JP2020199596A - Grinding method - Google Patents

Grinding method Download PDF

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JP2020199596A
JP2020199596A JP2019108555A JP2019108555A JP2020199596A JP 2020199596 A JP2020199596 A JP 2020199596A JP 2019108555 A JP2019108555 A JP 2019108555A JP 2019108555 A JP2019108555 A JP 2019108555A JP 2020199596 A JP2020199596 A JP 2020199596A
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grinding
holding
workpiece
grinding wheel
holding surface
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JP7347967B2 (en
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俊洙 禹
Junsoo Woo
俊洙 禹
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Disco Corp
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Disco Abrasive Systems Ltd
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Abstract

To prevent a stripe pattern from being formed on a work-piece without impairing productivity, in grinding the work-piece.SOLUTION: A grinding method performs a preparation step in which in a state where an inclination relation is adjusted so that a holding surface 20a of holding means 2 holding a work-piece W is in parallel with a grinding surface 340a of a grindstone 340 for grinding, the grinding stone 340 is positioned at a position away from the work-piece W in a horizontal direction parallel to the holding surface 20a, and further the grinding surface 340a of the grindstone 340 for grinding is positioned lower than an upper surface Wa of the work-piece W in a direction perpendicular to the holding surface 20a; and then performs a grinding step in which holding means 2 is made approach the grindstone 340 that rotates, using horizontally-moving means 5, while rotating the work-piece W held by the holding means 2 by rotating the holding means 2 using a rotation mechanism 23 to make the grindstone grind the work-piece W, from an outer periphery We toward a center Wo of the work-piece and keep grinding the work-piece until the grindstone 340 is positioned at the center Wo of the work-piece W.SELECTED DRAWING: Figure 2

Description

本発明は、研削方法に関する。 The present invention relates to a grinding method.

被加工物を研削砥石によって研削する研削加工では、特許文献１及び２に開示のように、インフィード研削とクリープフィード研削とをそれぞれ実施する発明がある。 In the grinding process of grinding a work piece with a grinding wheel, there is an invention in which in-feed grinding and creep-feed grinding are performed, respectively, as disclosed in Patent Documents 1 and 2.

樹脂などの軟らかいワークを研削する際には、特許文献３に開示のように、研削屑が研削砥石に付着するのを防止できるクリープフィード研削が用いられている。しかし、クリープフィード研削を行った場合、被研削面には縞模様が形成され、その縞模様がデバイスの形成に支障をきたすという問題があり、水平方向にチャックテーブルを移動させる速度を遅くするという対策がとられている。 When grinding a soft work such as resin, as disclosed in Patent Document 3, creep feed grinding that can prevent grinding debris from adhering to the grinding wheel is used. However, when creep feed grinding is performed, there is a problem that a striped pattern is formed on the surface to be ground, and the striped pattern hinders the formation of the device, which slows down the speed of moving the chuck table in the horizontal direction. Measures have been taken.

特開２０１０−０１６１８１号公報JP-A-2010-016181 特開２０１３−２１２５６１号公報Japanese Unexamined Patent Publication No. 2013-212561 特開２０１５−２２３６５２号公報JP-A-2015-223652

上記のように、クリープフィード研削において水平方向にチャックテーブルを移動させる速度を遅くすると、研削加工時間が大きくなり生産性が低下する。一方、インフィード研削においては、研削砥石が常に被加工物の中心に接触するように研削するため、被加工物の中心に凹みが形成されてしまうという問題がある。
従って、軟らかい材質のウェーハの研削加工においては、生産性を低下させないこと、被研削面に縞模様が発生しないように研削加工をすること、被加工物の中心に凹みが形成されないようにすること、及び、研削砥石への研削屑の付着を抑制することという課題がある。 As described above, if the speed of moving the chuck table in the horizontal direction is slowed down in creep feed grinding, the grinding time becomes long and the productivity decreases. On the other hand, in in-feed grinding, since the grinding wheel is always ground so as to be in contact with the center of the workpiece, there is a problem that a dent is formed in the center of the workpiece.
Therefore, when grinding a wafer made of a soft material, it is necessary not to reduce productivity, grind so that a striped pattern does not occur on the surface to be ground, and prevent a dent from being formed in the center of the work piece. , And there is a problem of suppressing the adhesion of grinding debris to the grinding wheel.

