JP5964637B2 - Grinding equipment - Google Patents

Description

  The present invention relates to a grinding apparatus for grinding a plate-like workpiece to a predetermined thickness by a plurality of grinding means.

  In a grinding apparatus that grinds circular plate-shaped workpieces, the plate-like workpiece is held on the chuck table formed in an umbrella shape with the center of the upper surface of the chuck table as the apex, and the chuck table is rotated to rotate the circle of the plate-shaped workpiece. Infeed grinding is performed in which a grinding wheel is brought into contact with the radius portion to perform grinding (see, for example, Patent Document 1 below).

  As another example of grinding a plate-like workpiece, the grinding wheel is contacted from the side surface of the plate-like workpiece by rotating the grinding wheel and the holding table without rotating the holding table holding the plate-like workpiece. There is creep feed grinding that grinds.

JP 2009-90389 A

  In the in-feed grinding described above, the contact surface between the plate-like workpiece and the grinding wheel at a certain temporary point is limited to the radius portion of the plate-like workpiece. Therefore, in order to increase the contact area per unit time between the plate workpiece and the grinding wheel during grinding of the plate workpiece, the number of rotations of the chuck table that holds the plate workpiece is increased.

  However, for example, when in-feed grinding is performed on a plate-like workpiece formed of a difficult-to-grind material such as SiC or sapphire, if the number of rotations of the chuck table is increased, the grinding wheel will be clogged and sufficient grinding will occur. There is a phenomenon that power cannot be secured.

  On the other hand, in the above-described creep feed grinding, since the amount of grinding and removing the plate-like workpiece is large, the plate-like workpiece can be thinned faster than in-feed grinding. However, with creep feed grinding alone, it is difficult to adjust the thickness of the plate workpiece while monitoring the variation in the thickness of the plate workpiece.

  The present invention has been made in view of the above circumstances, and even if the plate-like workpiece is formed of a difficult-to-grind material, the problem to be solved by the present invention is to accurately grind to a predetermined thickness. have.

The present invention relates to a holding table which can hold and rotate a plate-like workpiece, a grinding means equipped with a grinding wheel for grinding the plate-like workpiece held on the holding table, and a grinding means provided with the holding table. A grinding table comprising at least a turntable for positioning the holding table below, a grinding feed means for moving the grinding means toward and away from the holding table, and a thickness measuring unit for measuring the thickness of the plate-like workpiece. The holding table that holds the plate-like workpiece has an inclined surface with the center of the holding portion at the top and the outer peripheral side being lowered, and the grinding means has a predetermined cutting depth of the plate-like workpiece by the grinding feed means. A first grinding means for bringing the first grinding wheel positioned on the side into contact with the side surface of the plate-like workpiece; and a grinding feed means from above the plate-like workpiece held on the holding table. By cutting feed, and a second grinding means for grinding to approximate second grinding wheel to the plate-shaped workpiece, comprising a grinding means said second grinding surface of the second grinding wheel and of the holding table An angle adjusting means for inclining the second grinding means so as to be parallel to the inclined surface, wherein the rotation axis of the holding table and the rotation axis of the first grinding means are arranged in parallel, and the grinding feed The plate-like work held on the holding table is relatively moved toward the first grinding wheel positioned at a predetermined cutting depth by which the first grinding wheel is to be cut by the grinding feed by means. the plate-like workpiece in the grinding wheel of the first to enter is ground from the side surface, after grinding using the first grinding means, positioned below the second grinding means the holding table by the turntable, the 2 Grinding wheel grinding surface and holding table In a state in which the inclined surface is made to adjust the position so as to be parallel, while measuring the thickness of the plate-shaped workpiece inclined surface of the holding table holds in the thick viewed measuring section, from above of the holding table that rotates The second grinding means is lowered and the second grinding wheel is brought into contact with the radial portion of the plate workpiece to perform grinding, and the plate workpiece is brought into contact with the upper surface to be ground to a predetermined thickness.

