JP2017100254A - Polishing device - Google Patents

Polishing device Download PDF

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JP2017100254A
JP2017100254A JP2015236434A JP2015236434A JP2017100254A JP 2017100254 A JP2017100254 A JP 2017100254A JP 2015236434 A JP2015236434 A JP 2015236434A JP 2015236434 A JP2015236434 A JP 2015236434A JP 2017100254 A JP2017100254 A JP 2017100254A
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polishing
dressing
dress
elastic wave
chuck table
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JP6704244B2 (en
Inventor
邱　暁明
Toshiaki Oka
暁明 邱
文照 田篠
Fumiteru Tashino
文照 田篠
直哉 介川
Naoya Sukegawa
直哉 介川
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2015236434A priority Critical patent/JP6704244B2/en
Priority to TW105134780A priority patent/TWI703011B/en
Priority to CN201611076656.7A priority patent/CN106994649B/en
Priority to KR1020160163425A priority patent/KR102503527B1/en
Publication of JP2017100254A publication Critical patent/JP2017100254A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

PROBLEM TO BE SOLVED: To make a force for pressing a dress part against a polishing surface of a polishing pad constant when dressing the polishing surface.SOLUTION: A polishing device comprises: an elastic wave detection sensor 80 for detecting an elastic wave generated when a polishing surface 401a of a polishing pad 401 comes into contact with a top face of a dress part for dressing the polishing surface 401a; and a control part 82 for stopping movement of polishing means 4 when the elastic wave detection sensor 80 has detected a setting value of a preset output signal. After the movement of the polishing means 4 is stopped by the control of the control part 82, the polishing means 4 and a dress mechanism 6 are dressed and fed relatively to dress the polishing surface 401a, and thus a force for pressing a dress board 601 against the polishing surface 401a can be made constant during dress.SELECTED DRAWING: Figure 6

Description

本発明は、研磨工具の研磨面をドレスする機構を有する研磨装置に関する。   The present invention relates to a polishing apparatus having a mechanism for dressing a polishing surface of a polishing tool.

研磨パッドを用いてウエーハを研磨する研磨装置では、研磨パッドが回転するとともに、研磨パッドを備える研磨ユニットが研磨ユニット送り機構によってウエーハに向けて送られ、研磨パッドの研磨面をウエーハに接触させている。研磨中は、研磨パッドの研磨面をウエーハに押し付けるため、ウエーハが研磨されることにより生じる屑が研磨パッドの研磨面に入り込み、研磨面が目つぶれを起こすことがある。そこで、研磨面の目つぶれを解消するために、研磨面にドレッサーを押し当てて研磨面をドレスすることにより、研磨加工能力を維持することが行われている。研磨面のドレスは、例えば、ウエーハを一枚研磨する毎に行なわれている（例えば、特許文献１参照）。   In a polishing apparatus that polishes a wafer using a polishing pad, the polishing pad rotates and a polishing unit including the polishing pad is fed toward the wafer by a polishing unit feed mechanism, and the polishing surface of the polishing pad is brought into contact with the wafer. Yes. During polishing, the polishing surface of the polishing pad is pressed against the wafer, so that debris generated by polishing the wafer may enter the polishing surface of the polishing pad and cause the polishing surface to be clogged. Therefore, in order to eliminate the clogging of the polishing surface, it is performed to maintain the polishing processing capability by dressing the polishing surface by pressing a dresser against the polishing surface. The dressing of the polishing surface is performed, for example, every time one wafer is polished (see, for example, Patent Document 1).

特開２００６−０５５９７１号公報JP 2006-055971 A

しかし、研磨パッドの研磨面は軟らかく、ウエーハに押し付けることにより押し潰されることがある。また、研磨加工によって研磨面が消耗するため、研磨加工後は、研磨面の高さが一定にならない。そのため、研磨面をドレッサーに接触させる際の研磨ユニットの高さを常に一定とすると、研磨面に対してドレッサーを押し当てる力が一定にならないという問題がある。   However, the polishing surface of the polishing pad is soft and may be crushed when pressed against the wafer. Further, since the polishing surface is consumed by the polishing process, the height of the polishing surface is not constant after the polishing process. Therefore, if the height of the polishing unit when the polishing surface is brought into contact with the dresser is always constant, there is a problem that the force for pressing the dresser against the polishing surface is not constant.

研磨面に対してドレッサーを押し当てる力を一定にするために、現状では、研磨加工終了時の研磨ユニット送り機構が把握する研磨ユニットの位置情報を記憶するとともに、研磨加工終了時のウエーハの上面高さ情報を記憶しておき、これらの情報に基づいて、ドレス時の適正な研磨ユニットの高さを算出し、研磨ユニット送り機構が研磨ユニットをその高さに位置付けた状態でドレスを行うこととしている。また、押し潰された研磨パッドが元に戻ろうとして膨らむことによって研磨面の高さが変化することがあるため、研磨ユニット送り機構は、研磨ユニットの高さ制御に際し、研磨パッドの膨らみも考慮している。   In order to keep the force to press the dresser against the polishing surface constant, at the present time, the polishing unit feed mechanism at the end of the polishing process stores the position information of the polishing unit and the upper surface of the wafer at the end of the polishing process Store the height information, calculate the appropriate height of the polishing unit at the time of dressing based on this information, and perform the dressing with the polishing unit feed mechanism positioning the polishing unit at that height It is said. In addition, since the height of the polishing surface may change when the crushed polishing pad swells to return to its original state, the polishing unit feed mechanism also considers the swelling of the polishing pad when controlling the height of the polishing unit. doing.

しかし、ドレス時には、上記のように研磨面が押し潰されてドレッサーが研磨面に強く接触しすぎることがあり、また、研磨パッドが予定したように膨らまないためにドレッサーが研磨面に接触しなかったり押し当てる力が弱すぎたりする場合もある。   However, when dressing, the polishing surface may be crushed as described above, and the dresser may be in contact with the polishing surface too much, and the dresser will not contact the polishing surface because the polishing pad does not swell as expected. Or the pressing force may be too weak.

したがって、研磨パッドの研磨面のドレスにおいては、研磨面に対してドレス部を押し当てる力を一定にするという課題がある。   Accordingly, in the dressing of the polishing surface of the polishing pad, there is a problem that the force for pressing the dress portion against the polishing surface is made constant.