本発明は、被加工物を保持する保持面の中心を軸に該保持面に保持された被加工物を回転させる回転機構を有する保持手段と、研削砥石を環状に配置した研削ホイールを先端に装着したスピンドルを回転させ該研削砥石で該保持手段が保持した被加工物を研削する研削手段と、該保持手段と該研削手段とを相対的に該保持面に垂直な方向に移動させる垂直移動手段と、該保持手段と該研削手段とを相対的に該保持面に平行な水平方向に移動させる水平移動手段と、を備える研削装置を用いて、研削砥石によって被加工物を研削する研削方法であって、該保持面は、中心を頂点とし外周が中心より低い円錐面に形成され、該保持面の斜面と、該研削砥石の下面とが平行になるよう該保持手段と該研削手段との傾き関係が調整されていて、該研削砥石を該保持面に保持された被加工物から該保持面に平行な水平方向に離間した位置に該研削砥石を位置付け、さらに、該研削砥石の該下面を該被加工物の上面より低い位置に位置付ける準備工程と、該回転機構によって該被加工物を回転させ、該水平移動手段によって該保持手段と該研削手段とを接近する方向に移動させ、該研削砥石が回転する被加工物の外周から研削していき、少なくとも該研削砥石が被加工物の中心に到達したら研削を終了させる研削工程と、からなる研削方法である。 The present invention has a holding means having a rotating mechanism for rotating the work piece held on the holding surface around the center of the holding surface holding the work piece, and a grinding wheel in which a grinding wheel is arranged in an annular shape at the tip. A grinding means that rotates the mounted spindle to grind the workpiece held by the holding means with the grinding wheel, and a vertical movement that moves the holding means and the grinding means in a direction relatively perpendicular to the holding surface. A grinding method for grinding a workpiece with a grinding wheel using a grinding device including means, a horizontal moving means for moving the holding means and the grinding means in a horizontal direction relatively parallel to the holding surface. The holding surface is formed as a conical surface having the center as the apex and the outer periphery lower than the center, and the holding means and the grinding means are provided so that the slope of the holding surface and the lower surface of the grinding wheel are parallel to each other. The grinding wheel is positioned at a position parallel to the holding surface in the horizontal direction and further separated from the workpiece held on the holding surface, and the grinding wheel is further adjusted. In the preparatory step of positioning the lower surface at a position lower than the upper surface of the work piece, the work piece is rotated by the rotation mechanism, and the holding means and the grinding means are moved in the approaching direction by the horizontal moving means. It is a grinding method including a grinding step in which the grinding wheel grinds from the outer periphery of a rotating workpiece, and at least the grinding is terminated when the grinding wheel reaches the center of the workpiece.

被加工物を回転させながらクリープフィード研削を行うことによって、水平方向にチャックテーブルを移動させる速度を遅くすることによる生産性の低下を防ぐともに、被加工物の被研削面に縞模様が形成されるのを防ぐことができる。
チャックテーブルを回転させながらクリープフィード研削すると、砥石に研削屑を付着させることなく研削することができる。また、通常のインフィード研削では被加工物の中央に研削砥石が接触し続け、被加工物の中央が蓄熱され加工痕が荒れるという問題があったが、本クリープフィード研削では、被加工物の中央を研削する時間が短くて済み、被加工物の中央が蓄熱されないので、加工痕が荒れるのを防止することができる。さらに、通常のインフィード研削を行わないため、研削砥石への研削屑の付着を抑制することができる。 By performing creep feed grinding while rotating the work piece, it is possible to prevent a decrease in productivity due to slowing the speed of moving the chuck table in the horizontal direction, and a striped pattern is formed on the work surface of the work piece. Can be prevented.
When creep feed grinding is performed while rotating the chuck table, grinding can be performed without adhering grinding chips to the grindstone. Further, in normal in-feed grinding, there is a problem that the grinding wheel keeps in contact with the center of the workpiece, heat is stored in the center of the workpiece, and the machining marks are roughened. However, in this creep feed grinding, the workpiece is processed. Since the time for grinding the center is short and the center of the workpiece is not stored in heat, it is possible to prevent the machining marks from becoming rough. Further, since the usual in-feed grinding is not performed, it is possible to suppress the adhesion of grinding chips to the grinding wheel.

研削装置全体を表す斜視図である。It is a perspective view which shows the whole grinding apparatus. （ａ）は、研削砥石が保持面に保持されている被加工物から保持面に平行な水平方向に離間している位置に位置付けられている様子を表す断面図であり、（ｂ）は、（ａ）の様子を研削砥石の上からみた断面図である。(A) is a cross-sectional view showing a state in which the grinding wheel is positioned at a position parallel to the holding surface and horizontally separated from the workpiece held on the holding surface, and (b) is a cross-sectional view. It is sectional drawing which looked at the state of (a) from the top of the grinding wheel. （ａ）は、研削砥石の側面が保持面に保持された被加工物の外周に当接している様子を表す断面図であり、（ｂ）は、（ａ）の様子を研削砥石の上からみた断面図である。(A) is a cross-sectional view showing how the side surface of the grinding wheel is in contact with the outer periphery of the workpiece held on the holding surface, and (b) is a cross-sectional view showing the state of (a) from above the grinding wheel. It is a cross-sectional view as seen. （ａ）は、研削砥石の側面が被加工物の中心と外周との略中間の位置に位置付けられている様子を表す断面図であり、（ｂ）は、（ａ）の様子を研削砥石の上からみた断面図である。(A) is a cross-sectional view showing a state in which the side surface of the grinding wheel is positioned at a position substantially intermediate between the center of the workpiece and the outer circumference, and (b) is a cross-sectional view showing the state of (a) of the grinding wheel. It is a cross-sectional view seen from above. （ａ）は、研削砥石の側面が被加工物の中心に位置づけられている様子を表す断面図であり、（ｂ）は、（ａ）の様子を研削砥石の上からみた断面図である。(A) is a cross-sectional view showing a state in which the side surface of the grinding wheel is positioned at the center of the workpiece, and (b) is a cross-sectional view showing the state of (a) seen from above the grinding wheel.

