JP2013186310A - 光電気複合基板及びその製造方法 - Google Patents

光電気複合基板及びその製造方法 Download PDF

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Publication number
JP2013186310A
JP2013186310A JP2012051604A JP2012051604A JP2013186310A JP 2013186310 A JP2013186310 A JP 2013186310A JP 2012051604 A JP2012051604 A JP 2012051604A JP 2012051604 A JP2012051604 A JP 2012051604A JP 2013186310 A JP2013186310 A JP 2013186310A
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JP
Japan
Prior art keywords
layer
region
wiring
composite substrate
cladding layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012051604A
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English (en)
Japanese (ja)
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JP2013186310A5 (enExample
Inventor
Kazuhisa Yamamoto
和尚 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012051604A priority Critical patent/JP2013186310A/ja
Priority to US13/788,151 priority patent/US9201203B2/en
Publication of JP2013186310A publication Critical patent/JP2013186310A/ja
Publication of JP2013186310A5 publication Critical patent/JP2013186310A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4283—Electrical aspects with electrical insulation means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2012051604A 2012-03-08 2012-03-08 光電気複合基板及びその製造方法 Pending JP2013186310A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012051604A JP2013186310A (ja) 2012-03-08 2012-03-08 光電気複合基板及びその製造方法
US13/788,151 US9201203B2 (en) 2012-03-08 2013-03-07 Photoelectric composite substrate and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012051604A JP2013186310A (ja) 2012-03-08 2012-03-08 光電気複合基板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2013186310A true JP2013186310A (ja) 2013-09-19
JP2013186310A5 JP2013186310A5 (enExample) 2015-02-12

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JP2012051604A Pending JP2013186310A (ja) 2012-03-08 2012-03-08 光電気複合基板及びその製造方法

Country Status (2)

Country Link
US (1) US9201203B2 (enExample)
JP (1) JP2013186310A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015102648A (ja) * 2013-11-25 2015-06-04 新光電気工業株式会社 光導波路装置及びその製造方法
JP2015200785A (ja) * 2014-04-08 2015-11-12 新光電気工業株式会社 光導波路装置及びその製造方法
JP2015230481A (ja) * 2014-06-09 2015-12-21 新光電気工業株式会社 光導波路装置及びその製造方法
JP2016156865A (ja) * 2015-02-23 2016-09-01 京セラ株式会社 光回路基板の製造方法
JP2016206377A (ja) * 2015-04-21 2016-12-08 新光電気工業株式会社 光導波路装置及びその製造方法
JPWO2016175124A1 (ja) * 2015-04-27 2017-11-30 京セラ株式会社 光伝送基板および光伝送モジュール
JP2019029389A (ja) * 2017-07-26 2019-02-21 京セラ株式会社 光回路基板

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6168602B2 (ja) * 2013-10-31 2017-07-26 日東電工株式会社 光電気混載モジュール
US9786641B2 (en) * 2015-08-13 2017-10-10 International Business Machines Corporation Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications
JP7279354B2 (ja) * 2018-12-17 2023-05-23 富士電機株式会社 半導体素子及び半導体素子の識別方法
CN114127601B (zh) * 2019-07-25 2024-10-18 京瓷株式会社 光电路基板以及使用了该光电路基板的电子部件安装构造体
US12009951B2 (en) * 2020-07-22 2024-06-11 Marvell Asia Pte Ltd. Optimizing host / module interface
JP2023008205A (ja) * 2021-07-05 2023-01-19 イビデン株式会社 配線基板
US12500668B1 (en) 2022-07-01 2025-12-16 Marvell Asia Pte Ltd Setup and training of links between host devices and optical modules including menu-based and multi-stage link training
US12470315B2 (en) 2022-09-01 2025-11-11 Marvell Asia Pte Ltd Out-of-band based independent link training of in-band links between host devices and optical modules

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312471A (ja) * 1996-05-23 1997-12-02 Toppan Printing Co Ltd 多層配線板及びその製造方法
JP2006030605A (ja) * 2004-07-16 2006-02-02 Sony Corp 光電子装置およびその製造方法
JP2006120955A (ja) * 2004-10-22 2006-05-11 Ibiden Co Ltd 多層プリント配線板
JP2007156026A (ja) * 2005-12-02 2007-06-21 Kyocera Corp 光配線モジュール
JP2007156025A (ja) * 2005-12-02 2007-06-21 Kyocera Corp 光導波路部材、光配線基板および光配線モジュール
US20080247704A1 (en) * 2007-04-04 2008-10-09 Ibiden Co., Ltd Package substrate and device for optical communication
JP2008281923A (ja) * 2007-05-14 2008-11-20 Shinko Electric Ind Co Ltd 光電気混載基板
JP2011095385A (ja) * 2009-10-28 2011-05-12 Kyocera Corp 光電気配線基板の製造方法、および光電気配線基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3491677B2 (ja) 1999-06-24 2004-01-26 日本電気株式会社 光電気混載基板およびその製造方法
JP5461897B2 (ja) 2009-06-19 2014-04-02 新光電気工業株式会社 光導波路積層配線基板及びその製造方法と実装構造

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312471A (ja) * 1996-05-23 1997-12-02 Toppan Printing Co Ltd 多層配線板及びその製造方法
JP2006030605A (ja) * 2004-07-16 2006-02-02 Sony Corp 光電子装置およびその製造方法
JP2006120955A (ja) * 2004-10-22 2006-05-11 Ibiden Co Ltd 多層プリント配線板
JP2007156026A (ja) * 2005-12-02 2007-06-21 Kyocera Corp 光配線モジュール
JP2007156025A (ja) * 2005-12-02 2007-06-21 Kyocera Corp 光導波路部材、光配線基板および光配線モジュール
US20080247704A1 (en) * 2007-04-04 2008-10-09 Ibiden Co., Ltd Package substrate and device for optical communication
JP2008281923A (ja) * 2007-05-14 2008-11-20 Shinko Electric Ind Co Ltd 光電気混載基板
JP2011095385A (ja) * 2009-10-28 2011-05-12 Kyocera Corp 光電気配線基板の製造方法、および光電気配線基板

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015102648A (ja) * 2013-11-25 2015-06-04 新光電気工業株式会社 光導波路装置及びその製造方法
JP2015200785A (ja) * 2014-04-08 2015-11-12 新光電気工業株式会社 光導波路装置及びその製造方法
US9244224B2 (en) 2014-04-08 2016-01-26 Shinko Electric Industries, Co., Ltd. Optical waveguide device
JP2015230481A (ja) * 2014-06-09 2015-12-21 新光電気工業株式会社 光導波路装置及びその製造方法
JP2016156865A (ja) * 2015-02-23 2016-09-01 京セラ株式会社 光回路基板の製造方法
JP2016206377A (ja) * 2015-04-21 2016-12-08 新光電気工業株式会社 光導波路装置及びその製造方法
JPWO2016175124A1 (ja) * 2015-04-27 2017-11-30 京セラ株式会社 光伝送基板および光伝送モジュール
US10180548B2 (en) 2015-04-27 2019-01-15 Kyocera Corporation Optical transmission substrate and optical transmission module
JP2019029389A (ja) * 2017-07-26 2019-02-21 京セラ株式会社 光回路基板

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US20130236138A1 (en) 2013-09-12
US9201203B2 (en) 2015-12-01

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