板状ワークを保持面において保持するチャックテーブルと、該チャックテーブルに保持される板状ワークを研磨する研磨工具が装着され該研磨工具を回転させる回転手段を備え該研磨工具の研磨面を板状ワークに接触させて板状ワークを研磨する研磨手段と、該研磨手段を該チャックテーブルに対して接近及び離間する方向に移動させる研磨送り手段と、該研磨面をドレスするドレス機構と、該研磨手段と該ドレス機構とを相対的に該研磨面に平行にドレス送りするドレス送り手段とを備える研磨装置であって、該ドレス機構は、該研磨面に接触するドレス部と、該ドレス部が配設されるベースと、を備え、
該研磨手段が該研磨工具を回転させ該研磨送り手段が該研磨手段を該チャックテーブルの該保持面に接近する方向に研磨送りすることにより該ドレス部の上面に該研磨面が接触した時に発生する弾性波を検出する弾性波検出センサと、該弾性波検出センサが予め設定される出力信号の設定値を検出した時に該研磨送り手段による該研磨手段の移動を停止させる制御部と、を備え、該制御部の制御により該研磨手段の移動を停止させた後、該研磨手段と該ドレス機構とを該ドレス送り手段によって相対的にドレス送りし該研磨面をドレスする。 A chuck table for holding a plate-like workpiece on a holding surface, and a polishing tool for polishing the plate-like workpiece held on the chuck table, and a rotating means for rotating the polishing tool are provided. Polishing means for polishing a plate-like work in contact with the workpiece, polishing feed means for moving the polishing means in a direction approaching and separating from the chuck table, a dressing mechanism for dressing the polishing surface, and the polishing A polishing apparatus comprising dress feeding means for dressing the means and the dressing mechanism relatively in parallel with the polishing surface, wherein the dressing mechanism includes a dressing portion that contacts the polishing surface, A base to be disposed;
Occurs when the polishing surface comes into contact with the upper surface of the dressing portion by rotating the polishing tool and the polishing feeding device polishing and feeding the polishing device in a direction approaching the holding surface of the chuck table. An elastic wave detection sensor for detecting an elastic wave to be detected, and a control unit for stopping the movement of the polishing means by the polishing feed means when the elastic wave detection sensor detects a preset value of an output signal set in advance. After the movement of the polishing means is stopped by the control of the control unit, the polishing means and the dressing mechanism are relatively dressed by the dress feeding means to dress the polishing surface.

上記研磨装置においては、前記弾性波検出センサが検出した出力信号を出力電圧に変換するアンプを備え、該アンプから出力される電圧が予め設定した設定値を検出した時に前記研磨送り手段による研磨送りを停止させ、前記研磨面のドレスを行うようにしてもよい。
また、上記研磨装置においては、前記弾性波検出センサが検出した出力信号をフーリエ変換し、予め設定した設定値である周波数を検出した時に前記研磨送り手段による研磨送りを停止させ、前記研磨面のドレスを行うようにしてもよい。 The polishing apparatus includes an amplifier that converts an output signal detected by the elastic wave detection sensor into an output voltage, and when the voltage output from the amplifier detects a preset set value, the polishing feed by the polishing feed unit May be stopped and the polishing surface may be dressed.
Further, in the polishing apparatus, the output signal detected by the elastic wave detection sensor is Fourier-transformed, and when the frequency which is a preset set value is detected, the polishing feed by the polishing feeding means is stopped, and the polishing surface of the polishing surface is stopped. You may make it dress.

本発明に係る研磨装置は、研磨パッドの研磨面をドレスするドレス部の上面に研磨面が接触した時に発生する弾性波を検出する弾性波検出センサと、弾性波検出センサが予め設定される出力信号の設定値を検出した時に研磨手段の移動を停止させる制御部と、を備え、制御部の制御により研磨手段の移動を停止させた後、研磨手段とドレス機構とを相対的にドレス送りして研磨面をドレスするため、ドレス時に研磨面に対してドレスボードを押し当てる力を一定にすることができる。   The polishing apparatus according to the present invention includes an elastic wave detection sensor that detects an elastic wave that is generated when the polishing surface comes into contact with the upper surface of a dress portion that dresses the polishing surface of the polishing pad, and an output in which the elastic wave detection sensor is set in advance. A controller that stops the movement of the polishing means when the set value of the signal is detected, and after the movement of the polishing means is stopped by the control of the control section, the polishing means and the dressing mechanism are relatively dress-fed. Since the polishing surface is dressed, the force for pressing the dressboard against the polishing surface during dressing can be made constant.

研磨装置の一例を示す斜視図である。It is a perspective view which shows an example of a grinding | polishing apparatus. 研磨工具の上面側を示す斜視図である。It is a perspective view which shows the upper surface side of a polishing tool. 研磨工具の下面側を示す斜視図である。It is a perspective view which shows the lower surface side of a polishing tool. チャックテーブル機構、ドレス機構及び弾性波検出センサを示す斜視図である。It is a perspective view which shows a chuck table mechanism, a dress mechanism, and an elastic wave detection sensor. 支持機構、ドレス機構及び弾性波検出センサを示す斜視図である。It is a perspective view which shows a support mechanism, a dress mechanism, and an elastic wave detection sensor. ドレスボードを研磨パッドの研磨面に接触させて研磨面のドレスを行う状態を示す側面図である。It is a side view which shows the state which makes a dress board contact the polishing surface of a polishing pad, and dresses a polishing surface. 弾性波検出センサの出力信号を出力電圧に変換した結果を示すグラフである。It is a graph which shows the result of having converted the output signal of an elastic wave detection sensor into the output voltage. 弾性波検出センサの出力信号をフーリエ変換した結果を示すグラフである。It is a graph which shows the result of having Fourier-transformed the output signal of an elastic wave detection sensor.

図１に示す研磨装置１は、チャックテーブル５２に保持された板状ワークＷを、研磨工具４０を備える研磨手段４によって研磨する装置である。   A polishing apparatus 1 shown in FIG. 1 is an apparatus for polishing a plate-like workpiece W held on a chuck table 52 by polishing means 4 including a polishing tool 40.

研磨装置１のベース１０上には、チャックテーブル機構５が配設されている。チャックテーブル機構５は、実質上鉛直に延びる回転中心軸線を中心として回転自在に配設された円板形状のチャックテーブル５２と、その周囲のカバー５１とを含んでいる。   A chuck table mechanism 5 is disposed on the base 10 of the polishing apparatus 1. The chuck table mechanism 5 includes a disk-shaped chuck table 52 and a cover 51 around it, which are arranged to be rotatable about a rotation center axis extending substantially vertically.