  The present invention relates to a first grinding means for performing creep feed grinding on a plate-shaped workpiece, a second grinding means for performing in-feed grinding on a plate-shaped workpiece subjected to creep feed grinding, and a plate-shaped workpiece during in-feed grinding. A plate-like workpiece thickness measuring unit for measuring the thickness of the plate-like workpiece, so that the grinding removal amount of the plate-like workpiece can be increased during grinding by the first grinding means, and during grinding by the second grinding means. While the thickness of the plate-like workpiece is monitored by the thickness measuring unit, finish grinding can be performed on the plate-like workpiece. Therefore, even if the plate-like workpiece to be ground is formed of a difficult-to-grind material, the plate-like workpiece W is ground to a predetermined thickness with high accuracy and more efficiently than before. It becomes possible.

It is a top view which shows the structure of the grinding apparatus which can perform creep feed grinding and infeed grinding. It is sectional drawing which shows the structure of a 1st grinding means. It is sectional drawing which shows the operation example of a 1st grinding means. It is sectional drawing which shows the structure of a 2nd grinding means. It is sectional drawing which shows the operation example of a 2nd grinding means.

  A grinding apparatus 1 shown in FIG. 1 is a grinding apparatus that grinds a plate-like workpiece W, which is a workpiece, to a predetermined thickness by a plurality of grinding processes. Below, the structure of the grinding apparatus 1 is demonstrated.

  As shown in FIG. 1, the grinding apparatus 1 has an apparatus base 2, and a rotatable turntable 3 is disposed at the center of the upper surface of the apparatus base 2. A plurality of holding tables 4 that hold and rotate the plate-like workpiece W are disposed on the upper surface of the turntable 3. The turntable 3 rotates, for example, in the direction of the arrow A to revolve the plurality of holding tables 4, so that the plate-like workpiece W is attached to and detached from the holding table 4, and the plate-like workpiece is ground. The holding table 4 can be positioned in each of the grinding region P2, the grinding region P3, and the grinding region P4 in which the process is performed.

  As shown in FIG. 2, the holding table 4 includes a holding unit 400 that holds the plate-like workpiece W by suction. The holding portion 400 is formed with an inclined surface 400a having the central portion as an apex and the outer peripheral direction inclined downward. The holding unit 400 is supported by a support unit 401, and a suction hole 402 that allows the holding unit 400 to communicate with a suction source (not shown) is formed in the support unit 401.

  As shown in FIG. 1, on the Y1 direction side of the apparatus base 2 in the grinding apparatus 1, an accommodation cassette 7a for accommodating the plate-like workpiece W before grinding and a plate-like workpiece W after grinding are collected. A collection cassette 7b is provided.

  In the vicinity of the storage cassette 7a and the recovery cassette 7b, a transfer robot 8 that carries the plate-like workpiece W out of the storage cassette 7a and into the recovery cassette 7b is disposed. The transfer robot 8 includes a robot hand 8a that holds the plate-like workpiece W, and is supported on the side of the guide rail 13 disposed on the apparatus base 2, and can reciprocate in, for example, the X1 and X2 directions. . A temporary table 9 and a cleaning unit 10 are disposed in the movable range of the transfer robot 8. In the temporary placement table 9, the position of the plate-like workpiece W before grinding can be adjusted. Further, the cleaning unit 10 can clean the processing waste adhering to the upper surface of the plate-like workpiece W after grinding.

  A guide rail 14 extends from the temporary placement table 9 to the holding table 4 positioned in the attachment / detachment region P1 of the plate-like workpiece W, and a conveyance unit 11 that conveys the plate-like workpiece W before grinding on the side portion of the guide rail 14. Is arranged. The transport unit 11 is guided by the guide rail 14 and can move horizontally in, for example, the Y1 direction and the Y2 direction, and the plate-like workpiece W is transferred from the temporary placement table 9 to the holding table 4 located in the attachment / detachment region P1. Can be transported.