１ 研削装置
図１に示す研削装置１は、例えば樹脂や金属等の軟性を有する円板形状の半導体ウェーハ等である被加工物Ｗを、研削手段３に備える研削砥石３４０を用いて研削する研削装置である。以下、研削装置１について説明する。 1 Grinding device The grinding device 1 shown in FIG. 1 grinds a workpiece W, which is, for example, a disk-shaped semiconductor wafer having softness such as resin or metal, by using a grinding wheel 340 provided in the grinding means 3. It is a device. Hereinafter, the grinding device 1 will be described.

図１に示すように、研削装置１は、Ｙ軸方向に延設されたベース１０と、ベース１０の上における＋Ｙ方向側に立設されたコラム１１とを備えている。 As shown in FIG. 1, the grinding apparatus 1 includes a base 10 extending in the Y-axis direction and a column 11 erected on the base 10 on the + Y direction side.

図１に示すように、研削装置１のベース１０の上には、保持手段２が備えられている。保持手段２は、例えば、円板形状のテーブルであり、吸引部２０と、吸引部２０を支持する枠体２１とを備えている。吸引部２０の上面は、被加工物Ｗが保持される保持面２０ａとなっており、図２（ａ）に示すように、保持面２０ａの中心Ｏを頂点として外周が中心Ｏより低い円錐面に形成されている。また、研削装置１においては、図示しない傾き調整手段等を用いて保持手段２の保持面２０ａの傾きを調整することができる。
図１に示すように、保持手段２には、吸引路２８を介して吸引手段２７が接続されている。例えば、保持面２０ａに被加工物Ｗが載置されている状態で、吸引手段２７を制御して吸引力を発揮させることにより、生み出された吸引力が吸引路２８を通じて保持面２０ａに伝達されて、保持面２０ａに被加工物Ｗを吸引保持することができる。
保持手段２は、有底筒状のケーシング２４に支持されており、ケーシング２４の内部には、回転軸２５を軸にして保持手段２を回転させる回転機構２３が配設されている。
保持手段２の周囲にはカバー１２が配設されており、カバー１２には蛇腹１３がＹ軸方向に伸縮自在に連結されている。 As shown in FIG. 1, a holding means 2 is provided on the base 10 of the grinding device 1. The holding means 2 is, for example, a disk-shaped table, and includes a suction portion 20 and a frame body 21 that supports the suction portion 20. The upper surface of the suction portion 20 is a holding surface 20a on which the workpiece W is held, and as shown in FIG. 2A, a conical surface whose outer circumference is lower than the center O with the center O of the holding surface 20a as the apex. Is formed in. Further, in the grinding device 1, the inclination of the holding surface 20a of the holding means 2 can be adjusted by using an inclination adjusting means (not shown) or the like.
As shown in FIG. 1, the suction means 27 is connected to the holding means 2 via a suction path 28. For example, when the workpiece W is placed on the holding surface 20a, the suction means 27 is controlled to exert the suction force, and the generated suction force is transmitted to the holding surface 20a through the suction path 28. Therefore, the workpiece W can be sucked and held on the holding surface 20a.
The holding means 2 is supported by a bottomed tubular casing 24, and a rotating mechanism 23 for rotating the holding means 2 around a rotating shaft 25 is provided inside the casing 24.
A cover 12 is arranged around the holding means 2, and a bellows 13 is stretchably connected to the cover 12 in the Y-axis direction.