チャックテーブル５２は、例えば、その外形が円形状であり、ポーラス部材等からなり板状ワークＷを吸着する吸着部５２０と、吸着部５２０を支持する枠体５２１とを備える。吸着部５２０は図示しない吸引源に連通し、吸引源が吸引することで生み出された吸引力が、吸着部５２０の露出面である保持面５２０ａに伝達されることで、チャックテーブル５２０は、保持面５２０ａ上で板状ワークＷを吸引保持する。また、チャックテーブル５２は、カバー５１によって周囲から囲まれ、図示しない回転手段により回転可能に支持されている。   The chuck table 52 has, for example, a circular outer shape, and includes a suction portion 520 that is made of a porous member or the like and sucks the plate-like workpiece W, and a frame body 521 that supports the suction portion 520. The suction unit 520 communicates with a suction source (not shown), and suction force generated by suction by the suction source is transmitted to the holding surface 520a that is the exposed surface of the suction unit 520, whereby the chuck table 520 is held. The plate-like workpiece W is sucked and held on the surface 520a. The chuck table 52 is surrounded by a cover 51 from the periphery, and is rotatably supported by a rotating means (not shown).

ベース１０上の側方（−Ｘ方向側）にはコラム１１が立設されており、コラム１１の前面には、研磨手段４をチャックテーブル５２に対して接近及び離反する方向に移動させる研磨送り手段２が配設されている。研磨送り手段２は、鉛直方向（Ｚ軸方向）の軸心を有するボールネジ２０と、ボールネジ２０と平行に配設された一対のガイドレール２１と、ボールネジ２０の上端に連結しボールネジ２０を回動させるモータ２２と、内部のナットがボールネジ２０に螺合し側部がガイドレールに摺接する昇降板２３と、昇降板２３に連結され研磨手段４を保持するホルダ２４とから構成され、モータ２２がボールネジ２０を回動させると、これに伴い昇降板２３がガイドレール２１にガイドされてＺ軸方向に往復移動し、ホルダ２４に保持された研磨手段４がＺ軸方向に研磨送りされる。モータ２２の制御は、ＣＰＵ、メモリ等を備えた制御部８２によって行われる。   A column 11 is erected on the side (−X direction side) on the base 10, and a polishing feed for moving the polishing means 4 toward and away from the chuck table 52 on the front surface of the column 11. Means 2 are provided. The polishing feed means 2 is connected to a ball screw 20 having a vertical (Z-axis direction) axis center, a pair of guide rails 21 arranged in parallel to the ball screw 20, and an upper end of the ball screw 20, and rotates the ball screw 20. A motor 22 to be moved, an elevating plate 23 whose inner nut is screwed into the ball screw 20 and whose side portion is in sliding contact with the guide rail, and a holder 24 which is connected to the elevating plate 23 and holds the polishing means 4. When the ball screw 20 is rotated, the lifting plate 23 is guided by the guide rail 21 and reciprocates in the Z-axis direction, and the polishing means 4 held by the holder 24 is polished and fed in the Z-axis direction. Control of the motor 22 is performed by a control unit 82 including a CPU, a memory, and the like.

研磨手段４は、マウント４１を有するスピンドル４２と、マウント４１に装着されチャックテーブル５２に保持される板状ワークＷを研磨する研磨工具４０と、スピンドル４２に装着される研磨工具４０と、スピンドル４２を回転させることにより研磨工具４０を回転させる回転手段４３とを備えている。   The polishing means 4 includes a spindle 42 having a mount 41, a polishing tool 40 for polishing a plate-like workpiece W mounted on the mount 41 and held on the chuck table 52, a polishing tool 40 mounted on the spindle 42, and the spindle 42. Rotating means 43 for rotating the polishing tool 40 by rotating the tool.

研磨工具４０は、図２および図３に示すように、円板形状の支持部材４００と円板形状の研磨パッド４０１とから構成されている。研磨パッド４０１の下面が研磨面４０１ａとなっている。支持部材４００には、周方向に間隔をおいてその上面から下方に延びる複数の盲ねじ穴４００ａが形成されている。支持部材４００の下面は円形支持面を構成しており、研磨パッド４０１は、例えばエポキシ樹脂系接着剤からなる接着剤によって支持部材４００の円形支持面に接合されている。研磨パッド４０１は、図示の実施形態においてはフエルトに砥粒を分散させ適宜のボンド剤で固定したフエルト砥石が用いられている。   As shown in FIGS. 2 and 3, the polishing tool 40 includes a disk-shaped support member 400 and a disk-shaped polishing pad 401. The lower surface of the polishing pad 401 is a polishing surface 401a. The support member 400 is formed with a plurality of blind screw holes 400a extending downward from the upper surface at intervals in the circumferential direction. The lower surface of the support member 400 forms a circular support surface, and the polishing pad 401 is joined to the circular support surface of the support member 400 with an adhesive made of, for example, an epoxy resin adhesive. In the illustrated embodiment, the polishing pad 401 is a felt grindstone in which abrasive grains are dispersed in a felt and fixed with an appropriate bonding agent.

スピンドル４２の下端に固定されているマウント４１の下面に研磨工具４０を位置付け、マウント４１に形成されている貫通孔を通して研磨工具４０の支持部材４００に形成されている盲ねじ孔４００ａに締結ボルト４４を螺着することによって、マウント４１に研磨工具４０が装着される。   The polishing tool 40 is positioned on the lower surface of the mount 41 fixed to the lower end of the spindle 42, and the fastening bolt 44 is inserted into the blind screw hole 400 a formed in the support member 400 of the polishing tool 40 through the through hole formed in the mount 41. Is attached to the mount 41 by screwing.

