JP2017056516A - Surface grinding method of workpiece and surface grinder - Google Patents

Surface grinding method of workpiece and surface grinder Download PDF

Info

Publication number
JP2017056516A
JP2017056516A JP2015183134A JP2015183134A JP2017056516A JP 2017056516 A JP2017056516 A JP 2017056516A JP 2015183134 A JP2015183134 A JP 2015183134A JP 2015183134 A JP2015183134 A JP 2015183134A JP 2017056516 A JP2017056516 A JP 2017056516A
Authority
JP
Japan
Prior art keywords
grinding
load
speed
grindstone
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015183134A
Other languages
Japanese (ja)
Other versions
JP6510374B2 (en
Inventor
一裕 勇惣
Kazuhiro Yuso
一裕 勇惣
佳弘 栗岡
Yoshihiro KURIOKA
佳弘 栗岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JTEKT Machine Systems Corp
Original Assignee
Koyo Machine Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koyo Machine Industries Co Ltd filed Critical Koyo Machine Industries Co Ltd
Priority to JP2015183134A priority Critical patent/JP6510374B2/en
Priority to US15/236,667 priority patent/US20170072529A1/en
Priority to KR1020160115480A priority patent/KR102573501B1/en
Priority to TW105129696A priority patent/TWI703010B/en
Priority to CN201610824809.5A priority patent/CN106881639B/en
Publication of JP2017056516A publication Critical patent/JP2017056516A/en
Application granted granted Critical
Publication of JP6510374B2 publication Critical patent/JP6510374B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a surface grinding method and a surface grinder capable of efficiently grinding hard-brittle material, hardly grind material and other workpiece with a properly high load.SOLUTION: When a grinding load is raised while monitoring the grinding load upon surface grinding of a workpiece by means of a grinding stone, a cutting speed of the grind stone is reduced and, when the grinding load is lowered, the cutting speed is increased. Corresponding to a plurality of respective load thresholds of grinding load, such respective cutting speeds that, as the grinding load gets to larger, the cutting speed of grinding stone gets to slower are preset, the grinding is started at a prescribed speed and, thereafter, every time when the grinding load is raised/lowered to a prescribed threshold, the speed of grinding stone is reduce/increased up to the corresponding cutting speed.SELECTED DRAWING: Figure 5

Description

本発明は、ワークを平面研削するワークの平面研削方法及び平面研削盤に関するものである。   The present invention relates to a surface grinding method and a surface grinding machine for surface grinding a workpiece.

カップ型の砥石を備えた平面研削盤において、半導体素子の製造に用いるシリコンウェーハ等の硬脆材料のワークを研削する際に、砥石軸駆動モータの負荷電流をモニタリングしながら、砥石軸の先端の砥石を所定の切込速度で切込んで回転テーブル上のワークのインフィード研削を行い、砥石の目詰まりにより砥石軸駆動モータの負荷電流が所定閾値を超えたときに、砥石を退避させて研削を中断した後、砥石を再度切込んでワークに接触させることにより砥石の自生を促すようにしている(特許文献1)。   In a surface grinder equipped with a cup-type grindstone, when grinding a work made of hard and brittle materials such as silicon wafers used for manufacturing semiconductor elements, the load current of the grindstone shaft drive motor is monitored and the tip of the grindstone shaft is Grinding the grindstone by retracting the grindstone when the load current of the grindstone shaft drive motor exceeds the specified threshold due to clogging of the grindstone, cutting the grindstone at a predetermined cutting speed and performing in-feed grinding of the work on the rotary table. After the operation is interrupted, the grindstone is cut again and brought into contact with the workpiece to promote self-growth of the grindstone (Patent Document 1).

特開2006−35406号公報JP 2006-35406 A

このような従来の研削法では、砥石を所定の切込速度で切込んで行く一方、研削中の砥石に目詰まりが生じたときに砥石を一旦退避させて研削を中断し、その後に砥石を再度切込んで砥石の自生を促すようにしている。このため砥石の研削効率の高い高負荷状態でワークを研削することができない上に、研削サイクルが長くなり、ワークを短時間で能率良く研削することが困難であった。   In such a conventional grinding method, the grindstone is cut at a predetermined cutting speed, but when the grindstone being ground becomes clogged, the grindstone is temporarily retracted and the grinding is interrupted. It cuts again to encourage the self-growth of the grindstone. For this reason, the workpiece cannot be ground in a high load state where the grinding efficiency of the grindstone is high, and the grinding cycle becomes long, making it difficult to efficiently grind the workpiece in a short time.

また特許文献1の研削法以外の従来の研削法においても、研削時に砥石をワークに対して一定の切込速度で切込んで行く研削法と、砥石の切込送り量に応じて粗研削送り、中仕上げ研削送り、仕上げ研削送りと送り速度を順次減速方向に変速させながら研削する研削法(以下、通常研削法という)とがある。   Also, in conventional grinding methods other than the grinding method of Patent Document 1, a grinding method in which a grinding wheel is cut into a workpiece at a constant cutting speed during grinding, and a rough grinding feed according to the cutting feed amount of the grinding stone. There is a grinding method (hereinafter, referred to as a normal grinding method) in which grinding is carried out while the intermediate finish grinding feed, the finish grinding feed and the feed speed are sequentially shifted in the deceleration direction.

しかし、前者の研削法では、研削中に砥石の摩耗量とワークの除去量と砥石の切込量とのバランスが崩れて、研削負荷が急激に上昇したり砥石のみが摩耗したりするようなことがあって、砥石の研削効率の良い高負荷状態でワークを能率良く安定的に研削することが困難であった。   However, with the former grinding method, the balance between the wear amount of the grinding wheel, the removal amount of the workpiece and the cutting amount of the grinding wheel is lost during grinding, so that the grinding load increases rapidly or only the grinding wheel is worn. For this reason, it has been difficult to efficiently and stably grind the workpiece in a high load state where the grinding wheel is efficiently ground.

また後者の研削法でも、次のような理由から、砥石の研削効率の良い高負荷状態で能率良く安定的にワークを研削することはできなかった。特に硬度が高く脆い硬脆材料のワークを研削する際には、砥石の切込によって過負荷状態にならないように砥石の送り速度を変速しながら研削するため、砥石の切込速度を遅くして長時間をかけて研削する必要がある。   Even in the latter grinding method, the workpiece could not be efficiently and stably ground in a high load state with good grinding efficiency of the grindstone for the following reasons. Especially when grinding a hard and brittle material with high hardness and brittleness, the grinding wheel is cut while changing the feed speed of the grinding wheel so as not to be overloaded by the grinding of the grinding wheel. It is necessary to grind for a long time.

しかし、このような硬脆材料の場合には、研削中に砥石表面の自生(目替わり)が何度か起こり、研削負荷が大きく上下に変化する。これは、自生前は砥石の切れ味が悪いのに対して、一旦砥石の自生が起これば、砥石の切れ刃が増えて切れ味が急に良くなるためである。その結果、砥石とワークとの摩擦係数が変化することとなり、研削負荷が大きく上下に変化するため、研削効率の良い高負荷で短時間に能率良く安定的に研削することはできない。   However, in the case of such a hard and brittle material, the surface of the grindstone is self-generated (changed) several times during grinding, and the grinding load changes greatly up and down. This is because the sharpness of the grindstone is poor before self-growth, but once the self-growth of the grindstone occurs, the cutting edge of the grindstone increases and the sharpness sharply improves. As a result, the friction coefficient between the grindstone and the workpiece changes, and the grinding load changes greatly up and down. Therefore, it is impossible to efficiently and stably grind in a short time with a high load with good grinding efficiency.

また自生中は摩擦熱の増加による砥石、ワーク、機械の急激な熱変位により、砥石軸と回転テーブルとの軸方向の距離が小さくなることが多い。これは、砥石の切込速度が上がっているのと同じであり、研削負荷が激しく上昇する要因となる。そして、研削負荷が上昇し過ぎると、異常な研削負荷を検知して機械が加工を終了したり、最悪の場合には砥石、ワークが損傷し、又は機械が損傷する等の惧れがある。   Further, during self-growth, the axial distance between the grindstone shaft and the rotary table often decreases due to rapid thermal displacement of the grindstone, workpiece, and machine due to an increase in frictional heat. This is the same as increasing the cutting speed of the grindstone, and causes a sharp increase in grinding load. If the grinding load increases too much, an abnormal grinding load may be detected and the machine may finish processing, or in the worst case, the grindstone or workpiece may be damaged, or the machine may be damaged.

本発明は、このような従来の問題点に鑑み、硬脆材料、難削材料、その他のワークを適度な高負荷で能率的に研削できると共に、研削負荷の急激な上昇等によるワークや砥石、更には機械の損傷を防止でき、しかも砥石摩耗を少なくできるワークの平面研削方法及び平面研削盤を提供することを目的とするものである。   In view of such conventional problems, the present invention can efficiently grind hard and brittle materials, difficult-to-cut materials, and other workpieces with an appropriate high load, and a workpiece or a grindstone caused by a sudden increase in grinding load, Furthermore, it is an object of the present invention to provide a surface grinding method and a surface grinding machine that can prevent damage to a machine and reduce grinding wheel wear.

本発明に係るワークの平面研削方法は、砥石によりワークを平面研削するに際し、研削負荷を監視しながら、研削負荷が上昇するに伴って砥石の切込速度を減速するものである。   The surface grinding method for a workpiece according to the present invention reduces the cutting speed of the grinding wheel as the grinding load increases while the grinding load is monitored when the workpiece is surface ground with the grinding stone.

また別の本発明に係るワークの平面研削方法は、砥石によりワークを平面研削するに際し、研削負荷を監視しながら、研削負荷が上昇したときに砥石の切込速度を減速し、研削負荷が低下したときに切込速度を増速するものである。   In another surface grinding method for a workpiece according to the present invention, when grinding a workpiece with a grindstone, the grinding load is reduced when the grinding load is increased while the grinding load is monitored, and the grinding load is lowered. When it is done, the cutting speed is increased.