研削装置１のベース１０の内部には、内部ベース１００が配設されており、内部ベース１００の上には、保持手段２をＹ軸方向に移動させる水平移動手段５が配設されている。
図１に示すように、水平移動手段５は、Ｙ軸方向の回転軸５５を有するボールネジ５０と、ボールネジ５０に対して平行に配設された一対のガイドレール５１と、ボールネジ５０に連結され回転軸５５を軸にしてボールネジ５０を回動させるモータ５２と、内部のナットがボールネジ５０に螺合し底部がガイドレール５１に摺接する可動板５３とを備えている。可動板５３の上面５３ａにはケーシング２４が配設されており、可動板５３は、ケーシング２４を介して保持手段２を支持している。
モータ５２にボールネジ５０が駆動されてボールネジ５０が回転軸５５を軸として回転すると、これに伴い、可動板５３がガイドレール５１に案内されて水平方向（Ｙ軸方向）に移動し、可動板５３に配設されているケーシング２４とケーシング２４を介して可動板５３に支持されている保持手段２とがともにＹ軸方向に移動することとなる。水平移動手段５を用いて、保持手段２と研削手段３とを相対的に保持面２０ａに平行な水平方向（Ｙ軸方向）に移動させることができる。
なお、保持手段２がＹ軸方向に移動すると、カバー１２が保持手段２と一体的にＹ軸方向に移動して、蛇腹１３が伸縮することとなる。 An internal base 100 is disposed inside the base 10 of the grinding device 1, and a horizontal moving means 5 for moving the holding means 2 in the Y-axis direction is disposed on the internal base 100.
As shown in FIG. 1, the horizontal moving means 5 is connected to a ball screw 50 having a rotation axis 55 in the Y-axis direction, a pair of guide rails 51 arranged parallel to the ball screw 50, and a ball screw 50 to rotate. It includes a motor 52 that rotates the ball screw 50 around a shaft 55, and a movable plate 53 whose inner nut is screwed into the ball screw 50 and whose bottom is in sliding contact with the guide rail 51. A casing 24 is disposed on the upper surface 53a of the movable plate 53, and the movable plate 53 supports the holding means 2 via the casing 24.
When the ball screw 50 is driven by the motor 52 and the ball screw 50 rotates about the rotation shaft 55, the movable plate 53 is guided by the guide rail 51 and moves in the horizontal direction (Y-axis direction), and the movable plate 53 The casing 24 arranged in the above and the holding means 2 supported by the movable plate 53 via the casing 24 both move in the Y-axis direction. The horizontal moving means 5 can be used to move the holding means 2 and the grinding means 3 in the horizontal direction (Y-axis direction) relatively parallel to the holding surface 20a.
When the holding means 2 moves in the Y-axis direction, the cover 12 moves integrally with the holding means 2 in the Y-axis direction, and the bellows 13 expands and contracts.

図１に示すように、コラム１１の−Ｙ方向側の側面には、研削手段３をＺ軸方向に昇降可能に支持する垂直移動手段４が配設されている。図１に示すように、研削手段３は、Ｚ軸方向の回転軸３５を有するスピンドル３０と、スピンドル３０を回転可能に支持するハウジング３１と、回転軸３５を軸にしてスピンドル３０を回転駆動するモータ３２と、スピンドル３０の下端に接続された円環状のマウント３３と、マウント３３の下面に着脱可能に装着された研削ホイール３４とを備える。研削ホイール３４は、ホイール基台３４１と、ホイール基台３４１の下面に環状に配列された略直方体形状の複数の研削砥石３４０とを備えており、研削砥石３４０の下面は被加工物Ｗを研削する研削面３４０ａとなっている。 As shown in FIG. 1, a vertical moving means 4 for supporting the grinding means 3 so as to be able to move up and down in the Z-axis direction is provided on the side surface of the column 11 on the −Y direction side. As shown in FIG. 1, the grinding means 3 rotationally drives a spindle 30 having a rotating shaft 35 in the Z-axis direction, a housing 31 that rotatably supports the spindle 30, and a rotating shaft 35 as an axis. It includes a motor 32, an annular mount 33 connected to the lower end of the spindle 30, and a grinding wheel 34 detachably mounted on the lower surface of the mount 33. The grinding wheel 34 includes a wheel base 341 and a plurality of substantially square-shaped grinding wheels 340 arranged in an annular shape on the lower surface of the wheel base 341, and the lower surface of the grinding wheel 340 grinds the workpiece W. The grinding surface is 340a.

図１に示すように、垂直移動手段４は、Ｚ軸方向の回転軸４５を有するボールネジ４０と、ボールネジ４０に対して平行に配設された一対のガイドレール４１と、ボールネジ４０の上端に連結され回転軸４５を軸にしてボールネジ４０を回動させるモータ４２と、内部のナットがボールネジ４０に螺合し側部がガイドレール４１に摺接する昇降板４３と、昇降板４３に連結され研削手段３を保持するホルダ４４とを備えている。
モータ４２によってボールネジ４０が駆動されて、ボールネジ４０が回転軸４５を軸にして回転すると、これに伴って、昇降板４３がガイドレール４１に案内されてＺ軸方向に昇降移動するとともにホルダ４４に保持されている研削手段３が保持面２０ａに垂直な方向（Ｚ軸方向）に移動することとなる。垂直移動手段４を用いて、保持手段２と研削手段３とを相対的に保持面２０ａに垂直な方向（Ｚ軸方向）に移動させることができる。 As shown in FIG. 1, the vertical moving means 4 is connected to a ball screw 40 having a rotation shaft 45 in the Z-axis direction, a pair of guide rails 41 arranged parallel to the ball screw 40, and the upper end of the ball screw 40. A motor 42 that rotates the ball screw 40 around the rotating shaft 45, an elevating plate 43 in which the internal nut is screwed into the ball screw 40 and the side portion is in sliding contact with the guide rail 41, and a grinding means connected to the elevating plate 43. It is provided with a holder 44 for holding 3.
When the ball screw 40 is driven by the motor 42 and the ball screw 40 rotates about the rotation shaft 45, the elevating plate 43 is guided by the guide rail 41 to move up and down in the Z-axis direction and to the holder 44. The held grinding means 3 moves in the direction perpendicular to the holding surface 20a (Z-axis direction). The vertical moving means 4 can be used to move the holding means 2 and the grinding means 3 in a direction (Z-axis direction) relatively perpendicular to the holding surface 20a.