図４に示すように、チャックテーブル機構５は、チャックテーブル５２をＹ軸方向に移動させるチャックテーブル送り手段５６を備えている。チャックテーブル送り手段５６は、Ｙ軸方向に延在するボールネジ５６１と、ボールネジ５６１の一端に連結されボールネジ５６１を正逆両方向に回転させるモータ５６２と、ボールネジ５６１の他端においてボールネジ５６１を回転可能に支持する軸受部５６３と、ボールネジ５６１と平行に配設された一対のガイドレール５６４と、内部のナット５３１がボールネジ５６１に螺合するとともに底部がガイドレール５６４に摺接する移動基台５３とから構成されており、モータ５６２がボールネジ５６１を正転駆動すると移動基台５３が＋Ｙ方向に移動し、モータ５６２がボールネジ５６１を逆転駆動すると移動基台５３が−Ｙ方向に移動する。移動基台５３がＹ軸方向に移動することにより、チャックテーブル５２が、チャックテーブル５２に対する板状ワークの着脱が行われる領域である図１に示す着脱域１００と、研磨工具４０による研磨が行われる領域である研磨域１０１との間を移動可能となっている。また、ガイドレール５６４と平行にリニアスケール５７１が配設されるとともに、移動基台５３にはリニアスケール５７１を読み取る読み取りヘッド５７２を備えており、読み取りヘッド５７２は、移動基台５３のＹ軸方向の位置情報を、制御部８２に通知する。   As shown in FIG. 4, the chuck table mechanism 5 includes a chuck table feeding unit 56 that moves the chuck table 52 in the Y-axis direction. The chuck table feeding means 56 includes a ball screw 561 extending in the Y-axis direction, a motor 562 connected to one end of the ball screw 561 and rotating the ball screw 561 in both forward and reverse directions, and the ball screw 561 being rotatable at the other end of the ball screw 561. A bearing portion 563 to be supported, a pair of guide rails 564 arranged in parallel with the ball screw 561, and a movable base 53 whose inner nut 531 is screwed into the ball screw 561 and whose bottom portion is in sliding contact with the guide rail 564. When the motor 562 drives the ball screw 561 in the normal direction, the moving base 53 moves in the + Y direction. When the motor 562 drives the ball screw 561 in the reverse direction, the moving base 53 moves in the -Y direction. As the moving base 53 moves in the Y-axis direction, the chuck table 52 is polished by the attaching / detaching area 100 shown in FIG. It is possible to move between the polishing area 101, which is an area to be broken. In addition, a linear scale 571 is disposed in parallel with the guide rail 564, and the moving base 53 is provided with a reading head 572 that reads the linear scale 571. Is notified to the control unit 82.

図４に示すように、移動基台５３には、図示しない回転軸を介してチャックテーブル５２に連結されたモータ５４が配設されており、モータ５４がチャックテーブル５２を所望の回転速度で回転させる。   As shown in FIG. 4, the moving base 53 is provided with a motor 54 connected to the chuck table 52 via a rotating shaft (not shown), and the motor 54 rotates the chuck table 52 at a desired rotational speed. Let

図１及び図４に示すように、カバー５１の上面には、研磨工具４０の研磨面４００をドレスするドレス機構６が配設されている。ドレス機構６は、図５に示すように、研磨工具４０の研磨面４００に接触してドレスを行うドレス部６０と、ドレス６０が配設されるベース６１と、ベース６１を昇降可能に支持する支持機構７とを備えている。ドレス部６０は、ベース６１から立設された支持部６００と、支持部６００の上端に固定されたドレスボード６０１とから構成されている。   As shown in FIGS. 1 and 4, a dress mechanism 6 for dressing the polishing surface 400 of the polishing tool 40 is disposed on the upper surface of the cover 51. As shown in FIG. 5, the dressing mechanism 6 contacts a polishing surface 400 of the polishing tool 40 to perform dressing, a base 61 on which the dress 60 is disposed, and a base 61 that supports the base 61 so that it can be raised and lowered. And a support mechanism 7. The dress unit 60 includes a support unit 600 erected from the base 61 and a dress board 601 fixed to the upper end of the support unit 600.

支持機構７は、ベース６１を支持する支持板７１と、支持板７１を支持する移動基板７２と、図４に示した移動基台５３に立設され移動基板７２の上下方向の移動を案内する４本の案内ロッド７３と、移動基板７２を案内ロッド７３に沿って移動させる昇降手段７４と、移動基板７２と支持板７１との間に配設された水平度調整手段７５とを具備している。支持板７１は、矩形状に形成されており、その上面には、ベース６１に設けられた３個の取付け穴６１１に対応する位置に３個のネジ穴７１１が形成されている。このネジ穴７１１にベース６１に設けられた取付け穴６１１を通した皿ネジ７６を螺合させることによって、支持板７１上にドレス機構６が装着される。なお、支持板７１上にドレス機構６を取り付けた状態において、皿ネジ７６は、その頭部が取付け穴６１１の上部のテーパー面に嵌合してベース６１の上面より低い位置に位置付けられる。   The support mechanism 7 is provided on a support base 71 that supports the base 61, a moving board 72 that supports the support board 71, and a moving base 53 shown in FIG. 4, and guides the vertical movement of the moving board 72. Four guide rods 73, lifting / lowering means 74 for moving the moving substrate 72 along the guide rod 73, and a leveling adjustment means 75 disposed between the moving substrate 72 and the support plate 71 are provided. Yes. The support plate 71 is formed in a rectangular shape, and three screw holes 711 are formed on the upper surface thereof at positions corresponding to the three attachment holes 611 provided in the base 61. The dressing mechanism 6 is mounted on the support plate 71 by screwing a countersunk screw 76 that passes through a mounting hole 611 provided in the base 61 into the screw hole 711. In the state where the dressing mechanism 6 is mounted on the support plate 71, the countersunk screw 76 is positioned at a position lower than the upper surface of the base 61 with its head fitted into the upper tapered surface of the mounting hole 611.

支持板７１を支持する移動基板７２は矩形状に形成されており、その四隅部には、上下方向に貫通する４個の被案内穴７２１が設けられている。この４個の被案内穴７２１を４本の案内ロッド７３にそれぞれ挿通することにより、移動基板７２が案内ロッド７３に沿って上下方向に移動可能に構成される。移動基板７２を案内ロッド７３に沿って移動させる昇降手段７４は、図４に示した移動基台５３上に配設され正転・逆転可能なパルスモータ７４１及びパルスモータ７４１によって駆動されるボールネジ７４２を含んでおり、パルスモータ７４１を正転駆動すると移動基板７２が上昇し、パルスモータ７４１を逆転駆動すると移動基板７２が下降する。また、移動基板７２と支持板７１との間に配設された水平度調整手段７５は、支持板７１の長手方向に間隔をおいて配設された２個の昇降手段７５１からなっている。この昇降手段７５１は、パルスモータおよびパルスモータによって駆動されるボールネジを含んでおり、パルスモータを正転駆動すると支持板７１が上昇し、パルスモータを逆転駆動すると支持板７１が下降する。２個の昇降手段７５１を個別に昇降させることにより、支持板７１の上面に装着されたベース６１の水平度を調整することができる。   The movable substrate 72 that supports the support plate 71 is formed in a rectangular shape, and four guided holes 721 that penetrate in the vertical direction are provided at the four corners. By inserting the four guided holes 721 through the four guide rods 73, the movable substrate 72 is configured to be movable in the vertical direction along the guide rods 73. The lifting / lowering means 74 for moving the moving substrate 72 along the guide rod 73 is disposed on the moving base 53 shown in FIG. 4 and is capable of normal / reverse rotation, and a ball screw 742 driven by the pulse motor 741. When the pulse motor 741 is driven forward, the moving substrate 72 is raised, and when the pulse motor 741 is driven reversely, the moving substrate 72 is lowered. Further, the leveling adjustment means 75 disposed between the movable substrate 72 and the support plate 71 is composed of two lifting / lowering means 751 disposed at intervals in the longitudinal direction of the support plate 71. The elevating means 751 includes a pulse motor and a ball screw driven by the pulse motor. When the pulse motor is driven forward, the support plate 71 is raised, and when the pulse motor is driven reversely, the support plate 71 is lowered. The level of the base 61 mounted on the upper surface of the support plate 71 can be adjusted by lifting and lowering the two lifting means 751 individually.