  Further, a guide rail 15 extends from the vicinity of the attachment / detachment region P1 to a position close to the cleaning unit 10, and a conveyance unit 12 that conveys the ground plate-like workpiece W along the guide rail 15 is disposed. Has been. The conveyance unit 12 is guided by the guide rail 15 and can move horizontally in, for example, the Y1 direction and the Y2 direction, and conveys the plate-like workpiece W from the holding table 4 located in the attachment / detachment region P1 to the cleaning unit 10. can do.

  In the grinding region P2 shown in FIG. 1, the first grinding means 20 for performing rough grinding by creep feed grinding on the plate-like workpiece W is provided with the grinding feed means 50 at the side of the column 5a disposed in the apparatus base 2. It is arranged via. As shown in FIG. 2, the first grinding means 20 includes a spindle 21 having a vertical axis S <b> 1, a housing 22, a grinding wheel 23 connected to the lower end of the spindle 21, and a lower portion of the grinding wheel 23. And a grinding wheel 24 mounted in an annular shape. The grinding feed means 50 can move the side portion of the column 5a up and down, left and right, and can bring the grinding wheel 24 close to and away from the holding table 4. Further, the first grinding means 20 shown in FIG. 2 can rotate around the axis S1.

  In the grinding region P3, the second grinding means 30 for performing finish grinding by infeed grinding on the plate-like workpiece W on which rough grinding has been performed is provided on the side of the column 5b disposed in the apparatus base 2 with grinding feed means. 51 is provided. Further, the third grinding means 40 that performs finish grinding by in-feed grinding also in the grinding region P4 is disposed on the side of the column 5c via the grinding feed means 52.

  As shown in FIG. 4, the second grinding means 30 includes a spindle 31 having a vertical axis S <b> 2, a housing 32, a grinding wheel 33 connected to the lower end of the spindle 31, and a lower portion of the grinding wheel 33. And a grinding wheel 34 mounted in an annular shape. Although not shown, the second grinding means 30 is connected to an angle adjusting means for inclining the axis S2 of the spindle 31 by a predetermined angle. The inclining of the axis S2 by a predetermined angle during in-feed grinding is performed. Position adjustment is performed so that the lower surface and the inclined surface 400a of the holding portion 400 of the holding table 4 are in a parallel positional relationship. The grinding feed means 51 shown in FIG. 1 can move the second grinding means 30 up and down, and can approach and separate the grinding wheel 34 from the plate-like workpiece W. The third grinding means 40 has the same configuration as the second grinding means 30.

  Returning to FIG. 1, the thickness measurement unit 6 for measuring the thickness of the plate-like workpiece W during finish grinding of the plate-like workpiece W is disposed in the grinding region P3. The thickness measuring unit 6 includes a height gauge 6 a that measures the upper surface height position of the plate-like workpiece W and a height gauge 6 b that measures the upper surface height position of the holding table 4. Note that a thickness measuring unit 6 similar to the above is also disposed in the grinding region P4.

  The grinding apparatus 1 includes a control means 16 for controlling the various devices described above, and is connected to the various devices described above. The control means 16 includes a CPU and a memory. The control means 16 can memorize | store the finishing thickness of the plate-shaped workpiece W in memory beforehand, for example. Further, the thickness of the plate-like workpiece W measured by the thickness measuring unit 6 can be stored in the memory. Further, the inclination angle of the axis S2 of the second grinding means 30 shown in FIG. 4 can be set and stored in the memory.

Below, the operation example of the grinding apparatus 1 comprised as mentioned above is demonstrated.
Before the rough grinding by creep feed grinding is performed on the plate-like workpiece W, in order to make the plate-like workpiece W have a predetermined thickness, the position H of the cutting depth at which the grinding wheel 24 shown in FIG. It is set in the control means 16 in advance. In addition, the finish thickness of the plate-like workpiece W is set in the control means 16 in advance before performing finish grinding by in-feed grinding on the plate-like workpiece W.