なお、研削負荷の複数の各負荷閾値に対応して、研削負荷が大になるほど砥石の切込速度が遅くなる各切込速度を設定しておき、所定速度で研削を開始した後、研削負荷が所定の負荷閾値に上昇・低下するたびに砥石を対応する切込速度に減速・増速してもよい。   In addition, corresponding to each load threshold of the grinding load, each cutting speed at which the cutting speed of the grindstone becomes slower as the grinding load increases is set, and after starting grinding at a predetermined speed, the grinding load Each time is increased / decreased to a predetermined load threshold, the grindstone may be decelerated / accelerated to the corresponding cutting speed.

また砥石の切込時の最大の負荷閾値よりも高い戻し負荷閾値を設定しておき、研削負荷が戻し負荷閾値を超えたときに砥石を所定の戻し速度で戻しながら研削してもよい。スパークアウト前に砥石の切込と戻しとを繰り返してもよい。   Alternatively, a return load threshold higher than the maximum load threshold at the time of cutting of the grindstone may be set, and grinding may be performed while returning the grindstone at a predetermined return speed when the grinding load exceeds the return load threshold. You may repeat cutting and returning of a grindstone before a spark out.

更に研削負荷が速度制限実行用の負荷閾値を超えたときに、その後に研削負荷が所定の切込速度の負荷閾値に低下しても所定の切込速度よりも遅い制限切込速度で砥石を切込、制限切込速度以上に速くしないようにしてもよい。   Furthermore, when the grinding load exceeds the load threshold for speed limit execution, even if the grinding load subsequently drops to the load threshold for the predetermined cutting speed, the grindstone is moved at a limited cutting speed that is slower than the predetermined cutting speed. You may make it not make it cut faster than the cutting and the limit cutting speed.

本発明に係る平面研削盤は、砥石によりワークをインフィード研削する平面研削盤であって、研削中の砥石の研削負荷を測定する研削負荷測定手段と、複数の負荷閾値に対応して複数の砥石の切込速度が設定された速度設定手段と、研削中の研削負荷と負荷閾値とを比較しながら研削負荷の上昇、低下に伴って砥石の切込速度が減速、増速するように各負荷閾値を基準として各負荷閾値に対応する切込速度で砥石を増減速させる速度制御手段とを備えたものである。   A surface grinder according to the present invention is a surface grinder for infeed grinding a workpiece with a grindstone, and includes a grinding load measuring means for measuring a grinding load of a grindstone being ground, and a plurality of load thresholds corresponding to a plurality of load thresholds. Compare the speed setting means with the grinding wheel cutting speed and the grinding load and load threshold during grinding so that the grinding wheel cutting speed decreases and increases as the grinding load increases and decreases. Speed control means for increasing and decelerating the grindstone at a cutting speed corresponding to each load threshold with reference to the load threshold.

本発明によれば、硬脆材料、難削材料、その他のワークを適度な高負荷で能率的に研削できると共に、研削負荷の急激な上昇等によるワークや砥石、更には機械の損傷を防止でき、しかも砥石摩耗を少なくできる利点がある。   According to the present invention, hard and brittle materials, difficult-to-cut materials, and other workpieces can be efficiently ground with a moderately high load, and damage to the workpiece, the grindstone, and the machine due to a sharp increase in the grinding load can be prevented. In addition, there is an advantage that grinding wheel wear can be reduced.

本発明の第1の実施形態を示す平面研削盤の正面図である。It is a front view of the surface grinding machine which shows the 1st Embodiment of this invention. 同要部の斜視図である。It is a perspective view of the principal part. 同制御系のブロック図である。It is a block diagram of the control system. 同速度テーブルである。It is the same speed table. 同研削動作のフローチャートである。It is a flowchart of the grinding operation. 同研削負荷の変化等を示す図である。It is a figure which shows the change of the grinding load, etc. 本発明の第2の実施形態を示す制御系のブロック図である。It is a block diagram of a control system showing a second embodiment of the present invention. 同研削動作のフローチャートである。It is a flowchart of the grinding operation. 同速度テーブルである。It is the same speed table. 同研削負荷の変化を示す図である。It is a figure which shows the change of the grinding load. 本発明の第3の実施形態を示す制御系のブロック図である。It is a block diagram of a control system showing a third embodiment of the present invention. 同第1速度テーブルである。It is the same 1st speed table. 同第2速度テーブルである。It is the 2nd speed table. 本発明の第4の実施形態を示す速度テーブルである。It is a speed table which shows the 4th Embodiment of this invention. 本発明の第5の実施形態を示すブロック図である。It is a block diagram which shows the 5th Embodiment of this invention. 同速度変更の波形図である。It is a wave form diagram of the same speed change.

以下、本発明の実施形態を図面に基づいて詳述する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図1〜図6は本願発明の第1の実施形態を例示する。サファイアウェーハ等の硬脆材料のワークWをカップ型の砥石1によりインフィード研削する際に使用する平面研削盤2は、図1、図2に示すように、上面にワークWが着脱自在に装着される回転テーブル3と、この回転テーブル3を上下方向の軸心廻りにa矢印方向に回転駆動するモータ等のワーク駆動手段4と、回転テーブル3上に上下動自在に配置される砥石軸5と、砥石軸5を上下方向の軸心廻りにb矢印方向に回転駆動するモータ等の砥石駆動手段6と、砥石軸5の下端に着脱自在に装着され且つb矢示方向の回転により回転テーブル3上のワークWを平面研削する砥石1と、砥石軸5を介して砥石1を上下方向の切込方向c及び戻し方向dに送る砥石送り手段7とを備えている。なお、回転テーブル3、砥石1の回転方向は任意である。   1 to 6 illustrate a first embodiment of the present invention. As shown in FIGS. 1 and 2, the surface grinder 2 used when in-feed grinding a work W made of a hard and brittle material such as a sapphire wafer with the cup-type grindstone 1 detachably mounts the work W on the upper surface. A rotating table 3, a work driving means 4 such as a motor for rotating the rotating table 3 around the vertical axis in the direction of arrow a, and a grindstone shaft 5 arranged on the rotary table 3 so as to be movable up and down. And a grindstone driving means 6 such as a motor for rotating the grindstone shaft 5 in the direction of arrow b around the vertical axis, and a rotary table that is detachably attached to the lower end of the grindstone shaft 5 and rotated in the direction of arrow b. 3 is provided with a grindstone 1 for surface-grinding the workpiece W on 3 and a grindstone feeding means 7 for feeding the grindstone 1 in a vertical cutting direction c and a return direction d via a grindstone shaft 5. In addition, the rotation direction of the rotary table 3 and the grindstone 1 is arbitrary.

図3は平面研削盤2の研削動作を制御する制御系を示す。この制御系は平面研削盤2のインフィード研削に関連する一般的研削動作を制御するNC制御手段9の他に、例えば定寸制御手段10と砥石切込戻し制御手段11とを有する。   FIG. 3 shows a control system for controlling the grinding operation of the surface grinding machine 2. The control system includes, for example, a sizing control means 10 and a grindstone cutting back control means 11 in addition to the NC control means 9 for controlling a general grinding operation related to the infeed grinding of the surface grinder 2.

定寸制御手段10は研削中のワークWの寸法を寸法測定手段12で測定し、所定のスパークアウト時期になったときに砥石送り手段7にスパークアウト指令を出して、スパークアウトによりワークWを所定寸法精度に仕上げるように制御する。   The sizing control means 10 measures the dimensions of the workpiece W being ground by the dimension measuring means 12, and issues a spark out command to the grindstone feeding means 7 when the predetermined spark out time comes, and the workpiece W is moved by the spark out. Control to finish to a predetermined dimensional accuracy.

なお、砥石送り手段7はスパークアウト指令があれば、その位置で砥石1がワークWの加工を続けるように砥石軸5の送りを停止させる。定寸制御手段10がない場合には、ワークWの研削開始から所定の切込量に達したり、所定時間が経過したときにスパークアウト指令を出すようにしても良い。   If there is a spark-out command, the grindstone feeding means 7 stops the grindstone shaft 5 feed so that the grindstone 1 continues to process the workpiece W at that position. When there is no fixed size control means 10, a spark-out command may be issued when a predetermined cutting amount is reached from the start of grinding of the workpiece W or when a predetermined time has elapsed.

砥石切込戻し制御手段11は、ワークWの研削中の研削負荷を監視しながら、砥石1が研削効率の高い適度な高負荷でワークWを能率的に研削するように砥石1の切込、戻しを制御するためのもので、研削負荷の上昇に伴って砥石1の切込速度を減速する機能と、研削負荷が上限付近まで上昇したときに砥石1の切込と戻しとを繰り返す機能と、研削負荷の低下に伴って砥石1を増速する機能とを有する。   The grindstone cutting back control means 11 cuts the grindstone 1 so that the grindstone 1 efficiently grinds the workpiece W with an appropriate high load with high grinding efficiency while monitoring the grinding load during grinding of the workpiece W. A function for controlling the return, a function of reducing the cutting speed of the grindstone 1 as the grinding load increases, and a function of repeating the cutting and returning of the grindstone 1 when the grinding load rises to near the upper limit. And a function of increasing the speed of the grindstone 1 as the grinding load decreases.

この砥石切込戻し制御手段11は、具体的には研削中の砥石1の研削負荷を測定する研削負荷測定手段13と、負荷閾値毎に砥石1の切込速度、戻し速度を設定する速度設定手段14と、研削中の実際の研削負荷と負荷閾値とを比較してその研削負荷の増減に応じて速度設定手段14で設定された切込速度、戻し速度で砥石送り手段7を制御する速度制御手段15とを有する。   The grinding wheel cutting / returning control means 11 is specifically a grinding load measuring means 13 for measuring the grinding load of the grinding wheel 1 during grinding, and a speed setting for setting the cutting speed and the returning speed of the grinding wheel 1 for each load threshold. The speed at which the grindstone feeding means 7 is controlled by the cutting speed and the return speed set by the speed setting means 14 in accordance with the increase / decrease of the grinding load by comparing the means 14 with the actual grinding load during grinding and the load threshold. And control means 15.