カバー５１上のドレス部６０に隣接する位置には、弾性波検出センサ８０が配設されている。この弾性波検出センサ８０は、ドレス部６０の上面に研磨パッド４０１が接触したときに発生する弾性波を検出する機能を有している。弾性波検出センサ８０としては、例えばＡＥセンサを用いることができる。   An elastic wave detection sensor 80 is disposed at a position adjacent to the dress portion 60 on the cover 51. The elastic wave detection sensor 80 has a function of detecting an elastic wave generated when the polishing pad 401 comes into contact with the upper surface of the dress portion 60. As the elastic wave detection sensor 80, for example, an AE sensor can be used.

図１に示すように、弾性波検出センサ８０は、信号処理部８１に接続されている。信号処理部８１には、弾性波検出センサ８０が検出した出力信号を出力電圧に変換するアンプ、又は、弾性波検出センサ８０が検出した出力信号をフーリエ変換するフーリエ変換部を備えている。   As shown in FIG. 1, the elastic wave detection sensor 80 is connected to a signal processing unit 81. The signal processing unit 81 includes an amplifier that converts an output signal detected by the elastic wave detection sensor 80 into an output voltage, or a Fourier transform unit that Fourier-transforms the output signal detected by the elastic wave detection sensor 80.

図１に示した研磨装置１においては、研磨対象のウエーハＷの一方の面Ｗ１にテープＴが貼着される。そして、図４に示したチャックテーブル送り手段５６がチャックテーブル５２を着脱域１００に移動させ、テープＴ側がチャックテーブル５２の保持面５２０ａに載置され、図示しない吸引源が吸引することで生み出された吸引力がチャックテーブル５２の保持面５２０ａに伝達されて、チャックテーブル５２がテープＴを介して板状ワークＷを吸引保持し、被研磨面Ｗ２が露出した状態となる。   In the polishing apparatus 1 shown in FIG. 1, a tape T is attached to one surface W1 of a wafer W to be polished. Then, the chuck table feeding means 56 shown in FIG. 4 moves the chuck table 52 to the attachment / detachment area 100, the tape T side is placed on the holding surface 520 a of the chuck table 52, and a suction source (not shown) sucks. The suction force is transmitted to the holding surface 520a of the chuck table 52, the chuck table 52 sucks and holds the plate-like workpiece W via the tape T, and the surface to be polished W2 is exposed.

次に、チャックテーブル送り手段５６がチャックテーブル５２を研磨域１０１に移動させるとともに、図４に示したモータ５４がチャックテーブル５２を回転させる。そして、研磨手段４においては回転手段４３がスピンドル４２を回転させて研磨パッド４００を回転させ、研磨送り手段２が研磨手段４をチャックテーブル５２の保持面５２０ａに接近する方向（−Ｚ方向）に研磨送りし、回転する研磨パッド４０１の研磨面４０１ａを板状ワークＷの被研磨面Ｗ２に接触させて研磨を行う。このとき、図５に示した昇降手段７４がドレス機構６を下降させておき、少なくともドレス部６０のドレスボード６１の上面がチャックテーブル５２の保持面５２０ａよりも下側（−Ｚ方向）に位置するようにし、研磨面４０１ａがドレスボード６１に接触しないようにしておく。   Next, the chuck table feeding means 56 moves the chuck table 52 to the polishing zone 101, and the motor 54 shown in FIG. In the polishing unit 4, the rotating unit 43 rotates the spindle 42 to rotate the polishing pad 400, and the polishing feeding unit 2 moves the polishing unit 4 in the direction approaching the holding surface 520 a of the chuck table 52 (−Z direction). Polishing is performed by bringing the polishing surface 401a of the polishing pad 401 to be polished into contact with the surface to be polished W2 of the plate-like workpiece W for polishing. At this time, the lifting / lowering means 74 shown in FIG. 5 lowers the dressing mechanism 6, and at least the upper surface of the dressboard 61 of the dressing portion 60 is positioned below (−Z direction) below the holding surface 520 a of the chuck table 52. The polishing surface 401a is not in contact with the dress board 61.

かかる研磨により生じた研磨屑が研磨パッド４０１の研磨面４０１ａに入り込んで研磨面４０１ａが目つぶれを起こすのを解消したり防止したりするために、適宜のタイミングで、研磨面４０１ａにドレッサーを押し当てて研磨面４０１ａをドレスする。   In order to eliminate or prevent the polishing debris generated by the polishing from entering the polishing surface 401a of the polishing pad 401 and causing the crushing of the polishing surface 401a, a dresser is pushed onto the polishing surface 401a at an appropriate timing. The polishing surface 401a is dressed by applying.

研磨面４０１ａのドレス時は、図４に示したチャックテーブル送り手段５６が移動基台５３をＹ軸方向に移動させ、ドレスボード６０１を研磨パッド４０１の下方に移動させる。   When dressing the polishing surface 401 a, the chuck table feeding means 56 shown in FIG. 4 moves the moving base 53 in the Y-axis direction and moves the dressboard 601 below the polishing pad 401.

そして、図５に示した昇降手段７４が支持板７１を上昇させることによりベース６１を上昇させ、ドレスボード６０１の上面を、チャックテーブル５２の保持面５２０ａよりも上側（＋Ｚ軸方向）に位置付ける。その後、研磨手段４において回転手段４３が研磨パッド４０１を回転させながら、研磨送り手段２が研磨手段４をチャックテーブル５２の保持面５２０ａに接近する方向に研磨送りする。そうすると、図６に示すように、ドレスボード６０１が、回転する研磨パッド４０１の研磨面４０１ａに接触する。   Then, the elevating means 74 shown in FIG. 5 raises the base 61 by raising the support plate 71, and positions the upper surface of the dressboard 601 above the holding surface 520 a of the chuck table 52 (+ Z axis direction). Thereafter, in the polishing unit 4, the polishing unit 4 polishes and feeds the polishing unit 4 in a direction approaching the holding surface 520 a of the chuck table 52 while the rotation unit 43 rotates the polishing pad 401. Then, as shown in FIG. 6, the dress board 601 comes into contact with the polishing surface 401 a of the rotating polishing pad 401.