  The transport robot 8 shown in FIG. 1 is operated, and one plate-like workpiece W before grinding is taken out from the storage cassette 7a by the robot hand 8a. Thereafter, the transfer robot 8 moves in the X2 direction until the robot hand 8 a reaches the temporary placement table 9 and places the plate-like workpiece W on the temporary placement table 9. The conveyance unit 11 holds the plate-like workpiece W temporarily placed on the temporary placement table 9, and conveys the plate-like workpiece W to the holding table 4 located in the attachment / detachment region P1. When the plate-like workpiece W is sucked and held by the holding table 4, the turntable 4 is rotated in the direction of arrow A, the holding table 4 is moved to the grinding region P2, and the grinding feed means 50 is operated.

  Next, the first grinding means 20 shown in FIG. 2 is lowered in the Z1 direction, and the lower surface of the grinding wheel 24 is positioned at a preset cutting depth H. The first grinding means 20 shown in FIG. 3 rotates the grinding wheel 24 by rotating the spindle 21 in the direction of arrow A, and horizontally moves the grinding wheel 24 in the direction of arrow X2 by the grinding feed means 50 shown in FIG. . Then, the plate-like workpiece W held on the holding table 4 that moves relatively toward the rotating grinding wheel 24 is roughly ground from the side and subjected to creep feed grinding. During rough grinding, the control means 16 controls so as not to rotate the holding table 4.

  After the rough grinding of the plate-like workpiece W is completed, the turntable 4 shown in FIG. 1 is rotated in the direction of arrow A in order to finish-grind the plate-like workpiece W on which the rough grinding has been performed, so that the holding table 4 is ground. Move to P3 and position it below the second grinding means 30.

  An axis S2 of the spindle 31 constituting the second grinding means 30 shown in FIG. 4 is inclined by a predetermined angle by an angle adjusting means (not shown), and the inclined surface 400a of the lower surface of the grinding wheel 34 and the holding portion 400 of the holding table 4 is provided. The positions are adjusted so that the two are parallel to each other. The grinding feed means 51 shown in FIG. 1 is operated, and the second grinding means 30 is lowered in the Z1 direction from above the plate-like workpiece W as shown in FIG. Then, the grinding wheel 34 is brought into contact with the radius portion of the plate-like workpiece W sucked and held on the inclined surface 400a, and the plate-like workpiece W is subjected to finish grinding. At this time, in order to perform grinding by bringing the grinding wheel 34 into contact with the entire surface of the plate-like workpiece W, the holding table 4 is also rotated in the direction of arrow A to perform infeed grinding.

  Further, as shown in FIG. 5, during the finish grinding of the plate-like workpiece W, the thickness measuring unit 6 always measures the thickness of the plate-like workpiece W. That is, the height gauge 6 a is brought into contact with the upper surface of the plate-like workpiece W, and the height gauge 6 b is brought into contact with the inclined surface 400 a of the holding table 4. In infeed grinding, the height position of the plate-like workpiece W being ground can be measured by bringing the height gauge 6a into contact with the portion of the upper surface of the plate-like workpiece W that is not in contact with the grinding wheel 34. By subtracting the value of the height position of the inclined surface 400a of the holding table 4 from the value of the height position of the plate-like workpiece W, the thickness of the plate-like workpiece W is calculated. The calculated value is transmitted to the control means 16 shown in FIG. 1, and it is determined whether or not it matches the preset thickness of the plate-like workpiece W, and the plate-like workpiece W is ground to the finished thickness. If it is determined that the grinding has been completed, the finish grinding by the second grinding means 30 is terminated. On the other hand, when it is determined that the plate-like workpiece W is not ground to the finished thickness, the plate-like workpiece W is ground by the second grinding means 30 until the finished thickness is reached.

  After the plate-like workpiece W is all ground and finished to a predetermined thickness, the turntable 3 rotates in the direction of arrow A, and the holding table 4 is moved to the attachment / detachment region P1. Then, the ground plate-like workpiece W is transported from the holding table 4 to the cleaning unit 10 by the transport unit 12.