研削負荷測定手段13は研削中の砥石1の研削負荷を砥石駆動手段6に流れる電流、電力又はトルク等の変化により測定するようになっている。速度設定手段14は図4に示すような速度テーブルを有する。速度テーブルには高速切込、早切込、中切込、遅切込、遅戻し、中戻し、早戻し、非常戻しの各動作毎に、研削負荷が段階的に増加する負荷閾値L1〜L7(N・m)と、その各負荷閾値L1〜L7(N・m)に対応して段階的に増減速する切込速度V0〜V7(mm/min)とが設定されている。   The grinding load measuring means 13 measures the grinding load of the grinding wheel 1 being ground by a change in current, power, torque, etc. flowing through the grinding wheel driving means 6. The speed setting means 14 has a speed table as shown in FIG. In the speed table, load thresholds L1 to L7 at which the grinding load increases step by step for each of high speed cutting, early cutting, middle cutting, slow cutting, slow return, middle return, fast return, and emergency return operations. (N · m) and cutting speeds V0 to V7 (mm / min) that increase and decrease in stages corresponding to the load threshold values L1 to L7 (N · m) are set.

高速切込は砥石1がワークWに接触して研削を開始する際の切込であり、その高速切込速度V0は0.5(mm/min)に設定されている。早切込は負荷閾値L1に対して早切込速度V1=0.3(mm/min)に、中切込は負荷閾値L2に対して中切込速度V2=0.1(mm/min)に、遅切込は負荷閾値L3に対して遅切込速度V3=0.05(mm/min)に夫々設定されている。   The high-speed cutting is a cutting when the grindstone 1 comes into contact with the workpiece W to start grinding, and the high-speed cutting speed V0 is set to 0.5 (mm / min). Early cutting is performed at an early cutting speed V1 = 0.3 (mm / min) with respect to the load threshold L1, and intermediate cutting is performed at an intermediate cutting speed V2 = 0.1 (mm / min) with respect to the load threshold L2. The slow cutting is set to a slow cutting speed V3 = 0.05 (mm / min) with respect to the load threshold L3.

また遅戻しは負荷閾値L4に対して遅戻し速度V4=−0.05(mm/min)に、中戻しは負荷閾値L5に対して中戻し速度V5=−0.1(mm/min)に、早戻しは負荷閾値L6に対して早戻し速度V6=−0.3(mm/min)に夫々設定されている。非常戻しは負荷閾値L7に対して戻し速度V7(全速)に設定されている。   Further, the slow return is a slow return speed V4 = −0.05 (mm / min) with respect to the load threshold L4, and the medium return is a medium return speed V5 = −0.1 (mm / min) with respect to the load threshold L5. The fast return is set to the fast return speed V6 = −0.3 (mm / min) with respect to the load threshold L6. The emergency return is set to the return speed V7 (full speed) with respect to the load threshold L7.

なお、戻しは切込に対して逆方向となるため、その遅戻し速度V4等の記載上、数値に−を付して逆方向に進む旨を示している。   In addition, since the return is in the reverse direction with respect to the cut, in order to describe the slow return speed V4 and the like, a numerical value is added to indicate that the process proceeds in the reverse direction.

各負荷閾値L1〜L7は、図6に負荷閾値L1〜L4について例示するように、負荷閾値L1から負荷閾値L7へと順次高くなる関係にある。研削負荷の各負荷閾値L1〜L7に対応する砥石1の切込速度V0〜V3、戻し速度V4〜V7は、ワークWの材質や大きさ、砥石1、平面研削盤2等の組み合わせを考慮して、砥石1が研削効率の高い適度な高負荷状態でワークWを能率的に研削できるように予め実験等により決められている。   Each of the load thresholds L1 to L7 has a relationship that increases sequentially from the load threshold L1 to the load threshold L7 as illustrated for the load thresholds L1 to L4 in FIG. The cutting speeds V0 to V3 and return speeds V4 to V7 of the grindstone 1 corresponding to the load thresholds L1 to L7 of the grinding load take into account the combination of the material and size of the workpiece W, the grindstone 1, the surface grinder 2, and the like. Thus, it is determined in advance by experiments or the like so that the grindstone 1 can efficiently grind the workpiece W in a moderately high load state with high grinding efficiency.

従って、高速切込、早切込、中切込、遅切込は、研削負荷が負荷閾値L1〜L3へと段階的に増加するに従って切込速度V1〜V3へと段階的に切込方向に減速するようになっている。また遅戻し、中戻し、早戻し、非常戻しは、研削負荷が負荷閾値L4〜L7へと段階的に増加するに従って戻し速度V4〜V7へと段階的に戻し方向に増速するようになっている。砥石1の戻し速度V4〜V7は、砥石1が切込方向とは逆方向に移動するため、砥石1が切込方向を基準にすれば、遅戻しから非常戻しへと段階的に減速すると云える。   Therefore, high-speed cutting, early cutting, medium cutting, and slow cutting are performed in the cutting direction stepwise toward the cutting speeds V1 to V3 as the grinding load increases stepwise to the load thresholds L1 to L3. It is designed to slow down. In addition, the slow return, middle return, fast return, and emergency return increase in the return direction stepwise from the return speed V4 to V7 as the grinding load increases stepwise from the load threshold L4 to L7. Yes. The return speeds V4 to V7 of the grindstone 1 are that the grindstone 1 moves in the direction opposite to the cutting direction, so that if the grindstone 1 is based on the cutting direction, it is decelerated stepwise from slow return to emergency return. Yeah.

なお、標準的なワークWに対応した標準的速度テーブルがある場合には、ワークWの材質等の違いに応じてその標準的速度テーブルの数値を読み出して、それに補正を加えながら制御するようにしても良い。   In addition, when there is a standard speed table corresponding to the standard work W, the numerical value of the standard speed table is read according to the difference in the material of the work W, etc., and the control is performed while correcting it. May be.

遅切込時の負荷閾値L3と遅戻し時の負荷閾値L4は、遅戻し時の負荷閾値L4の方が高くなっているが、負荷閾値L3を超えた後のスパークアウト前に遅切込と遅戻しとを複数回繰り返す場合には、例えば研削負荷が負荷閾値L3以上で負荷閾値L4未満のときに砥石1の遅切込を行い、負荷閾値L4以上のときに砥石1の遅戻しを行うように、負荷閾値L4を基準に砥石1の遅切込と遅戻しとを切替える。   The load threshold value L3 at the time of delay cutting and the load threshold value L4 at the time of delay return are higher than the load threshold value L4 at the time of delay return, but before the spark out after exceeding the load threshold L3, When repeating the slow return multiple times, for example, when the grinding load is equal to or higher than the load threshold L3 and lower than the load threshold L4, the grindstone 1 is delayed and when the grinding load is equal to or higher than the load threshold L4, the grindstone 1 is delayed. As described above, the slow cutting and the slow return of the grindstone 1 are switched based on the load threshold L4.

次に図5のフローチャートを参照しながらワークWの研削方法を説明する。平面研削盤2によるワークWのインフィード研削はNC制御手段9の制御により行う。平面研削盤2がインフィード研削の研削動作を開始すると(S1)、先ず砥石1がワークWに接触する直前までは、砥石送り手段7が高速切込速度V0よりも速い高速送り速度で砥石軸5を切込方向に送る。一方、寸法測定手段12により測定したワークWの寸法を測定し(S2)、研削負荷測定手段13により測定した研削負荷を測定し(S3)、定寸制御手段10がスパークアウト時期か否かを判断する(S4)。   Next, a method for grinding the workpiece W will be described with reference to the flowchart of FIG. In-feed grinding of the workpiece W by the surface grinding machine 2 is performed under the control of the NC control means 9. When the surface grinder 2 starts grinding operation for in-feed grinding (S1), the grindstone feeding means 7 is at a high speed feed speed higher than the high speed cutting speed V0 until the grindstone 1 first contacts the workpiece W. 5 is sent in the cutting direction. On the other hand, the dimension of the workpiece W measured by the dimension measuring means 12 is measured (S2), the grinding load measured by the grinding load measuring means 13 is measured (S3), and whether or not the sizing control means 10 is a spark-out time is determined. Judgment is made (S4).

研削動作の開始直後は、未だスパークアウト時期ではないので(S4)、研削負荷が早切込の負荷閾値L1未満か否かを判定し(S5)、砥石軸5の送り速度を高速送り速度から高速切込速度V0に減速して、その高速切込速度V0で砥石1がワークWを研削し始める(S6)。   Immediately after the start of the grinding operation, since it is not yet the spark-out time (S4), it is determined whether or not the grinding load is less than the load threshold L1 for early cutting (S5), and the feed speed of the grinding wheel shaft 5 is determined from the high speed feed speed. The speed is reduced to the high speed cutting speed V0, and the grindstone 1 starts grinding the workpiece W at the high speed cutting speed V0 (S6).

砥石1がワークWに接触するまでは高速切込速度V0よりも速い高速送り速度で砥石軸5を送り、砥石1がワークWに接触する直前に高速切込速度V0に減速することにより、エアーカット時間を短くして能率的にワークWの研削に移行することができる。   Until the grindstone 1 comes into contact with the workpiece W, the grindstone shaft 5 is fed at a high feed rate that is faster than the high-speed cutting speed V0, and immediately before the grindstone 1 comes into contact with the workpiece W, the air is decelerated to the high-speed cutting speed V0. The cutting time can be shortened to efficiently shift to grinding of the workpiece W.

砥石1がワークWに接触して研削を開始すると、砥石軸5にかかる研削負荷が上昇するが、研削負荷が負荷閾値L1未満の間は高速切込速度V0で砥石1を切込む(S6)。そして、高速切込速度V0での高速切込により研削負荷が上昇して負荷閾値L1以上で負荷閾値L2未満になれば(S5、S7)、砥石1の切込速度を高速切込速度V0から早切込速度V1に減速し(S8)、その早切込速度V1で砥石1を切込ながらワークWの研削を継続する。   When the grindstone 1 comes into contact with the workpiece W and starts grinding, the grinding load applied to the grindstone shaft 5 increases, but the grindstone 1 is cut at a high cutting speed V0 while the grinding load is less than the load threshold L1 (S6). . If the grinding load increases due to the high-speed cutting at the high-speed cutting speed V0 and becomes equal to or higher than the load threshold L1 and less than the load threshold L2 (S5, S7), the cutting speed of the grindstone 1 is changed from the high-speed cutting speed V0. The speed is reduced to the fast cutting speed V1 (S8), and the grinding of the workpiece W is continued while cutting the grindstone 1 at the fast cutting speed V1.

