JP2013161647A5 - - Google Patents

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Publication number
JP2013161647A5
JP2013161647A5 JP2012022637A JP2012022637A JP2013161647A5 JP 2013161647 A5 JP2013161647 A5 JP 2013161647A5 JP 2012022637 A JP2012022637 A JP 2012022637A JP 2012022637 A JP2012022637 A JP 2012022637A JP 2013161647 A5 JP2013161647 A5 JP 2013161647A5
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JP
Japan
Prior art keywords
charged particle
particle beam
sample
ionic liquid
irradiation position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012022637A
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English (en)
Japanese (ja)
Other versions
JP2013161647A (ja
JP5723801B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2012022637A external-priority patent/JP5723801B2/ja
Priority to JP2012022637A priority Critical patent/JP5723801B2/ja
Priority to US14/376,860 priority patent/US9963776B2/en
Priority to PCT/JP2013/052298 priority patent/WO2013118640A1/ja
Priority to CN201380007984.XA priority patent/CN104094375B/zh
Priority to DE112013000459.3T priority patent/DE112013000459B4/de
Publication of JP2013161647A publication Critical patent/JP2013161647A/ja
Publication of JP2013161647A5 publication Critical patent/JP2013161647A5/ja
Publication of JP5723801B2 publication Critical patent/JP5723801B2/ja
Application granted granted Critical
Priority to US15/939,689 priority patent/US10808312B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012022637A 2012-02-06 2012-02-06 荷電粒子線装置および配線方法 Active JP5723801B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012022637A JP5723801B2 (ja) 2012-02-06 2012-02-06 荷電粒子線装置および配線方法
DE112013000459.3T DE112013000459B4 (de) 2012-02-06 2013-02-01 Verdrahtungsverfahren
PCT/JP2013/052298 WO2013118640A1 (ja) 2012-02-06 2013-02-01 荷電粒子線装置および配線方法
CN201380007984.XA CN104094375B (zh) 2012-02-06 2013-02-01 带电粒子线装置及布线方法
US14/376,860 US9963776B2 (en) 2012-02-06 2013-02-01 Charged particle device and wiring method
US15/939,689 US10808312B2 (en) 2012-02-06 2018-03-29 Charged particle device and wiring method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012022637A JP5723801B2 (ja) 2012-02-06 2012-02-06 荷電粒子線装置および配線方法

Publications (3)

Publication Number Publication Date
JP2013161647A JP2013161647A (ja) 2013-08-19
JP2013161647A5 true JP2013161647A5 (enExample) 2014-05-29
JP5723801B2 JP5723801B2 (ja) 2015-05-27

Family

ID=48947404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012022637A Active JP5723801B2 (ja) 2012-02-06 2012-02-06 荷電粒子線装置および配線方法

Country Status (5)

Country Link
US (2) US9963776B2 (enExample)
JP (1) JP5723801B2 (enExample)
CN (1) CN104094375B (enExample)
DE (1) DE112013000459B4 (enExample)
WO (1) WO2013118640A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015125087A (ja) * 2013-12-27 2015-07-06 株式会社日立ハイテクノロジーズ 試料加工方法および試料加工装置
WO2015136635A1 (ja) * 2014-03-12 2015-09-17 株式会社日立ハイテクノロジーズ 試料観察方法及び荷電粒子線装置
KR102358551B1 (ko) * 2014-08-29 2022-02-04 가부시키가이샤 히다치 하이테크 사이언스 자동 시료편 제작 장치
EP3043372B1 (en) * 2015-01-12 2017-01-04 Fei Company Method of modifying a sample surface layer from a microscopic sample
CN108015496B (zh) * 2017-12-01 2019-05-28 北京创昱科技有限公司 真空腔及真空腔的制备方法
KR102045535B1 (ko) * 2017-12-21 2019-11-15 울산과학기술원 적층 세라믹 콘덴서 표면 처리 장치 및 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02205682A (ja) * 1989-02-02 1990-08-15 Mitsubishi Electric Corp 荷電ビーム式加工装置
GB2247345B (en) * 1990-07-05 1995-04-05 Haroon Ahmed Integrated circuit structure analysis
JP3190873B2 (ja) * 1998-03-02 2001-07-23 山形日本電気株式会社 収束イオンビーム装置とその制御方法
JP2002110680A (ja) 2000-10-04 2002-04-12 Nec Corp フリップチップｌｓｉの配線修正方法
US20030000921A1 (en) 2001-06-29 2003-01-02 Ted Liang Mask repair with electron beam-induced chemical etching
JP2004000921A (ja) * 2002-04-26 2004-01-08 Seiko Epson Corp 膜体形成装置、レンズの製造方法、カラーフィルタの製造方法および有機ｅｌ装置の製造方法
JP4754273B2 (ja) 2005-06-06 2011-08-24 日立マクセル株式会社 インクジェット用導電性インク、導電性パターンおよび導電体
EP1978355B1 (en) * 2006-01-20 2016-07-27 Hitachi High-Technologies Corporation Method of observing sample using a liquid medium for preventing charge-up in an electron microscope
JP5226378B2 (ja) 2008-04-28 2013-07-03 株式会社日立ハイテクノロジーズ 透過型電子顕微鏡、及び試料観察方法
JP5030906B2 (ja) * 2008-09-11 2012-09-19 株式会社日立ハイテクノロジーズ 走査荷電粒子顕微鏡を用いたパノラマ画像合成方法およびその装置
JP5205234B2 (ja) * 2008-12-02 2013-06-05 株式会社日立ハイテクノロジーズ 微小試料採取装置，検査解析システム、および検査解析方法
JP5442417B2 (ja) * 2009-12-14 2014-03-12 株式会社日立ハイテクノロジーズ 荷電粒子線装置及び試料観察方法
JP2011216426A (ja) * 2010-04-02 2011-10-27 Hitachi High-Technologies Corp 試料ホルダーおよび試料観察方法
US20110293847A1 (en) * 2010-05-28 2011-12-01 Jeffrey Todd Hastings Particle-Beam Induced Processing Using Liquid Reactants
JP5707082B2 (ja) 2010-10-08 2015-04-22 株式会社日立ハイテクノロジーズ 液体の表面を浮遊する試料の走査電子顕微鏡観察方法
JP5542749B2 (ja) 2011-06-30 2014-07-09 株式会社日立ハイテクノロジーズ 試料の作製装置，作製方法、及びそれを用いた荷電粒子線装置
JP5951223B2 (ja) 2011-11-02 2016-07-13 株式会社日立ハイテクノロジーズ 電子顕微法、電子顕微鏡および観察標体作製装置

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