図１に示すように、ベース１０の上には、被加工物Ｗの研削加工中に、保持面２０ａに保持されている被加工物Ｗの上面Ｗａに向けて研削水を供給する研削水ノズル６が備えられている。研削水ノズル６は噴射口６ａを有しており、図示しない水源から研削水ノズル６に供給される研削水を噴射口６ａから噴射することによって、保持面２０ａに保持されている被加工物Ｗに研削水を供給することができる。 As shown in FIG. 1, a grinding water nozzle that supplies grinding water onto the base 10 toward the upper surface Wa of the workpiece W held on the holding surface 20a during grinding of the workpiece W. 6 is provided. The grinding water nozzle 6 has an injection port 6a, and the workpiece W held on the holding surface 20a by injecting the grinding water supplied to the grinding water nozzle 6 from a water source (not shown) from the injection port 6a. Grinding water can be supplied to.

２ 研削方法
（準備工程）
上記の研削装置１を用いた被加工物Ｗの研削方法について説明する。研削方法は、準備工程と研削工程とを備えている。
予め、図示しない傾き変更手段等を用いて、図２（ａ）に示すように、保持面２０ａの斜面と研削砥石３４０の下面である研削面３４０ａとが平行になるように保持手段２と研削手段３との傾き関係を調整しておく。
保持手段２と研削手段３との傾き関係の調整がされている状態で、図１に示す保持手段２の保持面２０ａに被加工物Ｗを載置する。保持面２０ａに被加工物Ｗが載置されている状態で、吸引手段２７が吸引力を発揮することにより、生み出された吸引力が吸引路２８を通じて保持面２０ａに伝達されて、被加工物Ｗが保持面２０ａに吸引保持される。 2 Grinding method (preparation process)
A method of grinding the workpiece W using the above-mentioned grinding device 1 will be described. The grinding method includes a preparatory step and a grinding step.
As shown in FIG. 2A, the holding means 2 and the grinding surface 340a, which is the lower surface of the grinding wheel 340, are ground in parallel by using an inclination changing means (not shown) in advance. The inclination relationship with the means 3 is adjusted.
The workpiece W is placed on the holding surface 20a of the holding means 2 shown in FIG. 1 in a state where the inclination relationship between the holding means 2 and the grinding means 3 is adjusted. When the workpiece W is placed on the holding surface 20a, the suction means 27 exerts a suction force, and the generated suction force is transmitted to the holding surface 20a through the suction path 28 to convey the workpiece W to the workpiece 20a. W is sucked and held on the holding surface 20a.

保持面２０ａに被加工物Ｗが吸引保持されている状態で、図１に示す水平移動手段５を用いて保持手段２をＹ軸方向に適宜移動させて、図２（ａ）に示すように、保持面２０ａに保持されている被加工物Ｗから保持面２０ａに平行な水平方向（Ｙ軸方向）に離間する位置に研削砥石３４０を位置付ける。具体的には、モータ５２を用いてボールネジ５０を駆動して、回転軸５５を軸にしてボールネジ５０を回動させる。これにより、可動板５３がガイドレール５１に案内されながら、例えば−Ｙ方向に移動する。可動板５３が−Ｙ方向に移動すると、可動板５３の上面５３ａに配設されているケーシング２４及びケーシング２４に支持されている保持手段２が−Ｙ方向に一体的に移動して、保持手段２と研削砥石３４０とが離間していく。こうして、図２（ａ）に示すように、研削砥石３４０が保持面２０ａに保持されている被加工物ＷからＹ軸方向に離間された状態になる。 With the workpiece W being sucked and held on the holding surface 20a, the holding means 2 is appropriately moved in the Y-axis direction using the horizontal moving means 5 shown in FIG. 1, as shown in FIG. 2A. The grinding wheel 340 is positioned at a position separated from the workpiece W held on the holding surface 20a in the horizontal direction (Y-axis direction) parallel to the holding surface 20a. Specifically, the ball screw 50 is driven by using the motor 52 to rotate the ball screw 50 around the rotation shaft 55. As a result, the movable plate 53 moves in the −Y direction while being guided by the guide rail 51. When the movable plate 53 moves in the −Y direction, the casing 24 arranged on the upper surface 53a of the movable plate 53 and the holding means 2 supported by the casing 24 move integrally in the −Y direction, and the holding means 2 and the grinding wheel 340 are separated from each other. In this way, as shown in FIG. 2A, the grinding wheel 340 is separated from the workpiece W held on the holding surface 20a in the Y-axis direction.