ドレスボード６０１の上面が回転する研磨パッド４０１の研磨面４０１ａに接触すると、弾性波が発生する。ドレス機構６の近傍に位置する弾性波検出センサ８０は、この弾性波を検出し、この出力信号が所定の設定値に到達したことを検出した時に、図１に示した制御部８２は、研磨送り手段２による研磨手段４の−Ｚ方向の移動を停止させる。所定の設定値は、例えば制御部８２に備えるメモリに記憶される。   When the upper surface of the dress board 601 comes into contact with the polishing surface 401a of the rotating polishing pad 401, an elastic wave is generated. When the elastic wave detection sensor 80 located in the vicinity of the dressing mechanism 6 detects this elastic wave and detects that this output signal has reached a predetermined set value, the control unit 82 shown in FIG. The movement of the polishing means 4 in the −Z direction by the feeding means 2 is stopped. The predetermined set value is stored in a memory provided in the control unit 82, for example.

そしてその後、チャックテーブル送り手段５６が、研磨手段４に対してドレス機構６をＹ軸方向にドレス送りすることにより、回転する研磨パッド４０１の研磨面４０１ａの全面をドレスボード６０１によってドレスする。すなわち、チャックテーブル送り手段５６は、研磨手段４とドレス機構６とを研磨面４０１ａに平行に移動させるドレス送り手段として機能する。   After that, the chuck table feeding unit 56 dresses the dressing mechanism 6 in the Y-axis direction with respect to the polishing unit 4, so that the entire polishing surface 401 a of the rotating polishing pad 401 is dressed by the dress board 601. That is, the chuck table feeding unit 56 functions as a dress feeding unit that moves the polishing unit 4 and the dressing mechanism 6 in parallel with the polishing surface 401a.

このように、弾性波検出センサ８０の出力信号が所定の設定値に到達したことを検出した時に、研磨手段４の−Ｚ方向の移動が停止し、研磨手段４がその時のＺ軸方向の位置を保ったまま研磨面４０１ａのドレスを行うため、ドレス中は、ドレスボード６０１を研磨面４０１ａに対して押し当てる力を一定にすることができる。   Thus, when it is detected that the output signal of the elastic wave detection sensor 80 has reached a predetermined set value, the movement of the polishing means 4 in the −Z direction is stopped, and the polishing means 4 is moved to the position in the Z-axis direction at that time. Since the dressing of the polishing surface 401a is performed while maintaining the above, the force for pressing the dressboard 601 against the polishing surface 401a can be made constant during the dressing.

また、研磨面４０１ａのドレスがいったん終了した後は、別の板状ワークの研磨を行い、再び研磨面４０１ａのドレスを行うが、そのドレス時においても、弾性波検出センサ８０の出力信号が前記所定の設定値に到達したことを検出した時に、研磨手段４の−Ｚ方向の移動が停止し、研磨手段４がその時のＺ軸方向の位置を保ったまま研磨面４０１ａのドレスを行う。したがって、研磨面４０１ａに対してドレスボード６０１を押し当てる力を、前回のドレス時と同じにすることができる。すなわち、何度ドレスを繰り返しても、ドレス時ごとに研磨面４０１ａに対してドレスボード６０１を押し当てる力を常に一定とすることができる。また、ドレス時ごとに研磨パッド４０１の膨らみが異なる場合であっても、膨らみの違いに対応してドレスボード６０１を押し当てる力を調整することができる。   Further, after the dressing of the polishing surface 401a is once finished, another plate-like workpiece is polished and the polishing surface 401a is dressed again. Even at the time of dressing, the output signal of the elastic wave detection sensor 80 is the above-mentioned signal. When it is detected that the predetermined set value has been reached, the movement of the polishing means 4 in the −Z direction stops, and the polishing means 4 dresses the polishing surface 401a while maintaining the position in the Z-axis direction at that time. Therefore, the force that presses the dressboard 601 against the polishing surface 401a can be made the same as the previous dressing. That is, no matter how many times the dressing is repeated, the force for pressing the dressboard 601 against the polishing surface 401a at every dressing can always be constant. Further, even when the bulge of the polishing pad 401 is different for each dressing, the force for pressing the dressboard 601 can be adjusted in accordance with the difference in bulge.

信号処理部８１に、弾性波検出センサ８０が検出した出力信号を出力電圧に変換するアンプを備えている場合は、弾性波検出のための電圧の閾値を制御部８２に記憶しておく。そして、アンプからの出力電圧が例えば図７に示すグラフのようになる場合において、所定の電圧値を閾値として制御部８２に設定しておけば、アンプから出力される実際の電圧値がその閾値に達した時に、研磨送り手段２による研磨手段４の研磨送りを停止させ、研磨パッド４０１の研磨面４０１ａのドレスを開始する。そうすることにより、ドレス時に研磨面４０１ａに対してドレスボード６０１を押し当てる力を一定にすることができる。   When the signal processing unit 81 includes an amplifier that converts the output signal detected by the elastic wave detection sensor 80 into an output voltage, the threshold value of the voltage for elastic wave detection is stored in the control unit 82. When the output voltage from the amplifier is as shown in the graph of FIG. 7, for example, if a predetermined voltage value is set as a threshold value in the control unit 82, the actual voltage value output from the amplifier is the threshold value. Is reached, the polishing feed of the polishing means 4 by the polishing feed means 2 is stopped, and dressing of the polishing surface 401a of the polishing pad 401 is started. By doing so, the force which presses the dress board 601 with respect to the grinding | polishing surface 401a at the time of dressing can be made constant.

