JP2013218126A5 - - Google Patents

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Publication number
JP2013218126A5
JP2013218126A5 JP2012088871A JP2012088871A JP2013218126A5 JP 2013218126 A5 JP2013218126 A5 JP 2013218126A5 JP 2012088871 A JP2012088871 A JP 2012088871A JP 2012088871 A JP2012088871 A JP 2012088871A JP 2013218126 A5 JP2013218126 A5 JP 2013218126A5
Authority
JP
Japan
Prior art keywords
metal
insulating film
terminals
cap
tft substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012088871A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013218126A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012088871A priority Critical patent/JP2013218126A/ja
Priority claimed from JP2012088871A external-priority patent/JP2013218126A/ja
Priority to US13/845,400 priority patent/US9093592B2/en
Publication of JP2013218126A publication Critical patent/JP2013218126A/ja
Publication of JP2013218126A5 publication Critical patent/JP2013218126A5/ja
Priority to US14/734,375 priority patent/US9865579B2/en
Pending legal-status Critical Current

Links

JP2012088871A 2012-04-10 2012-04-10 表示装置 Pending JP2013218126A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012088871A JP2013218126A (ja) 2012-04-10 2012-04-10 表示装置
US13/845,400 US9093592B2 (en) 2012-04-10 2013-03-18 Display device
US14/734,375 US9865579B2 (en) 2012-04-10 2015-06-09 Display device having driver IC directly connected to substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012088871A JP2013218126A (ja) 2012-04-10 2012-04-10 表示装置

Publications (2)

Publication Number Publication Date
JP2013218126A JP2013218126A (ja) 2013-10-24
JP2013218126A5 true JP2013218126A5 (enExample) 2015-05-28

Family

ID=49291602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012088871A Pending JP2013218126A (ja) 2012-04-10 2012-04-10 表示装置

Country Status (2)

Country Link
US (2) US9093592B2 (enExample)
JP (1) JP2013218126A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6701777B2 (ja) * 2016-02-15 2020-05-27 セイコーエプソン株式会社 電気光学装置、電子機器
CN109270754B (zh) 2017-07-17 2021-04-27 京东方科技集团股份有限公司 阵列基板和显示装置
CN109801888A (zh) * 2017-11-16 2019-05-24 群创光电股份有限公司 第一电子元件及包含第一电子元件的显示设备
KR102581839B1 (ko) * 2018-10-02 2023-09-22 삼성디스플레이 주식회사 표시 장치
CN111328184B (zh) * 2020-01-20 2022-03-11 维沃移动通信有限公司 显示屏及电子设备
DE102020135087A1 (de) 2020-03-27 2021-09-30 Samsung Electronics Co., Ltd. Halbleitergehäuse
KR102671897B1 (ko) * 2021-01-15 2024-06-03 주식회사 엘시텍 표시 장치 및 그 제조 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3139549B2 (ja) 1999-01-29 2001-03-05 日本電気株式会社 アクティブマトリクス型液晶表示装置
JP4774161B2 (ja) * 2001-04-13 2011-09-14 シチズンホールディングス株式会社 液晶装置
JP3744450B2 (ja) * 2001-05-09 2006-02-08 セイコーエプソン株式会社 電気光学装置、駆動用ｉｃ及び電子機器
KR100698042B1 (ko) * 2002-07-29 2007-03-23 엘지.필립스 엘시디 주식회사 액정표시소자 및 그 제조방법
JP2006215224A (ja) * 2005-02-03 2006-08-17 Sanyo Epson Imaging Devices Corp 電気光学装置、電気光学装置の製造方法、及び電子機器
US8410571B2 (en) * 2006-07-12 2013-04-02 United Microelectronics Corp. Layout of dummy patterns
US7446398B2 (en) * 2006-08-01 2008-11-04 Taiwan Semiconductor Manufacturing Co., Ltd. Bump pattern design for flip chip semiconductor package
KR20080060442A (ko) * 2006-12-27 2008-07-02 엘지디스플레이 주식회사 액정표시장치와 그 제조방법

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