さらに、図１に示す垂直移動手段４を用いて研削手段３をＺ軸方向に移動させて、図２（ａ）に示すように、研削砥石３４０の下面である研削面３４０ａを、被加工物Ｗの上面Ｗａよりも保持面２０ａに対して垂直な方向に低い位置に位置付ける。具体的には、モータ４２を用いてボールネジ４０を駆動して、回転軸４５を軸にしてボールネジ４０を回転させることにより、昇降板４３がガイドレール４１に案内されながら、例えば、−Ｚ方向に移動する。昇降板４３が−Ｚ方向に移動するのに伴って、昇降板４３にホルダ４４を介して支持されている研削手段３が−Ｚ方向に移動する。これにより、図２に示すように、保持面２０ａに対して垂直な方向において、研削砥石３４０の下面である研削面３４０ａの高さ位置が被加工物Ｗの上面Ｗａの高さ位置よりも低い位置に位置付けられる。 Further, the grinding means 3 is moved in the Z-axis direction using the vertical moving means 4 shown in FIG. 1, and as shown in FIG. 2A, the grinding surface 340a, which is the lower surface of the grinding wheel 340, is moved to the workpiece. It is positioned lower than the upper surface Wa of W in the direction perpendicular to the holding surface 20a. Specifically, the ball screw 40 is driven by the motor 42 to rotate the ball screw 40 around the rotation shaft 45, so that the elevating plate 43 is guided by the guide rail 41, for example, in the −Z direction. Moving. As the elevating plate 43 moves in the −Z direction, the grinding means 3 supported by the elevating plate 43 via the holder 44 moves in the −Z direction. As a result, as shown in FIG. 2, the height position of the grinding surface 340a, which is the lower surface of the grinding wheel 340, is lower than the height position of the upper surface Wa of the workpiece W in the direction perpendicular to the holding surface 20a. Positioned.

（研削工程）
次に、図１に示す回転機構２３を用いて回転軸２５を軸にして保持手段２を回転させることにより、保持面２０ａに保持されている被加工物Ｗを同じく回転軸２５を軸にして回転させる。さらには、図１に示す研削手段３において、モータ３２を用いて回転軸３５を軸にしてスピンドル３０を回転させることにより、スピンドル３０にマウント３３を介して連結されている研削砥石３４０を同じく回転軸３５を軸にして回転させる。
このとき、図２〜図５に示すように、被加工物Ｗの回転方向と研削砥石３４０の回転方向とは同じ回転方向である。すなわち、被加工物Ｗの回転方向及び研削砥石３４０の回転方向は、例えば、ともに＋Ｚ方向からみて反時計回り、または、ともに＋Ｚ方向からみて時計回りである。 (Grinding process)
Next, by rotating the holding means 2 around the rotating shaft 25 using the rotating mechanism 23 shown in FIG. 1, the workpiece W held on the holding surface 20a is also centered on the rotating shaft 25. Rotate. Further, in the grinding means 3 shown in FIG. 1, by rotating the spindle 30 around the rotating shaft 35 by using the motor 32, the grinding grind 340 connected to the spindle 30 via the mount 33 is also rotated. Rotate around the shaft 35.
At this time, as shown in FIGS. 2 to 5, the rotation direction of the workpiece W and the rotation direction of the grinding wheel 340 are the same rotation directions. That is, the rotation direction of the workpiece W and the rotation direction of the grinding wheel 340 are, for example, both counterclockwise when viewed from the + Z direction, or both clockwise when viewed from the + Z direction.

そして、被加工物Ｗ及び研削砥石３４０が回転している状態で、水平移動手段５を用いて保持手段２を＋Ｙ方向に移動させて、保持手段２と研削手段３とを接近させる。
これにより、図３（ａ）及び（ｂ）に示すように、回転する研削砥石３４０の側面３４０ｅが回転する被加工物Ｗの外周Ｗｅに当接して、被加工物Ｗの外周Ｗｅを研削していく。なお、図２〜図５に示すように、被加工物Ｗの研削中には、研削水ノズル６の噴射口６ａから被加工物Ｗの外周Ｗｅと研削砥石３４０の側面３４０ｅとが当接する位置に向けて研削水を供給する。 Then, while the workpiece W and the grinding wheel 340 are rotating, the holding means 2 is moved in the + Y direction by using the horizontal moving means 5, and the holding means 2 and the grinding means 3 are brought close to each other.
As a result, as shown in FIGS. 3A and 3B, the side surface 340e of the rotating grinding wheel 340 abuts on the outer peripheral We of the rotating workpiece W to grind the outer peripheral We of the workpiece W. To go. As shown in FIGS. 2 to 5, during grinding of the workpiece W, a position where the outer peripheral We of the workpiece W and the side surface 340e of the grinding wheel 340 come into contact with each other from the injection port 6a of the grinding water nozzle 6. Supply grinding water toward.

研削砥石３４０の側面３４０ｅと被加工物Ｗの外周Ｗｅとが当接してから、さらに保持手段２が＋Ｙ方向に移動していくことによって、被加工物Ｗが研削されていく。図４（ａ）及び（ｂ）においては、研削砥石３４０の側面３４０ｅが被加工物Ｗの中心Ｗｏと外周Ｗｅとの略中間の位置に位置付けられている様子が示されており、このとき、被加工物Ｗの上面Ｗａには、研削加工がなされた円環状の領域Ａと、領域Ａに囲繞されている研削されていない円形状の領域Ｂとが形成されている。 After the side surface 340e of the grinding wheel 340 and the outer peripheral We of the workpiece W come into contact with each other, the holding means 2 further moves in the + Y direction, so that the workpiece W is ground. In FIGS. 4A and 4B, it is shown that the side surface 340e of the grinding wheel 340 is positioned at a position substantially intermediate between the center Wo of the workpiece W and the outer peripheral Wee, and at this time, An annular region A that has been ground and an unground circular region B that is surrounded by the region A are formed on the upper surface Wa of the workpiece W.

