(無負荷)になる。そうすると、研削手段10が下降に転じ(フェーズZ2、第2の研削送り工程)研削荷重の値は上昇する(フェーズL2)。   When the grinding means 10 rises in phase Z1 and the grinding wheel 15 does not come into contact with the plate-like workpiece W, the grinding load becomes 0 (no load) at the time of switching t3. Then, the grinding means 10 turns downward (phase Z2, second grinding feed step), and the value of the grinding load increases (phase L2).

こうして研削荷重が上昇して切替え時t2’においてしきい値に達すると、研削手段10が上昇に転じ(フェーズZ1’、第1の研削送り工程)、研削荷重の値が下がっていく(フェーズL1’)。   Thus, when the grinding load increases and reaches the threshold value at the time of switching t2 ′, the grinding means 10 starts to increase (phase Z1 ′, first grinding feed process), and the value of the grinding load decreases (phase L1). ').

フェーズZ1’において研削手段10が上昇していき、研削砥石15が板状ワークWに接触しなくなると、研削荷重は、切替え時t3’おいて無負荷になる。そうすると、研削手段10が下降に転じ(フェーズZ2’、第2の研削送り工程)研削荷重の値は上昇する(フェーズL2’)。   When the grinding means 10 rises in phase Z1 'and the grinding wheel 15 does not contact the plate-like workpiece W, the grinding load becomes no load at the time of switching t3'. Then, the grinding means 10 turns downward (phase Z2 ', second grinding feed step), and the value of the grinding load increases (phase L2').

研削荷重の値が上昇し、タイムアウト時t4においてしきい値に達すると、研削手段10が上昇に転じる。そして、第1の研削送り工程と第2の研削送り工程との繰り返し時間がゼロになり、さらに研削手段10が上昇し、研削を終了する。   When the value of the grinding load increases and reaches the threshold value at time-out t4, the grinding means 10 starts to increase. And the repetition time of a 1st grinding feed process and a 2nd grinding feed process becomes zero, and also the grinding means 10 raises and grinding is complete | finished.

このように、研削装置1では、荷重検出手段5で板状ワークWにかかる研削荷重を検出しながら、制御部7が研削送り手段20の研削送りを制御することができる。そして、第1の研削送り工程において研削荷重の値が所定のしきい値に達したと判断部6が判断したときには所定の研削送り速度で研削手段10を上昇させて研削を中断し、第2の研削送り工程ではこの上昇により研削荷重の荷重値が無負荷になったと判断部6が判断したときには所定の研削送り速度で研削手段10を下降させて研削を再開することができ、このようにして研削の中断と再開とを交互に繰り返し行いながら板状ワークWを研削することができる。したがって、研削砥石15を回転させるモータに過剰な回転負荷がかかって研削砥石15が自生発刃作用を失うのを防止することができ、被加工物が難研削材料により形成される板状ワークであったとしても継続して研削を行うことができる。   Thus, in the grinding apparatus 1, the control unit 7 can control the grinding feed of the grinding feed means 20 while detecting the grinding load applied to the plate-like workpiece W by the load detection means 5. When the determination unit 6 determines that the value of the grinding load has reached a predetermined threshold value in the first grinding feed step, the grinding means 10 is raised at a predetermined grinding feed speed to interrupt the grinding, and the second In this grinding feed process, when the judgment unit 6 judges that the load value of the grinding load has become unloaded due to this increase, the grinding means 10 can be lowered at a predetermined grinding feed speed to resume grinding. Thus, the plate-like workpiece W can be ground while alternately repeating grinding interruption and resumption. Therefore, it is possible to prevent the grinding wheel 15 from losing its self-generated blade action due to an excessive rotational load applied to the motor that rotates the grinding wheel 15, and the workpiece is a plate-like workpiece formed of a difficult-to-grind material. Even if there is, grinding can be continued.

1:研削装置 100:基台 101:立設基台
2:保持テーブル
2a:テーブルベース 2b:保持部 2c:保持面 2d:支持部
3:ターンテーブル
4:回転軸
5:荷重検出手段
6:判断部
7:制御部
8:回転軸
9:吸引源
10:研削手段 11:スピンドル 12:スピンドルハウジング 13:マウンタ
14:研削ホイール 15:研削砥石
20:研削送り手段 21:ボールネジ 22:モータ 23:軸支部 24:移動基台
30:ベルト 31:モータ
1: Grinding device 100: Base 101: Standing base 2: Holding table 2a: Table base 2b: Holding portion 2c: Holding surface 2d: Supporting portion 3: Turntable 4: Rotating shaft 5: Load detecting means 6: Determination Unit 7: Control unit 8: Rotating shaft 9: Suction source 10: Grinding means 11: Spindle 12: Spindle housing 13: Mounter 14: Grinding wheel 15: Grinding wheel 20: Grinding feed means 21: Ball screw 22: Motor 23: Shaft support 24: Moving base 30: Belt 31: Motor