  The plate-like workpiece W conveyed to the cleaning unit 10 is subjected to a cleaning process and a drying process. Thereafter, the plate-like workpiece W is taken out from the cleaning unit 10 by the robot hand 8a of the transfer robot 8 and stored in the collection cassette 7b.

  Examples of difficult-to-grind materials for forming the plate-like workpiece W to be ground include sapphire and silicon carbide (SiC).

  In the grinding apparatus 1 shown in the embodiment, a first grinding means 20 that performs rough grinding by creep feed grinding on the plate-like workpiece W, and finish grinding by in-feed grinding on the plate-like workpiece W that has undergone rough grinding. Since the second grinding unit 30 and the third grinding unit 40 to be applied and the thickness measuring unit 6 of the plate-like workpiece W for measuring the thickness of the plate-like workpiece at the time of in-feed grinding, the first grinding unit 20 is provided. When the rough grinding is performed, the amount of removal of the plate-like workpiece W can be increased. During the finish grinding by the second grinding means 30 and the third grinding means 40, the thickness measuring unit 6 determines the thickness of the plate-like workpiece W. Finish grinding can be performed while monitoring. Therefore, even if the plate-like workpiece W, which is the object to be ground, is formed of a difficult-to-grind material, the plate-like workpiece W can be accurately ground and more efficiently than conventional.

1: Grinding device 2: Device base 3: Turntable 4: Holding table 400: Holding portion 400a: Inclined surface 401: Suction hole 402: Support portion 5a, 5b, 5c: Column 6: Thickness measuring portion 6a, 6b: Height gauge 7a : Storage cassette 7b: Collection cassette 8: Transfer robot 8a: Robot hand 9: Temporary placement table 10: Cleaning unit 11, 12: Transfer unit 13, 14, 15: Guide rail 16: Control means 20: First grinding means 21 : Spindle 22: housing 23: grinding wheel 24: grinding wheel 30: second grinding means 31: spindle 32: housing 33: grinding wheel 34: grinding wheel 40: third grinding means 41: spindle 42: housing 43: grinding Wheel 44: Grinding wheel 50, 51, 52: Grinding feed means

Claims (1)

A holding table capable of holding and rotating a plate-like workpiece, a grinding means mounted with a grinding wheel for grinding the plate-like workpiece held on the holding table, and a holding table disposed below the grinding means. A grinding apparatus comprising at least a turntable for positioning a holding table, a grinding feed means for causing the grinding means to approach and separate from the holding table, and a thickness measuring unit for measuring the thickness of the plate-like workpiece,
The holding table for holding the plate-like work by the holding table includes an inclined surface having a lower outer peripheral side with the center of the holding portion as a vertex,
The grinding means includes a first grinding means for contacting a first grinding wheel positioned at a predetermined cutting depth of the plate-like workpiece by the grinding feed means from a side surface of the plate-like workpiece;
A second grinding means for approaching and grinding the second grinding wheel by approaching the plate-like workpiece by grinding feed by the grinding feed means from above the plate-like workpiece held by the holding table;
The second grinding means includes angle adjusting means for inclining the second grinding means so that the grinding surface of the second grinding wheel and the inclined surface of the holding table are parallel to each other.
The rotation axis of the holding table and the rotation axis of the first grinding means are arranged in parallel;
By the grinding feed by the grinding feed means, the plate-like workpiece held on the holding table is relatively moved toward the first grinding wheel positioned at a predetermined cutting depth into which the first grinding wheel is to be cut. Move the first grinding wheel to grind the plate-like workpiece from the side,
After grinding by the first grinding means, the holding table is positioned below the second grinding means by the turntable, and the grinding surface of the second grinding wheel and the inclined surface of the holding table are parallel to each other. The second grinding means from above the rotating holding table while measuring the thickness of the plate-like workpiece held by the inclined surface of the holding table with the thickness measuring unit in a state in which the position is adjusted to be Is a grinding apparatus for grinding the plate-like workpiece to a predetermined thickness by lowering and bringing the second grinding wheel into contact with the radius portion of the upper surface of the plate-like workpiece .

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