早切込速度V1での早切込により研削負荷が上昇して負荷閾値L2以上で負荷閾値L3未満になれば(S7、S9)、砥石1の切込速度を早切込速度V1から中切込の中切込速度V2に減速し(S10)、その中切込速度V2で砥石1を切込む。   If the grinding load increases due to the rapid cutting at the rapid cutting speed V1 and becomes equal to or greater than the load threshold L2 and less than the load threshold L3 (S7, S9), the cutting speed of the grindstone 1 is cut from the rapid cutting speed V1. The speed is reduced to the medium cutting speed V2 (S10), and the grindstone 1 is cut at the medium cutting speed V2.

また切込速度V2での中切込により研削負荷が上昇して負荷閾値L3以上で負荷閾値L4未満になれば(S9、S11)、砥石1の切込速度を中切込速度V2から遅切込の遅切込速度V3に減速し(S12)、その遅切込速度V3で砥石1を切込ながらワークWの研削を継続する。   Further, if the grinding load increases due to the medium cutting at the cutting speed V2 and becomes the load threshold L3 or more and less than the load threshold L4 (S9, S11), the cutting speed of the grindstone 1 is delayed from the medium cutting speed V2. The workpiece is decelerated to a slow cutting speed V3 (S12), and grinding of the workpiece W is continued while cutting the grindstone 1 at the slow cutting speed V3.

このように速い高速切込速度V0で研削を開始し、その後に研削負荷が負荷閾値L1から負荷閾値L2を経て負荷閾値L3以上まで上昇して行く間に、各負荷閾値L1〜L3毎に、砥石1を切込速度V1〜V3へと段階的に減速しながら切込んで行く。   Grinding is started at such a high speed cutting speed V0, and thereafter the grinding load increases from the load threshold L1 to the load threshold L3 through the load threshold L2, and for each load threshold L1 to L3, The grindstone 1 is cut while gradually decelerating to the cutting speeds V1 to V3.

なお、砥石1の遅切込中に負荷閾値L3未満になったときに(S9)、砥石1の切込速度を遅切込速度V3から中切込速度V2へと増速する(S10)等、研削負荷が低下すれば、その研削負荷の低下に伴って砥石1の切込速度を増速する。   In addition, when it becomes less than the load threshold L3 during the slow cutting of the grindstone 1 (S9), the cutting speed of the grindstone 1 is increased from the slow cutting speed V3 to the medium cutting speed V2 (S10), etc. If the grinding load is reduced, the cutting speed of the grindstone 1 is increased as the grinding load is reduced.

遅切込速度V3での研削中に研削負荷が上昇して負荷閾値L4以上で負荷閾値L5未満になれば(S11、S13)、遅切込速度V3での遅切込から遅戻し速度V4での遅戻しに切替えて砥石1を戻しながらワークWの研削を継続する(S14)。また遅戻しでの研削中に研削負荷が負荷閾値L4未満になれば(S11)、遅戻し速度V4での遅戻しから遅切込速度V3での遅切込に切り替えて砥石1を遅切込する(S12)。   If the grinding load increases during grinding at the slow cutting speed V3 and becomes greater than or equal to the load threshold L4 and less than the load threshold L5 (S11, S13), the slow cutting speed V3 to the slow return speed V4. The grinding of the workpiece W is continued while the grindstone 1 is returned by switching to the slow return (S14). Also, if the grinding load becomes less than the load threshold L4 during the grinding with the slow return (S11), the grindstone 1 is slowly cut by switching from the slow return at the slow return speed V4 to the slow cut at the slow cut speed V3. (S12).

従って、砥石1の研削負荷が負荷閾値L4付近の高負荷域になるまでワークWの研削が進めば、その後は負荷閾値L3、L4の上下で砥石1が遅切込と遅戻しとを1回又は複数回繰り返しながら、ワークWの終盤の研削を継続する。   Therefore, if the grinding of the workpiece W proceeds until the grinding load of the grindstone 1 reaches a high load range near the load threshold L4, then the grindstone 1 performs slow cutting and slow return once above and below the load thresholds L3 and L4. Alternatively, the grinding of the final stage of the workpiece W is continued while repeating a plurality of times.

この間にも定寸制御手段10がワークWの寸法を読み込んでおり、所定の仕上精度寸法に近いスパークアウト時期になれば(S4)、定寸制御手段10からのスパークアウトの指令に基づいて砥石送り手段7が砥石1の移動を停止させて、砥石1が停止位置でワークWを研削するスパークアウトを行う(S21)。そして、スパークアウトによりワークWが仕上げ寸法になれば研削を終了する(S22)。   During this time, the sizing control means 10 reads the dimensions of the workpiece W, and if the sparking time is close to the predetermined finishing accuracy dimension (S4), the grindstone is based on the spark-out command from the sizing control means 10. The feeding means 7 stops the movement of the grindstone 1, and the grindstone 1 performs a spark out for grinding the workpiece W at the stop position (S21). Then, when the workpiece W has a finished dimension due to the spark-out, the grinding is finished (S22).

なお、遅戻しでの研削中に研削負荷が負荷閾値L5以上で負荷閾値L6未満になれば(S13、S15)、中戻し速度V5で砥石1を戻しながら研削を継続し(S16)、更にその中戻し中に研削負荷が負荷閾値L6以上で負荷閾値L7未満になれば(S15、S17)、早戻し速度V6で砥石1を戻しながら研削を継続する(S18)。   If the grinding load is greater than or equal to the load threshold value L5 and less than the load threshold value L6 during grinding with slow return (S13, S15), grinding is continued while returning the grindstone 1 at the intermediate return speed V5 (S16), and further If the grinding load is greater than or equal to the load threshold L6 and less than the load threshold L7 during the middle return (S15, S17), the grinding is continued while returning the grindstone 1 at the fast return speed V6 (S18).

また研削負荷が負荷閾値L7以上になれば(S17)、非常戻し速度V7(全速)で非常戻しを行い(S19)、研削を中止する(S20)。そして、研削の中止後に、砥石1のドレッシング等を行って砥石1の切れ味を復活させる等の適宜措置を行う。   If the grinding load is equal to or greater than the load threshold L7 (S17), emergency return is performed at the emergency return speed V7 (full speed) (S19), and grinding is stopped (S20). Then, after the grinding is stopped, appropriate measures are taken such as performing dressing of the grindstone 1 to restore the sharpness of the grindstone 1.

このように高速切込速度V0で砥石1の高速切込を開始した後、砥石1の研削負荷の変動を監視しながら、その研削負荷が負荷閾値L1から負荷閾値L2を経て負荷閾値L3へと順次上昇するに伴って砥石1の切込速度を高速切込から早切込へ、早切込から中切込へ、中切込から遅切込へと順次減速する。   After starting the high-speed cutting of the grindstone 1 at the high-speed cutting speed V0 in this way, the grinding load is changed from the load threshold L1 to the load threshold L3 through the load threshold L2 while monitoring the fluctuation of the grinding load of the grindstone 1. As the speed increases, the cutting speed of the grindstone 1 is decelerated sequentially from high speed cutting to early cutting, from early cutting to middle cutting, and from middle cutting to slow cutting.

従って、このような研削法を採用することにより、砥石1の切込速度とワークWが砥石1により研削されて行く速度とが略一致するように、砥石1によりワークWを研削することが可能であり、研削効率の高い適度な高負荷を砥石1に加えた状態でワークWを能率的に研削することができる。   Therefore, by adopting such a grinding method, it is possible to grind the workpiece W by the grindstone 1 so that the cutting speed of the grindstone 1 and the speed at which the workpiece W is ground by the grindstone 1 substantially coincide. The workpiece W can be efficiently ground in a state where a moderately high load with high grinding efficiency is applied to the grindstone 1.

特に砥石1を高速で切込んで行くと、研削が進むに従ってワークWが砥石1により研削されて行く速度と砥石1の切込速度とが一致しなくなって、ワークW側に研削残りが生じ砥石1の研削負荷が異常に上昇する。その結果、高速切込状態のままで研削を続けると、ワークWに加わる負荷が過大となってワークWが割れる等の問題が生じる。しかし、研削負荷を監視しながら、研削負荷が上昇するに伴って砥石1の切込速度を減速するため、ワークWに過大な負荷が加わるようなことを防止できる。   In particular, when the grindstone 1 is cut at a high speed, the speed at which the workpiece W is ground by the grindstone 1 and the cutting speed of the grindstone 1 do not match as the grinding progresses, and a grinding residue is generated on the workpiece W side. 1 grinding load rises abnormally. As a result, if grinding is continued in a high-speed cutting state, the load applied to the workpiece W becomes excessive, causing problems such as the workpiece W breaking. However, since the cutting speed of the grindstone 1 is reduced as the grinding load increases while monitoring the grinding load, it is possible to prevent an excessive load from being applied to the workpiece W.

またワークWの研削の終盤では、研削負荷が負荷閾値L3以上に上昇して遅切込での研削中に、研削負荷がL4に上昇すれば砥石1を遅戻しに切り替えるため、遅切込と遅戻しを繰り返しながら高負荷状態でワークWを研削する。そのため砥石1の研削負荷が上昇し続けてワークWに過大な負荷が加わるようなことがなく、研削効率の高い適度な高負荷で研削を継続することができる。   Further, at the final stage of grinding the workpiece W, the grinding load is increased to the load threshold L3 or more and the grinding wheel 1 is switched to the slow return if the grinding load increases to L4 during the grinding with the slow cutting. Grinding the workpiece W under high load while repeating slow return. Therefore, the grinding load of the grindstone 1 does not continue to increase and an excessive load is not applied to the workpiece W, and grinding can be continued with a moderately high load with high grinding efficiency.

図6は実際にワークWを研削したときのワークWの研削負荷と寸法の変化を示す。Aは本発明の場合の研削開始からスパークアウト終了までの研削負荷の変化を示す研削負荷曲線であり、Bはその場合のワークWの寸法の変化を示す寸法曲線である。A1は従来の通常研削の場合の研削負荷曲線であり、B1はその場合のワークWの寸法の変化を示す寸法曲線である。   FIG. 6 shows changes in the grinding load and dimensions of the workpiece W when the workpiece W is actually ground. A is a grinding load curve showing a change in grinding load from the start of grinding to the end of spark out in the present invention, and B is a dimension curve showing a change in the size of the workpiece W in that case. A1 is a grinding load curve in the case of conventional normal grinding, and B1 is a dimensional curve showing a change in the dimension of the workpiece W in that case.