Claims (2)

板状ワークを保持する保持テーブルと、該保持テーブルに保持された板状ワークに研削砥石を接触させて該板状ワークを研削する研削手段と、該保持テーブルに接近する方向及び該保持テーブルから離間する方向に該研削手段を研削送りする研削送り手段と、を備えた研削装置を用いる研削方法であって、
該保持テーブルまたは該研削手段には、該研削手段を該研削送り手段によって研削送りする際に該板状ワークにかかる研削荷重を検出する荷重検出手段が配設され、
該研削送り手段が該研削手段を下降させ該研削砥石を該保持テーブルに保持された板状ワークに接触させ、さらに該研削手段を所定の研削送り速度で下降させることによって該荷重検出手段が検出する荷重値が所定のしきい値に達したときに、該研削送り手段によって該研削手段を所定の速度で上昇させる第1の研削送り工程と、
該第1の研削送り工程において該研削手段を上昇させることにより該荷重検出手段が検出する荷重値が無負荷となったときには、該研削送り手段によって該研削手段を所定の研削送り速度で下降させる第2の研削送り工程と、を備え、
該第1の研削送り工程と該第2の研削送り工程とを交互に繰り返し行う研削方法。
A holding table for holding the plate-like workpiece; a grinding means for grinding the plate-like workpiece by bringing a grinding wheel into contact with the plate-like workpiece held on the holding table; and a direction approaching the holding table and the holding table A grinding method using a grinding device comprising: a grinding feed means for grinding and feeding the grinding means in a separating direction;
The holding table or the grinding means is provided with a load detection means for detecting a grinding load applied to the plate-like workpiece when the grinding means is ground and fed by the grinding feed means.
The load detection means detects the grinding means by lowering the grinding means to bring the grinding wheel into contact with the plate-like workpiece held on the holding table, and further lowering the grinding means at a predetermined grinding feed speed. A first grinding feed step of raising the grinding means at a predetermined speed by the grinding feed means when a load value to be reached reaches a predetermined threshold;
When the load value detected by the load detection means becomes no load by raising the grinding means in the first grinding feed step, the grinding means is lowered at a predetermined grinding feed speed by the grinding feed means. A second grinding feed step,
A grinding method in which the first grinding feed step and the second grinding feed step are alternately repeated.
板状ワークを保持する保持テーブルと、該保持テーブルに保持された板状ワークを研削する研削手段と、該保持テーブルに接近する方向及び該保持テーブルから離間する方向に該研削手段を研削送りする研削送り手段と、を備える研削装置であって、
該保持テーブルまたは該研削手段に配設され、該研削手段を該研削送り手段によって研削送りする際に該板状ワークにかかる研削荷重を検出する荷重検出手段と、
該荷重検出手段が検出する荷重値が所定のしきい値に達したときに、該研削送り手段により該研削手段を所定の速度で上昇させ、該研削手段の上昇によって該荷重検出手段が検出する荷重値が無負荷となったときに、該研削送り手段により該研削手段を所定の速度で下降させ、該研削送り手段による該研削手段の上昇と下降とを交互に繰り返す制御を行う制御部と、
を備えた研削装置。
A holding table for holding a plate-like workpiece, a grinding means for grinding the plate-like workpiece held on the holding table, and grinding-feeding the grinding means in a direction approaching the holding table and a direction away from the holding table A grinding device comprising a grinding feed means,
A load detecting means which is disposed on the holding table or the grinding means and detects a grinding load applied to the plate-like workpiece when the grinding means is ground and fed by the grinding feed means;
When the load value detected by the load detecting means reaches a predetermined threshold value, the grinding means is raised at a predetermined speed by the grinding feed means, and the load detecting means detects by the rising of the grinding means. A control unit that controls the grinding means to lower the grinding means at a predetermined speed when the load value becomes no load, and alternately and repeatedly raises and lowers the grinding means by the grinding feed means; ,
Grinding device equipped with.
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JP7431589B2 (en) 2020-01-17 2024-02-15 株式会社ディスコ processing equipment
DE102021211670A1 (en) 2020-10-29 2022-05-05 Disco Corporation WAFER GRINDING PROCESS
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