JP2013191687A5 - - Google Patents
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- Publication number
- JP2013191687A5 JP2013191687A5 JP2012056166A JP2012056166A JP2013191687A5 JP 2013191687 A5 JP2013191687 A5 JP 2013191687A5 JP 2012056166 A JP2012056166 A JP 2012056166A JP 2012056166 A JP2012056166 A JP 2012056166A JP 2013191687 A5 JP2013191687 A5 JP 2013191687A5
- Authority
- JP
- Japan
- Prior art keywords
- optical semiconductor
- semiconductor device
- organopolysiloxane
- group
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 56
- 230000003287 optical effect Effects 0.000 claims 54
- 229920001296 polysiloxane Polymers 0.000 claims 22
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 15
- 238000004519 manufacturing process Methods 0.000 claims 15
- 125000003342 alkenyl group Chemical group 0.000 claims 14
- 239000000470 constituent Substances 0.000 claims 14
- 239000003795 chemical substances by application Substances 0.000 claims 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 12
- 125000003118 aryl group Chemical group 0.000 claims 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 10
- 238000000034 method Methods 0.000 claims 9
- 238000009832 plasma treatment Methods 0.000 claims 9
- 239000000565 sealant Substances 0.000 claims 9
- 238000007789 sealing Methods 0.000 claims 9
- 239000000463 material Substances 0.000 claims 8
- 239000011347 resin Substances 0.000 claims 8
- 229920005989 resin Polymers 0.000 claims 8
- 229910052710 silicon Inorganic materials 0.000 claims 6
- 125000004432 carbon atom Chemical group C* 0.000 claims 5
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 5
- 125000000524 functional group Chemical group 0.000 claims 4
- 229910000077 silane Inorganic materials 0.000 claims 3
- -1 silane compound Chemical class 0.000 claims 3
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 claims 2
- 239000007809 chemical reaction catalyst Substances 0.000 claims 2
- 238000006459 hydrosilylation reaction Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012056166A JP2013191687A (ja) | 2012-03-13 | 2012-03-13 | 光半導体装置の製造方法及び光半導体装置 |
| PCT/JP2013/056124 WO2013137079A1 (ja) | 2012-03-13 | 2013-03-06 | 光半導体装置の製造方法及び光半導体装置 |
| TW102108902A TW201347241A (zh) | 2012-03-13 | 2013-03-13 | 光半導體裝置之製造方法及光半導體裝置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012056166A JP2013191687A (ja) | 2012-03-13 | 2012-03-13 | 光半導体装置の製造方法及び光半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013191687A JP2013191687A (ja) | 2013-09-26 |
| JP2013191687A5 true JP2013191687A5 (https=) | 2014-03-13 |
Family
ID=49160991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012056166A Pending JP2013191687A (ja) | 2012-03-13 | 2012-03-13 | 光半導体装置の製造方法及び光半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2013191687A (https=) |
| TW (1) | TW201347241A (https=) |
| WO (1) | WO2013137079A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103694709B (zh) * | 2013-12-09 | 2016-04-13 | 华南理工大学 | 加成型液体硅橡胶用耐漏电起痕剂及其制备方法和应用 |
| JP6512120B2 (ja) * | 2016-01-26 | 2019-05-15 | 信越化学工業株式会社 | 含フッ素エラストマーの基材への接着方法 |
| JP7037046B2 (ja) | 2018-01-31 | 2022-03-16 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| JP6777105B2 (ja) | 2018-01-31 | 2020-10-28 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| JP6905486B2 (ja) * | 2018-03-13 | 2021-07-21 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物、シリコーン硬化物、及び半導体装置 |
| JP7074642B2 (ja) | 2018-10-29 | 2022-05-24 | 信越化学工業株式会社 | シリコーンエマルジョン組成物 |
| JP2024118254A (ja) * | 2023-02-20 | 2024-08-30 | 信越化学工業株式会社 | シリコーンエマルション組成物 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3557682B2 (ja) * | 1994-01-13 | 2004-08-25 | セイコーエプソン株式会社 | 半導体装置の製造方法及びその装置、並びに液晶ディスプレイの製造方法 |
| JP3835983B2 (ja) * | 2000-12-14 | 2006-10-18 | 松下電器産業株式会社 | プラズマ処理装置およびプラズマ処理方法 |
| KR100665178B1 (ko) * | 2005-05-26 | 2007-01-09 | 삼성전기주식회사 | 발광다이오드 패키지 제조방법 |
| JP4823656B2 (ja) * | 2005-11-22 | 2011-11-24 | パナソニック株式会社 | パッケージ部品の製造方法 |
| KR20120123242A (ko) * | 2009-06-26 | 2012-11-08 | 가부시키가이샤 아사히 러버 | 백색 반사재 및 그 제조방법 |
| EP2554601A4 (en) * | 2010-03-31 | 2013-10-09 | Sekisui Chemical Co Ltd | SEALANT FOR OPTICAL SEMICONDUCTORS AND OPTICAL SEMICONDUCTOR ELEMENT |
| JP2012007136A (ja) * | 2010-05-21 | 2012-01-12 | Sekisui Chem Co Ltd | 光半導体装置用封止剤及びそれを用いた光半導体装置 |
| JP2012021131A (ja) * | 2010-06-18 | 2012-02-02 | Mitsubishi Chemicals Corp | 半導体発光デバイス部材用２液型硬化性ポリオルガノシロキサン組成物、該組成物を硬化させてなるポリオルガノシロキサン硬化物及びその製造方法 |
| JP5830974B2 (ja) * | 2010-07-02 | 2015-12-09 | 日立化成株式会社 | 樹脂組成物、ｂステージシート、樹脂付金属箔、金属基板及びｌｅｄ基板 |
-
2012
- 2012-03-13 JP JP2012056166A patent/JP2013191687A/ja active Pending
-
2013
- 2013-03-06 WO PCT/JP2013/056124 patent/WO2013137079A1/ja not_active Ceased
- 2013-03-13 TW TW102108902A patent/TW201347241A/zh unknown
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