従来の通常研削では、過負荷にならないように砥石1の切込送り量によって粗研削送り、中仕上げ研削送り、仕上げ研削送りと砥石1の切込速度を制御しながら研削するため、図6の研削負荷曲線A1に示すように遅い切込速度で研削せざるを得ず、研削の進行と共に砥石1の研削負荷は上昇するものの、その勾配が緩やかである。従って、従来は砥石1の目詰まりが発生し易く研削効率を十分に発揮できない低負荷状態でワークWを研削するため、ワークWの研削サイクルが長くなって研削能率が悪い上に、研削温度が上昇する等の問題があった。   In conventional normal grinding, in order to avoid overloading, grinding is performed while controlling the rough grinding feed, intermediate finish grinding feed, finish grinding feed and the cutting speed of the grinding stone 1 according to the cutting feed amount of the grinding stone 1. As shown in the grinding load curve A1, grinding must be performed at a slow cutting speed, and the grinding load of the grindstone 1 increases with the progress of grinding, but the gradient is gentle. Therefore, conventionally, since the workpiece W is ground in a low load state in which the grinding stone 1 is likely to be clogged and the grinding efficiency cannot be sufficiently exhibited, the grinding cycle of the workpiece W becomes long, the grinding efficiency is poor, and the grinding temperature is low. There was a problem of rising.

一方、本発明では、図6の研削負荷曲線Aに示すように、砥石1の研削負荷を基準にその研削負荷が所定の負荷閾値になる毎に高速切込、早切込、中切込、遅切込の順で砥石1を順次減速しながら切込、遅切込と遅戻しとを数回繰り返してスパークアウトに移行する。   On the other hand, in the present invention, as shown in the grinding load curve A in FIG. 6, each time the grinding load reaches a predetermined load threshold based on the grinding load of the grindstone 1, high speed cutting, fast cutting, medium cutting, The grindstone 1 is gradually decelerated in the order of slow cutting, and cutting, slow cutting, and slow returning are repeated several times to shift to spark out.

そのため砥石1の研削負荷の上昇により砥粒の自生作用を促進できるので、高い研削効率でワークWを短時に研削することが可能であり、従来の通常研削よりも短い研削サイクルで能率的に研削できる。その結果、本発明での研削時間は従来の通常研削の場合に比較して約2/3程度に短縮でき、能率的な研削が可能であることが判った。また本発明では、研削効率の高い高負荷で能率的に研削するため、低い研削負荷で研削する通常研削の場合に比較して研削温度の上昇を防止できる。   Therefore, since the self-generated action of the abrasive grains can be promoted by increasing the grinding load of the grindstone 1, the workpiece W can be ground in a short time with high grinding efficiency, and the grinding can be efficiently performed with a grinding cycle shorter than conventional normal grinding. it can. As a result, it was found that the grinding time in the present invention can be shortened to about 2/3 as compared with the conventional normal grinding, and efficient grinding is possible. Further, in the present invention, since the grinding is efficiently performed with a high load with high grinding efficiency, an increase in the grinding temperature can be prevented as compared with the case of the normal grinding in which the grinding is performed with a low grinding load.

図7〜図10は本発明の第2の実施形態を例示する。この実施形態の砥石切込戻し制御手段11は速度制限実行機能を有し、図7に示すように、第1の実施形態と同様の研削負荷測定手段13、速度設定手段14、速度制御手段15の他に速度制限実行手段14Aを備えている。   7-10 illustrate a second embodiment of the present invention. The grindstone cutting back control means 11 of this embodiment has a speed limit execution function. As shown in FIG. 7, the grinding load measuring means 13, the speed setting means 14, and the speed control means 15 are the same as those of the first embodiment. In addition, a speed limit execution means 14A is provided.

この速度制限実行手段14Aは砥石1の研削負荷が速度制限実行の負荷閾値LAを越えたときには、その後に研削負荷が遅切込の負荷閾値L3未満に低下しても、砥石1の切込速度を遅切込速度V3(=0.05mm/min)よりも遅い制限切込速度Vα(=0.03mm/min)に制限する速度制限を実行する機能を有する。   When the grinding load of the grindstone 1 exceeds the load threshold LA for executing the speed limitation, the speed limiting execution means 14A is capable of cutting the grinding wheel 1 even if the grinding load subsequently drops below the slow cutting load threshold L3. Has a function of executing a speed limit to limit the speed to a limit cut speed Vα (= 0.03 mm / min) slower than the slow cut speed V3 (= 0.05 mm / min).

速度テーブルは図9に示すように構成されており、研削負荷が負荷閾値L1〜L3へと段階的に高くなるに従って砥石1の切込速度V1〜V3へと段階的に減速し、研削負荷が遅戻し時の負荷閾値L4まで上昇したときに砥石1を遅戻し速度V4(=−0.05mm/min)で戻し、速度制限実行時の負荷閾値LAまで上昇したときに制限切込速度Vα(=0.03mm/min)に制限し、研削中断時の負荷閾値LXまで上昇したときに研削を中断させるようになっている。   The speed table is configured as shown in FIG. 9, and the grinding load is gradually reduced to the cutting speeds V1 to V3 of the grindstone 1 as the grinding load increases stepwise to the load thresholds L1 to L3. The grindstone 1 is returned at the slow return speed V4 (= −0.05 mm / min) when the speed rises to the load threshold L4 at the time of slow return, and the limit cutting speed Vα ( = 0.03 mm / min), and grinding is interrupted when the load threshold LX at the time of grinding interruption is increased.

ワークWのインフィード研削に際しては、図8に示すように、研削負荷が研削中止時の負荷閾値LX以上か否かを判定し(S23)、負荷閾値LX以上であれば研削を中止する(S24)。また研削負荷が負荷閾値LX未満のときには、それまでに研削負荷が速度制限実行時の負荷閾値LA以上になったことがあるか否かを確認し(S25)、一度でもあれば研削負荷が負荷閾値L4未満でも(S26)、砥石1を制限切込速度Vα(=0.03mm/min)に制限する(S27)。負荷閾値LA以上になったことがなければ、その研削負荷を負荷閾値L1と比較して(S28)、負荷閾値L1未満であれば高速切込の切込速度V0とする(S29)。そして、研削負荷が負荷閾値L1以上のときには、負荷閾値L2と比較して負荷閾値L2未満のときには(S30)、早切込の切込速度V1とする(S31)。   In the in-feed grinding of the workpiece W, as shown in FIG. 8, it is determined whether or not the grinding load is equal to or greater than the load threshold LX when grinding is stopped (S23). If the grinding load is equal to or greater than the load threshold LX, grinding is stopped (S24). ). When the grinding load is less than the load threshold LX, it is checked whether the grinding load has exceeded the load threshold LA when the speed limit is executed until that time (S25). Even if it is less than the threshold value L4 (S26), the grindstone 1 is limited to the limited cutting speed Vα (= 0.03 mm / min) (S27). If the load threshold LA has not been exceeded, the grinding load is compared with the load threshold L1 (S28), and if it is less than the load threshold L1, the cutting speed V0 for high speed cutting is set (S29). When the grinding load is greater than or equal to the load threshold L1, when compared with the load threshold L2, when the grinding load is less than the load threshold L2 (S30), the rapid cutting speed V1 is set (S31).

同様に研削負荷が負荷閾値L2以上のときには、負荷閾値L3と比較して負荷閾値L3未満であれば(S32)、中切込の切込速度V2とする(S33)。また研削負荷が負荷閾値L3以上のときには、負荷閾値L4と比較して負荷閾値L4未満であれば(S34)、遅切込の遅切込速度V3とする(S35)。遅切込での研削中の研削負荷が負荷閾値L4以上となったときには、砥石1を遅戻し速度V4で戻し(S36)、砥石1の遅戻しにより研削負荷の低下を図る。   Similarly, when the grinding load is equal to or greater than the load threshold L2, if the grinding load is less than the load threshold L3 compared to the load threshold L3 (S32), the medium cutting depth V2 is set (S33). When the grinding load is equal to or greater than the load threshold L3, if it is less than the load threshold L4 compared to the load threshold L4 (S34), the slow cutting speed V3 is set (S35). When the grinding load during grinding with slow cutting becomes equal to or greater than the load threshold L4, the grindstone 1 is returned at the slow return speed V4 (S36), and the grinding load is reduced by the slow return of the grindstone 1.

遅戻しでの研削中も、砥石1の研削負荷を速度制限実行時の負荷閾値LAと比較しており(S37)、負荷閾値LA未満であればステップS2に戻る。しかし、遅戻しでの研削中に研削負荷が低下せず何等かの原因により、研削負荷が一次的に速度制限実行時の負荷閾値LA以上に上昇すれば(S37)、研削負荷が負荷閾値LAを超えたことを記憶し(S38)、速度制限実行手段14Aの切込速度制限機能が働く。   During grinding with slow return, the grinding load of the grindstone 1 is compared with the load threshold LA at the time of speed limit execution (S37), and if it is less than the load threshold LA, the process returns to step S2. However, if the grinding load temporarily rises above the load threshold LA at the time of speed limit execution due to some cause without lowering the grinding load during the slow return grinding (S37), the grinding load becomes the load threshold LA. (S38), and the cutting speed limiting function of the speed limiting execution means 14A is activated.

その後に一時的な研削負荷の上昇原因が解消すれば、砥石1の遅戻し速度V4での遅戻しによって研削負荷が急激に低下する。しかし、研削負荷が一旦負荷閾値LXを超えているので(S25)、仮に砥石1の研削負荷が遅切込時の負荷閾値L4未満となっても(S26)、速度制御手段14Aの切込速度制限機能が働いて、本来の遅切込速度V3(=0.05mm/min)とはせずに、以後の砥石1の切込を最も遅い制限切込速度Vα(=0.03mm/min)に制限する(S27)。   After that, if the cause of the temporary increase in the grinding load is eliminated, the grinding load is rapidly reduced by the slow return of the grindstone 1 at the slow return speed V4. However, since the grinding load once exceeds the load threshold LX (S25), even if the grinding load of the grindstone 1 becomes less than the load threshold L4 at the time of slow cutting (S26), the cutting speed of the speed control means 14A The limiting function is activated, and the subsequent slow cutting speed Vα (= 0.03 mm / min) for the subsequent cutting of the grindstone 1 without the original slow cutting speed V3 (= 0.05 mm / min). (S27).