さらに、保持手段２が＋Ｙ方向に移動し続けて、図５（ａ）及び（ｂ）に示すように、少なくとも研削砥石３４０が被加工物Ｗの中心Ｗｏに到達すれば、被加工物Ｗの上面Ｗａは全領域にわたって研削加工される。研削砥石３４０が被加工物Ｗの中心Ｗｏに到達した後、例えば、垂直移動手段４を用いて研削砥石３４０を＋Ｚ方向へと上昇させ、研削砥石３４０を被加工物Ｗの上面Ｗａから離間させる。これにより、被加工物Ｗの研削を終了する。
また、研削砥石３４０が被加工物Ｗの中心Ｗｏに到達した後、所定の時間（例えば１０秒）その位置を維持させ、その後、垂直移動手段４を用いて研削砥石３４０を＋Ｚ方向へと上昇させてもよい。 Further, if the holding means 2 continues to move in the + Y direction and at least the grinding wheel 340 reaches the center Wo of the workpiece W as shown in FIGS. 5 (a) and 5 (b), the workpiece W The upper surface Wa is ground over the entire area. After the grinding wheel 340 reaches the center Wo of the workpiece W, for example, the grinding wheel 340 is raised in the + Z direction by using the vertical moving means 4, and the grinding wheel 340 is separated from the upper surface Wa of the workpiece W. .. As a result, the grinding of the workpiece W is completed.
Further, after the grinding wheel 340 reaches the center Wo of the workpiece W, the position is maintained for a predetermined time (for example, 10 seconds), and then the grinding wheel 340 is raised in the + Z direction by using the vertical moving means 4. You may let me.

保持手段２を回転させることにより保持手段２に保持されている被加工物Ｗを回転させながら、水平移動手段５を用いて保持手段２を研削砥石３４０に向かってＹ軸方向に移動させて被加工物Ｗを研削する、本クリープフィード研削を行うことにより、保持手段２のＹ軸方向への移動速度を下げることなく、生産性を低下させずに被加工物Ｗを研削することができ、かつ、被加工物Ｗの上面Ｗａに縞模様が形成されるのを防ぐことができる。
また、被加工物Ｗを回転させながらクリープフィード研削を行えば、研削砥石３４０に研削屑が付着するのを抑制することができる。さらには、本クリープフィード研削は、被加工物Ｗの中心Ｗｏを研削する時間が短いため、被加工物Ｗの中心Ｗｏの付近に蓄熱されるのを防止することができ、これにより加工痕が荒れるのを防ぐことが可能になる。 While rotating the workpiece W held by the holding means 2 by rotating the holding means 2, the holding means 2 is moved toward the grinding wheel 340 in the Y-axis direction by using the horizontal moving means 5 to be covered. By performing this creep feed grinding, which grinds the workpiece W, it is possible to grind the workpiece W without reducing the moving speed of the holding means 2 in the Y-axis direction and without lowering the productivity. Moreover, it is possible to prevent a striped pattern from being formed on the upper surface Wa of the workpiece W.
Further, if creep feed grinding is performed while rotating the workpiece W, it is possible to suppress the adhesion of grinding chips to the grinding wheel 340. Further, in this creep feed grinding, since the time for grinding the center W of the workpiece W is short, it is possible to prevent heat from being stored in the vicinity of the center W of the workpiece W, thereby causing machining marks. It becomes possible to prevent it from becoming rough.

１：研削装置 １０：ベース １１：コラム １００：内部ベース １２：カバー
１３：蛇腹
２：保持手段 ２０：吸引部 ２０ａ：保持面 Ｏ：保持面の中心 ２１：枠体
２３：回転機構 ２４：ケーシング ２５：回転軸 ２７：吸引手段 ２８：吸引路
３：研削手段 ３０：スピンドル ３１：ハウジング ３２：モータ ３３：マウント
３４：研削ホイール ３４０：研削砥石 ３４０ａ：研削面
３４０ｅ：研削砥石の側面 ３４１：ホイール基台 ３５：回転軸
４：垂直移動手段 ４０：ボールネジ ４１：ガイドレール ４２：モータ
４３：昇降板 ４４：ホルダ ４５：回転軸
５：水平移動手段 ５０：ボールネジ ５１：ガイドレール ５２：モータ
５３：可動板 ５３ａ：可動板の上面 ５５：回転軸
６：研削水ノズル ６ａ：噴射口
Ｗ：被加工物 Ｗａ：被加工物の上面 Ｗｏ：被加工物の中心 Ｗｅ：被加工物の外周
Ａ：研削されていない領域 Ｂ：研削された領域 1: Grinding device 10: Base 11: Column 100: Internal base 12: Cover 13: Bellows 2: Holding means 20: Suction part 20a: Holding surface O: Center of holding surface 21: Frame 23: Rotation mechanism 24: Casing 25 : Rotating shaft 27: Suction means 28: Suction path 3: Grinding means 30: Spindle 31: Housing 32: Motor 33: Mount 34: Grinding wheel 340: Grinding grindstone 340a: Grinding surface 340e: Grinding grindstone side surface 341: Wheel base 35: Rotating shaft 4: Vertical moving means 40: Ball screw 41: Guide rail 42: Motor 43: Elevating plate 44: Holder 45: Rotating shaft 5: Horizontal moving means 50: Ball screw 51: Guide rail 52: Motor 53: Movable plate 53a : Top surface of movable plate 55: Rotating shaft 6: Grinding water nozzle 6a: Injection port W: Work piece Wa: Top surface of work piece Wo: Center of work piece We: Outer circumference of work piece A: Not ground Area B: Grinded area