一方、信号処理部８１には、弾性波検出センサ８０が検出した出力信号をフーリエ変換するフーリエ変換部を備えてもよい。フーリエ変換部は、ＣＰＵ、メモリ等を備え、弾性波検出センサ８０からの出力信号をフーリエ変換することにより、例えば図８に示す波形を得る。この波形において、特定の周波数において波形が上方に突出している部分が周波数のピーク値であり、この周波数のピーク値を制御部８２のメモリに記憶しておくことにより、このピーク値を制御部８２が検出した時に、研磨送り手段２による研磨手段４の研磨送りを停止させ、研磨パッド４０１の研磨面４０１ａのドレスを開始する。そうすることにより、ドレス時に研磨面４０１ａに対してドレスボード６０１を押し当てる力を一定にすることができる。   On the other hand, the signal processing unit 81 may include a Fourier transform unit that performs a Fourier transform on the output signal detected by the elastic wave detection sensor 80. The Fourier transform unit includes a CPU, a memory, and the like, and obtains, for example, a waveform illustrated in FIG. 8 by performing Fourier transform on the output signal from the elastic wave detection sensor 80. In this waveform, the portion where the waveform protrudes upward at a specific frequency is the peak value of the frequency. By storing this peak value of the frequency in the memory of the control unit 82, this peak value is stored in the control unit 82. Is detected, the polishing feed of the polishing means 4 by the polishing feed means 2 is stopped, and dressing of the polishing surface 401a of the polishing pad 401 is started. By doing so, the force which presses the dress board 601 with respect to the grinding | polishing surface 401a at the time of dressing can be made constant.

なお、上記実施形態では、チャックテーブル送り手段５６がドレス送り手段を兼ねることとしたが、チャックテーブル送り手段とドレス送り手段とがそれぞれが単独に存在してもよい。したがって、ドレス機構６は、チャックテーブル機構５のカバー５１上に配設されていなくてもよい。   In the above-described embodiment, the chuck table feeding unit 56 also serves as the dress feeding unit. However, the chuck table feeding unit and the dress feeding unit may exist independently. Therefore, the dressing mechanism 6 may not be disposed on the cover 51 of the chuck table mechanism 5.

また、上記実施形態では、弾性波検出センサ８０をチャックテーブル機構５のカバー５１上においてドレス機構６に隣接する位置に配設したが、弾性波検出センサを研磨手段４に備える構成としてもよい。もっとも、上記実施形態のようにチャックテーブル機構５のカバー５１上に弾性波検出センサ８０を配設する構成とすると、装置構成が複雑化するのを防ぐことができる。   In the above embodiment, the elastic wave detection sensor 80 is disposed on the cover 51 of the chuck table mechanism 5 at a position adjacent to the dressing mechanism 6. However, the elastic wave detection sensor may be provided in the polishing unit 4. However, when the elastic wave detection sensor 80 is disposed on the cover 51 of the chuck table mechanism 5 as in the above embodiment, the apparatus configuration can be prevented from becoming complicated.

上記実施形態に示した研磨装置１は、いわゆるドライポリッシュ装置であるが、研磨パッドに加えてスラリーも用いて研磨を行うＣＭＰ装置にも本発明を適用することができる。   The polishing apparatus 1 shown in the above embodiment is a so-called dry polishing apparatus, but the present invention can also be applied to a CMP apparatus that performs polishing using a slurry in addition to a polishing pad.

１：研磨装置
２：研磨送り手段
２０：ボールネジ ２１：ガイドレール ２２：モータ ２３：昇降板 ２４：ホルダ
４：研磨手段
４０：研磨工具 ４００：支持部材 ４０１：研磨パッド
４１：マウント ４２：スピンドル ４３：回転手段 ４４：締結ボルト
５：チャックテーブル機構
５１：カバー ５２：チャックテーブル ５２０：吸着部 ５２０ａ：保持面
５２１：枠体
５３：移動基台 ５４：モータ
５６：チャックテーブル送り手段
５６１：ボールネジ ５６２：モータ ５６３：軸受部 ５６４：ガイドレール
５７１：リニアスケール ５７２：読み取りヘッド
６：ドレス機構
６０：ドレス部 ６００：支持部 ６０１：ドレスボード
６１：ベース ６１１：取付け穴
７：支持機構
７１：支持板 ７１１：ネジ穴
７２：移動基板 ７２１：被案内穴 ７３：案内ロッド
７４：昇降手段 ７４１：パルスモータ ７４２：ボールネジ
７５：水平度調整手段 ７５１：昇降手段
７６：皿ネジ
８０：弾性波検出センサ ８１：信号処理部 ８２：制御部
１００：着脱域 １０１：研磨域 1: Polishing device 2: Polishing feeding means 20: Ball screw 21: Guide rail 22: Motor 23: Lift plate 24: Holder 4: Polishing means 40: Polishing tool 400: Support member 401: Polishing pad 41: Mount 42: Spindle 43: Rotating means 44: Fastening bolt 5: Chuck table mechanism 51: Cover 52: Chuck table 520: Suction part 520a: Holding surface 521: Frame body 53: Moving base 54: Motor 56: Chuck table feeding means 561: Ball screw 562: Motor 563: Bearing portion 564: Guide rail 571: Linear scale 572: Reading head 6: Dress mechanism 60: Dress portion 600: Support portion 601: Dress board 61: Base 611: Mounting hole 7: Support mechanism 71: Support plate 711: Screw Hole 72: Moving substrate 721: Guided hole 73: Plan Rod 74: elevating means 741: Pulse Motor 742: ball screw 75: horizontal adjustment means 751: elevation means 76: countersunk screw 80: acoustic wave sensor 81: signal processor 82: Control unit 100: removable area 101: polishing zone

Claims (3)