従って、砥石1とワークWとが接触と離反とを繰り返すようなことがない。何故なら速度制限実行機能がなければ、遅戻しでのワークWの研削中に研削負荷が負荷閾値L3未満に低下したときに(S34)、遅戻しから遅切込に切り替えて遅切込速度V3(=0.05mm/min)で砥石1を切り込む。そのため研削負荷の上昇、低下に応じて砥石1の切込速度を制御すれば、砥石1が速い切込速度と速い戻し速度とで激しく行き来し、砥石1とワークWとが接触と離反とを繰り返して、ワークWの研削が進まなくなることがある。   Therefore, the grindstone 1 and the workpiece W do not repeat contact and separation. If the speed limit execution function is not provided, when the grinding load decreases to less than the load threshold L3 during grinding of the workpiece W with the slow return (S34), the slow cut speed V3 is switched from the slow return to the slow cut. The grindstone 1 is cut at (= 0.05 mm / min). Therefore, if the cutting speed of the grindstone 1 is controlled in accordance with the increase or decrease of the grinding load, the grindstone 1 moves back and forth violently at a fast cutting speed and a fast return speed, and the grindstone 1 and the workpiece W are brought into contact with and separated from each other. Repeatedly, the grinding of the workpiece W may not proceed.

しかし、砥石1の遅戻しによって研削負荷が負荷閾値L3未満に低下しても、直ちに砥石1を切込速度V3(=0.05mm/min)の早い速度で切込まずに、制限切込速度Vα(=0.03mm/min)の遅い速度でゆっくりと切込むことになり、遅戻しから遅切込への切り替えによって砥石1の研削負荷の急激な上昇を防止でき、砥石1が戻しと切込とを激しく繰り返すようなことはない。そのため図10に研削負荷曲線を示すように、その後の研削負荷の変化が安定したものとなり、ワークWを能率的に研削することができる。   However, even if the grinding load decreases to less than the load threshold L3 due to the slow return of the grindstone 1, the grindstone 1 is not cut immediately at a fast cutting speed V3 (= 0.05 mm / min), but the limited cutting speed. Cutting is performed slowly at a slow speed of Vα (= 0.03 mm / min), and a sharp increase in the grinding load of the grindstone 1 can be prevented by switching from slow return to slow cut. There is no such thing as violent repetition. Therefore, as shown in the grinding load curve in FIG. 10, the subsequent change in the grinding load becomes stable, and the workpiece W can be efficiently ground.

なお、この実施形態では、速度制限実行時の負荷閾値LAを超えた後は、研削負荷が低下しても制限切込速度Vαよりも早い速度で砥石1を切込まないように制御しているが、砥石1を戻す場合にも、制限戻し速度Vβを設定して、研削負荷がある負荷閾値LBを超えた後に、その後に研削負荷が負荷閾値L4の上側近くまで下がるようなことがあっても、制限戻し速度Vβよりも早い戻し速度で戻さないようにしても良い。   In this embodiment, after exceeding the load threshold LA at the time of speed limit execution, control is performed so that the grindstone 1 is not cut at a speed faster than the limit cut speed Vα even if the grinding load is reduced. However, even when the grindstone 1 is returned, there is a case in which after the limit return speed Vβ is set and the grinding load exceeds a certain load threshold value LB, the grinding load subsequently decreases to near the upper side of the load threshold value L4. Alternatively, the return speed may not be higher than the limit return speed Vβ.

図11〜図13は本発明の第3の実施形態を例示する。この実施形態の砥石切込戻し制御手段11は、図11に示すように、速度設定手段14が記憶する速度テーブルを適宜選択可能なテーブル選択手段16を有し、このテーブル選択手段16により選択されたテーブルに従って速度制御手段15が砥石送り手段7を制御するように構成されている。   11-13 illustrate a third embodiment of the present invention. As shown in FIG. 11, the grindstone cutting back control means 11 of this embodiment has a table selection means 16 that can appropriately select a speed table stored in the speed setting means 14, and is selected by the table selection means 16. The speed control means 15 is configured to control the grindstone feeding means 7 according to the table.

速度設定手段14が記憶するテーブルには、例えば図12に示す第1速度テーブルT1と、図13に示す第2速度テーブルT2とがある。テーブル選択手段16は第1速度テーブルT1と第2速度テーブルT2とを個別に選択可能である他、両速度テーブルT1,T2の一部を結合した結合テーブルを選択可能である。   Tables stored by the speed setting means 14 include, for example, a first speed table T1 shown in FIG. 12 and a second speed table T2 shown in FIG. The table selection means 16 can select the first speed table T1 and the second speed table T2 individually, and can select a combined table obtained by combining a part of both speed tables T1 and T2.

結合テーブルは第1速度テーブルT1と第2速度テーブルT2との前後を選択すると共に、その一方の速度テーブルT1又は速度テーブルT2から他方の速度テーブルT2又は速度テーブルT1に変更するときの速度テーブル変更負荷を適宜負荷閾値に設定して、その速度テーブル変更負荷で両速度テーブルT1,T2の前後を変更し結合して、その一方の速度テーブルT1又は速度テーブルT2から他方の速度テーブルT2又は速度テーブルT1に切り替わるように構成される一つの速度テーブルである。   The combination table selects before and after the first speed table T1 and the second speed table T2, and changes the speed table when changing from one speed table T1 or speed table T2 to the other speed table T2 or speed table T1. The load is appropriately set as a load threshold, and the speed table change load is used to change the front and back of both speed tables T1 and T2 and combine them, and from one speed table T1 or speed table T2 to the other speed table T2 or speed table. It is one speed table comprised so that it may switch to T1.

例えば、第1速度テーブルT1を前とし、第2速度テーブルT2を後とする選択を行い、負荷閾値L3を速度テーブル変更負荷として設定した場合には、負荷閾値L3までの第1速度テーブルT1の前半と、負荷閾値L3から以後の第2速度テーブルT2の後半とを結合した一つの速度テーブルを構成することができる。   For example, when the first speed table T1 is set to the front and the second speed table T2 is set to the back, and the load threshold L3 is set as the speed table change load, the first speed table T1 up to the load threshold L3 is set. One speed table combining the first half and the second half of the second speed table T2 after the load threshold L3 can be configured.

従って、インフィード研削に際して、砥石切込戻し制御手段11は研削負荷の変化を監視しながら、その速度制御手段15により、結合テーブルに従って砥石1の切込速度を夫々制御する。例えば、研削の前半は第1速度テーブルT1に従って制御を行い、研削負荷が負荷閾値L3未満の場合には第1速度テーブルT1の遅切込速度V3(=0.05mm/min)で砥石1の遅切込を行う。そして、負荷閾値L3以上になれば、第1速度テーブルT1から第2速度テーブルT2に変更して、この第2速度テーブルT2に従って遅戻し速度V3(=−0.05mm/min)で砥石1の遅戻しを行う。なお、他の構成、制御等は各実施形態と同様である。   Accordingly, during in-feed grinding, the grindstone cutting back control means 11 controls the cutting speed of the grindstone 1 according to the coupling table by the speed control means 15 while monitoring changes in the grinding load. For example, the first half of grinding is controlled according to the first speed table T1, and when the grinding load is less than the load threshold L3, the grinding wheel 1 is rotated at the slow cutting speed V3 (= 0.05 mm / min) of the first speed table T1. Make a slow cut. And if it becomes more than the load threshold value L3, it will change from 1st speed table T1 to 2nd speed table T2, and according to this 2nd speed table T2, the return speed V3 (= -0.05 mm / min) of the grindstone 1 is changed. Perform a slow return. Other configurations, controls, and the like are the same as those in each embodiment.

このようにすれば、第1速度テーブルT1と第2速度テーブルT2との一部を選択的に組み合わせて結合テーブルを構成することができ、少ない数の速度テーブルT1,T2を基準にしながらもワークWの材質、その他に最適な条件で研削することが可能である。   In this way, a combined table can be configured by selectively combining a part of the first speed table T1 and the second speed table T2, and work can be performed while using a small number of speed tables T1 and T2. It is possible to grind under the optimum conditions for the material of W and others.

なお、速度テーブルは3種類以上あってもよいし、速度テーブル変更負荷は複数種類あってもよい。また速度テーブル変更負荷によりテーブルを変更する他、切込時間、切込量、定寸装置等から読み取った除去量を基準に、複数の速度テーブルを変更するようにしても良い。   There may be three or more types of speed tables, and there may be a plurality of types of speed table changing loads. Further, in addition to changing the table according to the speed table changing load, a plurality of speed tables may be changed based on the cutting time, the cutting amount, the removal amount read from the sizing device or the like.

図14は本発明の第4の実施形態を例示する。砥石1によりワークWをインフィード研削する場合、研削中の研削負荷はそのときの条件に応じて上昇、低下することがある。従って、図14に速度テーブルを例示するように、速度テーブル中に研削負荷の上昇局面と低下局面との何れの負荷閾値を使用するか否かを選択可能(ONは選択、OFFは非選択)にしておき、研削条件に応じて適宜必要な条件を選択するようにしても良い。   FIG. 14 illustrates a fourth embodiment of the present invention. When the workpiece W is in-feed ground with the grindstone 1, the grinding load during grinding may rise and fall according to the conditions at that time. Accordingly, as illustrated in FIG. 14 as an example of the speed table, it is possible to select whether to use a load threshold value for the rising phase or the decreasing phase of the grinding load in the speed table (ON is selected, OFF is not selected). In addition, necessary conditions may be selected as appropriate according to grinding conditions.