Claims (1)

被加工物を保持する保持面の中心を軸に該保持面に保持された被加工物を回転させる回転機構を有する保持手段と、
研削砥石を環状に配置した研削ホイールを先端に装着したスピンドルを回転させ該研削砥石で該保持手段が保持した被加工物を研削する研削手段と、
該保持手段と該研削手段とを相対的に該保持面に垂直な方向に移動させる垂直移動手段と、
該保持手段と該研削手段とを相対的に該保持面に平行な水平方向に移動させる水平移動手段と、を備える研削装置を用いて、
該研削砥石によって被加工物を研削する研削方法であって、
該保持面は、中心を頂点とし外周が中心より低い円錐面に形成され、
該保持面の斜面と、該研削砥石の下面とが平行になるよう該保持手段と該研削手段との傾き関係が調整されていて、
該研削砥石を該保持面に保持された被加工物から該保持面に平行な水平方向に離間した位置に位置付け、さらに、該研削砥石の該下面を該被加工物の上面より該保持面に垂直な方向に低い位置に位置付ける準備工程と、
該回転機構によって該被加工物を回転させ、該水平移動手段によって該保持手段と該研削手段とを接近する方向に移動させ、該研削砥石が回転する被加工物の外周から研削していき、少なくとも該研削砥石が被加工物の中心に到達したら研削を終了させる研削工程と、
からなる研削方法。 A holding means having a rotation mechanism for rotating the work piece held on the holding surface around the center of the holding surface holding the work piece, and
A grinding means that rotates a spindle equipped with a grinding wheel in which a grinding wheel is arranged in an annular shape at the tip to grind a workpiece held by the holding means with the grinding wheel, and a grinding means.
A vertical moving means for moving the holding means and the grinding means in a direction relatively perpendicular to the holding surface, and
Using a grinding device including a horizontal moving means for moving the holding means and the grinding means in a horizontal direction relatively parallel to the holding surface,
A grinding method for grinding a work piece with the grinding wheel.
The holding surface is formed as a conical surface whose apex is the center and whose outer circumference is lower than the center.
The inclination relationship between the holding means and the grinding means is adjusted so that the slope of the holding surface and the lower surface of the grinding wheel are parallel to each other.
The grinding wheel is positioned at a position horizontally separated from the workpiece held on the holding surface in the horizontal direction parallel to the holding surface, and the lower surface of the grinding wheel is placed on the holding surface from the upper surface of the workpiece. The preparatory process to position it in a low position in the vertical direction,
The work piece is rotated by the rotation mechanism, the holding means and the grinding means are moved in a direction approaching by the horizontal moving means, and the grinding wheel grinds from the outer periphery of the rotating work piece. A grinding process that terminates grinding at least when the grinding wheel reaches the center of the workpiece,
Grinding method consisting of.
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Publication number Priority date Publication date Assignee Title
CN115213762A (en) * 2022-08-16 2022-10-21 苏州昊信精密科技有限公司 Can realize automatic burr polisher of camshaft of continuous material loading

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Publication number Priority date Publication date Assignee Title
WO2001022484A1 (en) * 1999-09-20 2001-03-29 Shin-Etsu Handotai Co., Ltd. Method of manufacturing semiconductor wafer
JP2005205543A (en) * 2004-01-22 2005-08-04 Shin Etsu Handotai Co Ltd Wafer grinding method and wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001022484A1 (en) * 1999-09-20 2001-03-29 Shin-Etsu Handotai Co., Ltd. Method of manufacturing semiconductor wafer
JP2005205543A (en) * 2004-01-22 2005-08-04 Shin Etsu Handotai Co Ltd Wafer grinding method and wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115213762A (en) * 2022-08-16 2022-10-21 苏州昊信精密科技有限公司 Can realize automatic burr polisher of camshaft of continuous material loading
CN115213762B (en) * 2022-08-16 2022-12-13 苏州昊信精密科技有限公司 Can realize automatic burr polisher of camshaft of continuous material loading

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