板状ワークを保持面において保持するチャックテーブルと、該チャックテーブルに保持される板状ワークを研磨する研磨工具が装着され該研磨工具を回転させる回転手段を備え該研磨工具の研磨面を板状ワークに接触させて板状ワークを研磨する研磨手段と、該研磨手段を該チャックテーブルに対して接近及び離間する方向に移動させる研磨送り手段と、該研磨面をドレスするドレス機構と、該研磨手段と該ドレス機構とを相対的に該研磨面に平行にドレス送りするドレス送り手段とを備える研磨装置であって、
該ドレス機構は、該研磨面に接触するドレス部と、該ドレス部が配設されるベースと、を備え、
該研磨手段が該研磨工具を回転させ該研磨送り手段が該研磨手段を該チャックテーブルの該保持面に接近する方向に研磨送りすることにより該ドレス部の上面に該研磨面が接触した時に発生する弾性波を検出する弾性波検出センサと、該弾性波検出センサが予め設定される出力信号の設定値を検出した時に該研磨送り手段による該研磨手段の移動を停止させる制御部と、を備え、
該制御部の制御により該研磨手段の移動を停止させた後、該研磨手段と該ドレス機構とを該ドレス送り手段によって相対的にドレス送りし該研磨面をドレスする研磨装置。 A chuck table for holding a plate-like workpiece on a holding surface, and a polishing tool for polishing the plate-like workpiece held on the chuck table, and a rotating means for rotating the polishing tool are provided. Polishing means for polishing a plate-like work in contact with the workpiece, polishing feed means for moving the polishing means in a direction approaching and separating from the chuck table, a dressing mechanism for dressing the polishing surface, and the polishing A polishing apparatus comprising dress feeding means for dressing the means and the dressing mechanism relatively in parallel with the polishing surface;
The dress mechanism includes a dress portion that contacts the polishing surface, and a base on which the dress portion is disposed,
Occurs when the polishing surface comes into contact with the upper surface of the dressing portion by rotating the polishing tool and the polishing feeding device polishing and feeding the polishing device in a direction approaching the holding surface of the chuck table. An elastic wave detection sensor for detecting an elastic wave to be detected, and a control unit for stopping the movement of the polishing means by the polishing feed means when the elastic wave detection sensor detects a preset value of an output signal set in advance. ,
A polishing apparatus for dressing the polishing surface by stopping the movement of the polishing means under the control of the control unit and then dress-feeding the polishing means and the dressing mechanism relatively by the dress-feeding means. 前記弾性波検出センサが検出した出力信号を出力電圧に変換するアンプを備え、該アンプから出力される電圧が予め設定した設定値を検出した時に前記研磨送り手段による研磨送りを停止させ、前記研磨面のドレスを行う請求項１記載の研磨装置。   An amplifier that converts an output signal detected by the elastic wave detection sensor into an output voltage is provided, and when the voltage output from the amplifier detects a preset value, the polishing feed by the polishing feed means is stopped, and the polishing is performed. The polishing apparatus according to claim 1, wherein the surface is dressed. 前記弾性波検出センサが検出した出力信号をフーリエ変換し、予め設定した設定値である周波数を検出した時に前記研磨送り手段による研磨送りを停止させ、前記研磨面のドレスを行う請求項１記載の研磨装置。   2. The dressing of the polishing surface is performed according to claim 1, wherein when the output signal detected by the elastic wave detection sensor is Fourier-transformed and a frequency which is a preset set value is detected, the polishing feed by the polishing feed unit is stopped and the polishing surface is dressed. Polishing equipment.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022070607A1 (en) * 2020-09-29 2022-04-07 株式会社荏原製作所 Polishing device, and method for determining when to replace polishing pad
CN114310650A (en) * 2021-12-27 2022-04-12 堃昊电子科技(江苏)有限公司 Electronic stroke control device of grinding machine

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020097089A (en) * 2018-12-19 2020-06-25 株式会社ディスコ Grinding device
CN109894976B (en) * 2019-04-15 2024-02-23 华侨大学 Diamond tool sand feeding micro-sizing device capable of detecting in real time
JP7308074B2 (en) * 2019-05-14 2023-07-13 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
KR102610449B1 (en) * 2021-08-11 2023-12-07 서우테크놀로지 주식회사 Semiconductor strip grinding apparatus

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11221757A (en) * 1998-02-09 1999-08-17 Hitachi Ltd Machining method and machining device using rotary machining tool
US20030199238A1 (en) * 2000-01-18 2003-10-23 Shigeo Moriyama Polishing apparatus and method for producing semiconductors using the apparatus
JP2004345049A (en) * 2003-05-23 2004-12-09 Sumitomo Mitsubishi Silicon Corp Double-head grinder and dressing method of rotating grinding wheel in double-head grinder
JP2005022028A (en) * 2003-07-02 2005-01-27 Tokyo Seimitsu Co Ltd Polishing pad dressing device and working device having the same
JP2006055971A (en) * 2004-08-23 2006-03-02 Disco Abrasive Syst Ltd Dressing method for polishing pad
JP2007080692A (en) * 2005-09-14 2007-03-29 Auto Network Gijutsu Kenkyusho:Kk Shield conductor
JP2007080699A (en) * 2005-09-15 2007-03-29 Shunji Kawabata Lighting system
JP2010030022A (en) * 2008-07-31 2010-02-12 Mitsubishi Heavy Ind Ltd Phase focusing method for screw-like grinding wheel and apparatus therefor
JP2010046762A (en) * 2008-08-22 2010-03-04 Mitsubishi Heavy Ind Ltd Phase adjusting device of screw-shaped grinding tool
US20140067321A1 (en) * 2012-09-06 2014-03-06 Schmitt Industries, Inc. Systems and methods for monitoring machining of a workpiece

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI418431B (en) * 2009-09-28 2013-12-11 Mitsubishi Heavy Ind Ltd Phase alignment method and phase alignment device of helical wheel
JP5511600B2 (en) * 2010-09-09 2014-06-04 株式会社荏原製作所 Polishing equipment
JP6393489B2 (en) * 2014-02-21 2018-09-19 株式会社ディスコ Polishing equipment

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11221757A (en) * 1998-02-09 1999-08-17 Hitachi Ltd Machining method and machining device using rotary machining tool
US20030199238A1 (en) * 2000-01-18 2003-10-23 Shigeo Moriyama Polishing apparatus and method for producing semiconductors using the apparatus
JP2004345049A (en) * 2003-05-23 2004-12-09 Sumitomo Mitsubishi Silicon Corp Double-head grinder and dressing method of rotating grinding wheel in double-head grinder
JP2005022028A (en) * 2003-07-02 2005-01-27 Tokyo Seimitsu Co Ltd Polishing pad dressing device and working device having the same
JP2006055971A (en) * 2004-08-23 2006-03-02 Disco Abrasive Syst Ltd Dressing method for polishing pad
JP2007080692A (en) * 2005-09-14 2007-03-29 Auto Network Gijutsu Kenkyusho:Kk Shield conductor
JP2007080699A (en) * 2005-09-15 2007-03-29 Shunji Kawabata Lighting system
JP2010030022A (en) * 2008-07-31 2010-02-12 Mitsubishi Heavy Ind Ltd Phase focusing method for screw-like grinding wheel and apparatus therefor
JP2010046762A (en) * 2008-08-22 2010-03-04 Mitsubishi Heavy Ind Ltd Phase adjusting device of screw-shaped grinding tool
US20140067321A1 (en) * 2012-09-06 2014-03-06 Schmitt Industries, Inc. Systems and methods for monitoring machining of a workpiece

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022070607A1 (en) * 2020-09-29 2022-04-07 株式会社荏原製作所 Polishing device, and method for determining when to replace polishing pad
JP7421460B2 (en) 2020-09-29 2024-01-24 株式会社荏原製作所 Polishing equipment and how to determine when to replace polishing pads
CN114310650A (en) * 2021-12-27 2022-04-12 堃昊电子科技(江苏)有限公司 Electronic stroke control device of grinding machine

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