図14の速度テーブルの場合には、高速切込、早切込、中切込、遅切込、遅戻し、中戻し、早戻し、非常戻しの制御要素があり、その各制御要素を上昇局面、低下局面に応じて適宜選択できるようになっている。例えば、研削負荷の上昇局面では、中切込、遅戻し、中戻しは選択されておらず、低下局面では遅切込は選択されていない。   In the case of the speed table of FIG. 14, there are control elements of high speed cutting, fast cutting, middle cutting, slow cutting, slow returning, middle returning, fast returning, and emergency returning. , And can be appropriately selected according to the decline phase. For example, in the rising phase of the grinding load, medium cutting, slow return and medium returning are not selected, and in the decreasing phase, slow cutting is not selected.

実際のインフィード研削において、その時点での研削が上昇局面、低下局面の何れにあるかは、過去数秒間程度の判定時間を決めておき、その判定時間中における研削負荷の移動平均等を求めることにより判断しても良い。   In actual in-feed grinding, whether the grinding at that time is in the rising phase or the falling phase is determined by determining a judgment time of the past several seconds and obtaining a moving average of the grinding load during the judgment time. You may judge by.

図15、図16は本発明の第5の実施形態を例示する。この砥石切込戻し制御手段11は、図15に示すように、研削中の砥石1の研削負荷を測定する研削負荷測定手段13と、負荷閾値毎に砥石1の切込速度、戻し速度を設定する速度設定手段14と、切込速度の変更時、切込と戻しとの切替え時に加減速時間を設定する時間設定手段17と、研削中の研削負荷と負荷閾値とを比較してその研削負荷の増減に応じて速度設定手段14で設定された切込速度、戻し速度に、砥石送り手段7を切込制御、戻し制御すると共に、その切込速度の変更時、切込と戻しとの切替え時に時間設定手段17で設定された加減速時間Tで速度を一方向に緩やかに変化させる速度制御手段15とを有する。   15 and 16 illustrate a fifth embodiment of the present invention. As shown in FIG. 15, the grinding wheel cutting / returning control means 11 sets a grinding load measuring means 13 for measuring a grinding load of the grinding wheel 1 during grinding, and sets a cutting speed and a returning speed of the grinding stone 1 for each load threshold. The speed setting means 14 for performing, the time setting means 17 for setting the acceleration / deceleration time at the time of changing the cutting speed and switching between cutting and returning, and the grinding load during grinding and the load threshold value are compared, and the grinding load The grindstone feeding means 7 is controlled to be cut and returned to the cutting speed and return speed set by the speed setting means 14 in accordance with the increase / decrease of the speed, and when the cutting speed is changed, switching between cutting and returning is performed. And a speed control means 15 that gradually changes the speed in one direction with the acceleration / deceleration time T set by the time setting means 17.

このような構成の砥石切込戻し制御手段11では、時間設定手段17で予め加減速時間Tを設定しておけば、切込速度の変更時、切込と戻しとの切替え時の何れの場合にも、速度の急激な変化を防止できるため、研削負荷が一時的に低下する等の問題がなく、高研削負荷で能率良くワークWを研削することができる。   In the grindstone cutting / returning control means 11 having such a configuration, if the acceleration / deceleration time T is set in advance by the time setting means 17, the cutting speed is changed or the switching is made between cutting and returning. In addition, since a rapid change in speed can be prevented, there is no problem that the grinding load temporarily decreases, and the workpiece W can be efficiently ground with a high grinding load.

例えば切込速度V0の高速切込から切込速度V1の早切込に減速する場合には、図16(I)に実線で示すように加減速時間Tで切込速度V0から切込速度V1へと徐々に減速するため、点線で示すように直ちに切り替えるときに比べて、急激な速度変化を抑えて研削負荷の変化を抑えることができる。   For example, when decelerating from a high-speed cutting with a cutting speed V0 to a fast cutting with a cutting speed V1, the cutting speed V1 is changed from the cutting speed V0 with the acceleration / deceleration time T as shown by the solid line in FIG. Since the speed is gradually decelerated, it is possible to suppress a change in grinding load by suppressing a rapid change in speed as compared with a case where switching is performed immediately as indicated by a dotted line.

また切込速度V3での遅切込から戻し速度V4での遅戻しに切替える場合にも、図16(II)に実線で示すように加減速時間Tで切込速度V3から戻し速度V4へと徐々に切替えるため、点線で示すように直ちに切り替えるときに比べて、逆方向への急激な速度変化を抑えて研削負荷の変化を抑えることができる。   Also, when switching from slow cutting at the cutting speed V3 to slow returning at the returning speed V4, the cutting speed V3 is changed to the returning speed V4 at the acceleration / deceleration time T as shown by the solid line in FIG. Since the switching is performed gradually, it is possible to suppress a change in the grinding load by suppressing a rapid speed change in the reverse direction as compared with a case where the switching is performed immediately as indicated by a dotted line.

なお、加減速時間TはワークWの材質等に応じて適宜設定することも可能である。また加減速時間Tを可変的に設定可能にする他、切込速度の変更時、切込と戻しとの切替え時に速度制御手段15が所定の加減速特性に従って徐々に又は段階的に加減速をするようにしても良い。   The acceleration / deceleration time T can be appropriately set according to the material of the workpiece W or the like. In addition to making the acceleration / deceleration time T variable, the speed control means 15 performs acceleration / deceleration gradually or stepwise according to a predetermined acceleration / deceleration characteristic when changing the cutting speed or switching between cutting and returning. You may make it do.

以上、本発明の実施形態について詳述したが、本発明はこの実施形態に限定されるものではなく種々の変更が可能である。例えば、研削負荷の負荷閾値の数は多いことが望ましい。従って、負荷閾値の数を無数に増やすことも可能であり、負荷閾値の数を無数に増やすことにより、研削負荷の増加に伴って砥石1の切込速度を無段階に減速する無段変速も可能である。   As mentioned above, although embodiment of this invention was explained in full detail, this invention is not limited to this embodiment, A various change is possible. For example, it is desirable that the number of load thresholds of the grinding load is large. Therefore, it is possible to increase the number of load thresholds innumerably, and by continuously increasing the number of load thresholds, continuously variable transmission that continuously reduces the cutting speed of the grindstone 1 as the grinding load increases. Is possible.

また実施形態では、硬脆材料のワークWについて例示しているが、硬脆材料に限定されるものではなく、各種材料のワークWの平面研削の全般についても同様に実施可能である。   In the embodiment, the work W made of a hard and brittle material is illustrated. However, the present invention is not limited to the hard and brittle material, and general surface grinding of the work W made of various materials can be similarly performed.

研削負荷として砥石軸5の回転負荷トルクを例示しているが、砥石駆動手段6の電流、電力の変化、又は砥石駆動手段6に加わる荷重の変化で研削負荷を判断しても良いし、ワーク駆動手段4のトルク、電流、電力、荷重の変化で研削負荷を判断しても良い。またワーク駆動機構のない平面研削盤2の場合には、ワークWにかかる荷重から研削負荷を判断しても良い。更に砥石駆動手段6の電流、電力又は荷重の変化と、ワーク駆動手段4の電流、電力又は荷重の変化とを組み合わせる等、研削負荷の変化に関連する二つ以上の関連要素を組み合わせて判断するようにしても良い。   Although the rotational load torque of the grindstone shaft 5 is exemplified as the grinding load, the grinding load may be determined by a change in the current and power of the grindstone driving means 6 or a change in the load applied to the grindstone driving means 6. The grinding load may be determined based on changes in torque, current, power, and load of the driving unit 4. Further, in the case of the surface grinding machine 2 having no workpiece driving mechanism, the grinding load may be determined from the load applied to the workpiece W. Further, the judgment is made by combining two or more related elements related to the change of the grinding load, such as combining the change of the current, power or load of the grindstone driving means 6 with the change of the current, power or load of the work driving means 4. You may do it.

第1及び第2の実施形態では、切込中に研削負荷が上昇する場合について詳述しているが、切込中に研削負荷が所定の負荷閾値よりも低下すれば、切込速度を増速させるように制御しても良いことは云うまでもない。その場合にも、所定の時間をかけて切込速度を加速するようにしても良い。   In the first and second embodiments, the case where the grinding load increases during cutting is described in detail. However, if the grinding load falls below a predetermined load threshold during cutting, the cutting speed is increased. Needless to say, the speed may be controlled. Also in that case, the cutting speed may be accelerated over a predetermined time.

また研削負荷が所定の負荷閾値を基準に切込速度を加減速し、又は切込と戻しとの間で切替える場合、所定の負荷閾値を基準に砥石1の切込、戻し等が可能であれば十分であり、負荷閾値未満、負荷閾値以上の何れで判断することも可能である。   In addition, when the grinding load accelerates or decelerates the cutting speed based on a predetermined load threshold or switches between cutting and returning, the grinding wheel 1 can be cut and returned based on the predetermined load threshold. It is sufficient, and it is possible to make a determination based on either less than the load threshold or more than the load threshold.

高速切込、早切込、中切込、遅切込、遅戻し、中戻し、早戻し等は単なる例示に過ぎず、これら以上に細かく分けても良いし、少ない数で大まかに分けても良い。また各負荷閾値、切込速度、戻し速度の値も単なる例示に過ぎず、これらに限定されるものではない。   Fast cutting, early cutting, middle cutting, slow cutting, slow returning, middle returning, fast returning, etc. are merely examples, and may be subdivided more than these, or roughly divided by a small number good. The values of the load threshold value, the cutting speed, and the return speed are merely examples, and are not limited to these.

