JP2013213191A - 酸窒化物系蛍光体およびこれを用いた発光装置 - Google Patents

酸窒化物系蛍光体およびこれを用いた発光装置 Download PDF

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Publication number
JP2013213191A
JP2013213191A JP2013005713A JP2013005713A JP2013213191A JP 2013213191 A JP2013213191 A JP 2013213191A JP 2013005713 A JP2013005713 A JP 2013005713A JP 2013005713 A JP2013005713 A JP 2013005713A JP 2013213191 A JP2013213191 A JP 2013213191A
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JP
Japan
Prior art keywords
phosphor
light
less
emitting device
phosphors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013005713A
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English (en)
Japanese (ja)
Inventor
Fumitaka Yoshimura
文孝 吉村
Takeshi Tawara
岳史 田原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
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Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2012015243A priority Critical patent/JP5358699B2/ja
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Publication of JP2013213191A publication Critical patent/JP2013213191A/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
JP2013005713A 2011-06-14 2013-01-16 酸窒化物系蛍光体およびこれを用いた発光装置 Pending JP2013213191A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012015243A JP5358699B2 (ja) 2011-06-14 2012-01-27 携帯端末

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012007128 2012-01-17
JP2012007128 2012-01-17
JP2012049561 2012-03-06
JP2012049561 2012-03-06

Publications (1)

Publication Number Publication Date
JP2013213191A true JP2013213191A (ja) 2013-10-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013005713A Pending JP2013213191A (ja) 2011-06-14 2013-01-16 酸窒化物系蛍光体およびこれを用いた発光装置

Country Status (3)

Country Link
JP (1) JP2013213191A (zh)
TW (1) TW201335338A (zh)
WO (1) WO2013108782A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103484110A (zh) * 2013-09-06 2014-01-01 北京科技大学 一种红色硅铝氧氮化物荧光材料及其制备方法
JPWO2019045106A1 (ja) * 2017-09-04 2020-08-20 三菱ケミカル株式会社 蛍光体、発光装置、画像表示装置及び照明装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7229573B2 (en) * 2004-04-20 2007-06-12 Gelcore, Llc Ce3+ and Eu2+ doped phosphors for light generation
WO2006061778A1 (en) * 2004-12-06 2006-06-15 Philips Intellectual Property & Standards Gmbh Illumination system comprising a radiation source and a blue-emitting phospor
CN101103088A (zh) * 2005-01-10 2008-01-09 皇家飞利浦电子股份有限公司 包含陶瓷发光转换器的照明系统
JP4899433B2 (ja) * 2005-11-15 2012-03-21 三菱化学株式会社 蛍光体、並びにそれを用いた発光装置、画像表示装置及び照明装置
JP4869317B2 (ja) * 2008-10-29 2012-02-08 株式会社東芝 赤色蛍光体およびそれを用いた発光装置
WO2011024296A1 (ja) * 2009-08-28 2011-03-03 株式会社 東芝 蛍光体の製造方法およびそれにより製造された蛍光体
JP4825923B2 (ja) * 2010-08-18 2011-11-30 株式会社東芝 赤色蛍光体およびそれを用いた発光装置
JP5259770B2 (ja) * 2011-05-02 2013-08-07 株式会社東芝 赤色蛍光体の製造方法

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TW201335338A (zh) 2013-09-01
WO2013108782A1 (ja) 2013-07-25

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