1 砥石
2 平面研削盤
3 回転テーブル
4 ワーク駆動手段
5 砥石軸
7 砥石送り手段
10 定寸制御手段
11 砥石切込戻し制御手段
12 寸法測定手段
13 研削負荷測定手段
14 速度設定手段
14A 速度制限実行手段
15 速度制御手段
16 テーブル選択手段
17 時間設定手段
DESCRIPTION OF SYMBOLS 1 Grinding wheel 2 Surface grinder 3 Rotary table 4 Work drive means 5 Grinding wheel shaft 7 Grinding wheel feeding means 10 Fixed dimension control means 11 Grinding wheel cutting back control means 12 Dimension measuring means 13 Grinding load measuring means 14 Speed setting means 14A Speed limit executing means 15 Speed control means 16 Table selection means 17 Time setting means

Claims (7)

砥石によりワークを平面研削するに際し、研削負荷を監視しながら、研削負荷が上昇するに伴って砥石の切込速度を減速することを特徴とするワークの平面研削方法。   A surface grinding method for a workpiece characterized in that when a workpiece is surface ground with a grindstone, the cutting speed of the grindstone is reduced as the grinding load increases while monitoring the grinding load. 砥石によりワークを平面研削するに際し、研削負荷を監視しながら、研削負荷が上昇したときに砥石の切込速度を減速し、研削負荷が低下したときに切込速度を増速することを特徴とするワークの平面研削方法。   When grinding a workpiece with a grindstone, while monitoring the grinding load, the cutting speed of the grindstone is reduced when the grinding load increases, and the cutting speed is increased when the grinding load decreases. Surface grinding method for workpieces. 研削負荷の複数の各負荷閾値に対応して、研削負荷が大になるほど砥石の切込速度が遅くなる各切込速度を設定しておき、所定速度で研削を開始した後、研削負荷が所定の負荷閾値に上昇・低下するたびに砥石を対応する切込速度に減速・増速することを特徴とする請求項1又は2に記載のワークの平面研削方法。   Corresponding to each load threshold of the grinding load, each cutting speed is set so that the cutting speed of the grindstone becomes slower as the grinding load becomes larger, and after starting grinding at a predetermined speed, the grinding load is predetermined. The surface grinding method for a workpiece according to claim 1, wherein the grinding wheel is decelerated / accelerated to a corresponding cutting speed each time the load threshold is increased / decreased. 砥石の切込時の最大の負荷閾値よりも高い戻し負荷閾値を設定しておき、研削負荷が戻し負荷閾値を超えたときに砥石を所定の戻し速度で戻しながら研削することを特徴とする請求項1〜3の何れかに記載のワークの平面研削方法。   A return load threshold higher than a maximum load threshold at the time of cutting of the grindstone is set, and grinding is performed while returning the grindstone at a predetermined return speed when the grinding load exceeds the return load threshold. Item 4. A method for surface grinding a workpiece according to any one of Items 1 to 3. スパークアウト前に砥石の切込と戻しとを繰り返すことを特徴とする請求項1〜4の何れかに記載のワークの平面研削方法。   The surface grinding method for a workpiece according to any one of claims 1 to 4, wherein cutting and returning of the grindstone are repeated before sparking out. 研削負荷が速度制限実行用の負荷閾値を超えたときに、その後に研削負荷が所定の切込速度の負荷閾値に低下しても所定の切込速度よりも遅い制限切込速度で砥石を切込、制限切込速度以上に速くしないことを特徴とする請求項1〜5の何れかに記載のワークの平面研削方法。   When the grinding load exceeds the load threshold for speed limit execution, the grindstone is cut at a limited cutting speed that is slower than the predetermined cutting speed even if the grinding load subsequently drops to the load threshold for the predetermined cutting speed. The method for surface grinding of a workpiece according to any one of claims 1 to 5, wherein the workpiece is not faster than a cutting speed and a limit cutting speed. 砥石によりワークをインフィード研削する平面研削盤であって、研削中の砥石の研削負荷を測定する研削負荷測定手段と、複数の負荷閾値に対応して複数の砥石の切込速度が設定された速度設定手段と、研削中の研削負荷と負荷閾値とを比較しながら研削負荷の上昇、低下に伴って砥石の切込速度が減速、増速するように各負荷閾値を基準として各負荷閾値に対応する切込速度で砥石を増減速させる速度制御手段とを備えたことを特徴とする平面研削盤。   A surface grinding machine for in-feed grinding a workpiece with a grindstone, wherein a grinding load measuring means for measuring a grinding load of a grinding wheel during grinding, and a plurality of grinding wheel cutting speeds corresponding to a plurality of load thresholds are set. While comparing the speed setting means with the grinding load during grinding and the load threshold, each load threshold is set to each load threshold so that the cutting speed of the grindstone decreases and increases as the grinding load increases and decreases. A surface grinding machine comprising speed control means for increasing or decreasing the speed of a grindstone at a corresponding cutting speed.
JP2015183134A 2015-09-16 2015-09-16 Method of surface grinding of workpiece and surface grinding machine Active JP6510374B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015183134A JP6510374B2 (en) 2015-09-16 2015-09-16 Method of surface grinding of workpiece and surface grinding machine
US15/236,667 US20170072529A1 (en) 2015-09-16 2016-08-15 Surface grinding method for workpiece and surface grinder
KR1020160115480A KR102573501B1 (en) 2015-09-16 2016-09-08 Surface grinding method for workpiece and surface grinder
TW105129696A TWI703010B (en) 2015-09-16 2016-09-13 Surface grinding method for workpiece and surface grinder
CN201610824809.5A CN106881639B (en) 2015-09-16 2016-09-14 Method for grinding surface of workpiece and surface grinding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015183134A JP6510374B2 (en) 2015-09-16 2015-09-16 Method of surface grinding of workpiece and surface grinding machine

Publications (2)

Publication Number Publication Date
JP2017056516A true JP2017056516A (en) 2017-03-23
JP6510374B2 JP6510374B2 (en) 2019-05-08

Family

ID=58236613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015183134A Active JP6510374B2 (en) 2015-09-16 2015-09-16 Method of surface grinding of workpiece and surface grinding machine

Country Status (5)

Country Link
US (1) US20170072529A1 (en)
JP (1) JP6510374B2 (en)
KR (1) KR102573501B1 (en)
CN (1) CN106881639B (en)
TW (1) TWI703010B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020025989A (en) * 2018-08-09 2020-02-20 株式会社ディスコ Grinding device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6871210B2 (en) * 2018-09-07 2021-05-12 ファナック株式会社 Numerical control device
CN112157585B (en) * 2020-08-24 2022-05-03 河南捷利达超硬制品有限公司 Grinding control method
KR20230118871A (en) * 2020-12-25 2023-08-14 가부시키가이샤 지벡크 테크놀로지 Control method of grinding ball holder, grinding ball holder, and grinding tool
CN114985844A (en) * 2022-06-28 2022-09-02 湖南中大创远数控装备有限公司 Grinding method for spiral bevel gear
CN117415730B (en) * 2023-12-19 2024-03-12 江苏京创先进电子科技有限公司 Thinning control method, system and thinning equipment

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63150158A (en) * 1986-12-10 1988-06-22 Sumitomo Electric Ind Ltd Cut-in device of end surface grinder
US5827111A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
JP2002028860A (en) * 2000-07-17 2002-01-29 Sumitomo Heavy Ind Ltd Grinding machine
JP2005279882A (en) * 2004-03-30 2005-10-13 Seiko Instruments Inc Grinding device
JP2006035406A (en) * 2004-07-30 2006-02-09 Nachi Fujikoshi Corp Surface grinding device
JP2013226625A (en) * 2012-04-26 2013-11-07 Disco Corp Grinding method and grinding device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056821A (en) * 1983-09-09 1985-04-02 Honda Motor Co Ltd Gear grinder
US5044125A (en) * 1988-09-02 1991-09-03 Cincinnati Milacron-Heald Corp. Method and apparatus for controlling grinding processes
KR0167021B1 (en) * 1993-03-15 1999-02-01 카타다 테쯔야 Automatic grinding apparatus
JP4447440B2 (en) * 2004-12-02 2010-04-07 新日本製鐵株式会社 Online grinding method for work rolls
JP5301823B2 (en) * 2007-12-06 2013-09-25 株式会社ニデック Eyeglass lens peripheral processing equipment
CN102470506B (en) * 2009-07-22 2014-11-26 株式会社捷太格特 Method and device for preventing slip of work piece

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63150158A (en) * 1986-12-10 1988-06-22 Sumitomo Electric Ind Ltd Cut-in device of end surface grinder
US5827111A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
JP2002028860A (en) * 2000-07-17 2002-01-29 Sumitomo Heavy Ind Ltd Grinding machine
JP2005279882A (en) * 2004-03-30 2005-10-13 Seiko Instruments Inc Grinding device
JP2006035406A (en) * 2004-07-30 2006-02-09 Nachi Fujikoshi Corp Surface grinding device
JP2013226625A (en) * 2012-04-26 2013-11-07 Disco Corp Grinding method and grinding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020025989A (en) * 2018-08-09 2020-02-20 株式会社ディスコ Grinding device

Also Published As

Publication number Publication date
CN106881639B (en) 2021-03-30
JP6510374B2 (en) 2019-05-08
KR20170033233A (en) 2017-03-24
TW201718179A (en) 2017-06-01
KR102573501B1 (en) 2023-08-31
TWI703010B (en) 2020-09-01
CN106881639A (en) 2017-06-23
US20170072529A1 (en) 2017-03-16

Similar Documents

Publication Publication Date Title
KR102573501B1 (en) Surface grinding method for workpiece and surface grinder
EP1666200B1 (en) Workpiece grinding method
KR101605484B1 (en) Polishing apparatus of substrate end face and polishing determining method
US3653855A (en) Grinding system
CN103842129B (en) The cutting method of workpiece and scroll saw
WO2010032371A1 (en) Band saw cutting device and method of cutting ingot
CN103507173A (en) Method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece
US5285597A (en) Method and arrangement for subdividing semiconductor bars into semiconductor wafers
WO2011030505A1 (en) Inner circumference edge blade dressing method
JP2000263437A (en) Cylindrical grinding wheel
JP2894906B2 (en) Dicing apparatus and cutting control method in dicing apparatus
JP2621844B2 (en) Dressing method and device for cutting blade in slicing device
JPS6351826B2 (en)
JP6563241B2 (en) Grinding wheel forming method of grinding wheel
JP4225210B2 (en) Truing device and truing method for grinding wheel
JPS5890440A (en) Overload control method for machine tool
JP2619363B2 (en) Grinding method and end face grinding device
JP2005059141A (en) Grinding method and controller of grinder
JP2940073B2 (en) Grinding machine control method
JP6909739B2 (en) Work surface grinding method and double-headed surface grinding machine
JP2007160436A (en) Grinder and grinding method
JP5846096B2 (en) Dressing method of inner peripheral blade
JP3781415B2 (en) Grinding equipment
JP7304672B2 (en) Electrode polishing method
JP2016198875A5 (en)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20171026

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180730

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180828

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181022

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20181204

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190204

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190402

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190404

R150 Certificate of patent or registration of utility model

Ref document number: 6510374

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250