JP2013153217A5 - - Google Patents

Download PDF

Info

Publication number
JP2013153217A5
JP2013153217A5 JP2013088605A JP2013088605A JP2013153217A5 JP 2013153217 A5 JP2013153217 A5 JP 2013153217A5 JP 2013088605 A JP2013088605 A JP 2013088605A JP 2013088605 A JP2013088605 A JP 2013088605A JP 2013153217 A5 JP2013153217 A5 JP 2013153217A5
Authority
JP
Japan
Prior art keywords
array
targets
target
wafer
calibration curve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013088605A
Other languages
English (en)
Japanese (ja)
Other versions
JP5813692B2 (ja
JP2013153217A (ja
Filing date
Publication date
Priority claimed from US11/329,716 external-priority patent/US7526749B2/en
Application filed filed Critical
Publication of JP2013153217A publication Critical patent/JP2013153217A/ja
Publication of JP2013153217A5 publication Critical patent/JP2013153217A5/ja
Application granted granted Critical
Publication of JP5813692B2 publication Critical patent/JP5813692B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013088605A 2005-10-31 2013-04-19 オーバレイ測定用の目盛校正曲線を生成する方法 Active JP5813692B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US73243305P 2005-10-31 2005-10-31
US60/732,433 2005-10-31
US11/329,716 2006-01-10
US11/329,716 US7526749B2 (en) 2005-10-31 2006-01-10 Methods and apparatus for designing and using micro-targets in overlay metrology

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2008537884A Division JP5443759B2 (ja) 2005-10-31 2006-10-23 オーバレイ測定におけるマイクロターゲットの設計と使用のための方法と装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014202977A Division JP6042396B2 (ja) 2005-10-31 2014-10-01 半導体のオーバーレイターゲットからオーバーレイを決定するシステム，その方法およびコンピュータプログラム

Publications (3)

Publication Number Publication Date
JP2013153217A JP2013153217A (ja) 2013-08-08
JP2013153217A5 true JP2013153217A5 (https=) 2013-09-26
JP5813692B2 JP5813692B2 (ja) 2015-11-17

Family

ID=37995066

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2008537884A Active JP5443759B2 (ja) 2005-10-31 2006-10-23 オーバレイ測定におけるマイクロターゲットの設計と使用のための方法と装置
JP2013088605A Active JP5813692B2 (ja) 2005-10-31 2013-04-19 オーバレイ測定用の目盛校正曲線を生成する方法
JP2014202977A Active JP6042396B2 (ja) 2005-10-31 2014-10-01 半導体のオーバーレイターゲットからオーバーレイを決定するシステム，その方法およびコンピュータプログラム

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2008537884A Active JP5443759B2 (ja) 2005-10-31 2006-10-23 オーバレイ測定におけるマイクロターゲットの設計と使用のための方法と装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014202977A Active JP6042396B2 (ja) 2005-10-31 2014-10-01 半導体のオーバーレイターゲットからオーバーレイを決定するシステム，その方法およびコンピュータプログラム

Country Status (5)

Country Link
US (1) US7526749B2 (https=)
EP (1) EP1946372B1 (https=)
JP (3) JP5443759B2 (https=)
TW (2) TWI411055B (https=)
WO (1) WO2007053376A2 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7526749B2 (en) * 2005-10-31 2009-04-28 Kla-Tencor Technologies Corporation Methods and apparatus for designing and using micro-targets in overlay metrology
US9151712B1 (en) * 2007-05-30 2015-10-06 Kla-Tencor Corporation Rule checking for metrology and inspection
DE102007046850B4 (de) * 2007-09-29 2014-05-22 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Verfahren zum Bestimmen einer Überlagerungsgenauigkeit
US8060843B2 (en) * 2008-06-18 2011-11-15 Taiwan Semiconductor Manufacturing Company, Ltd. Verification of 3D integrated circuits
US9927718B2 (en) * 2010-08-03 2018-03-27 Kla-Tencor Corporation Multi-layer overlay metrology target and complimentary overlay metrology measurement systems
US10890436B2 (en) * 2011-07-19 2021-01-12 Kla Corporation Overlay targets with orthogonal underlayer dummyfill
US9007585B2 (en) * 2012-03-07 2015-04-14 Kla-Tencor Corporation Imaging overlay metrology target and complimentary overlay metrology measurement system
WO2013177208A1 (en) * 2012-05-22 2013-11-28 Kla-Tencor Corporation Overlay targets with orthogonal underlayer dummyfill
US9576861B2 (en) * 2012-11-20 2017-02-21 Kla-Tencor Corporation Method and system for universal target based inspection and metrology
US9123649B1 (en) * 2013-01-21 2015-09-01 Kla-Tencor Corporation Fit-to-pitch overlay measurement targets
US9104831B2 (en) * 2013-08-23 2015-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor overlay production system and method
US9727047B2 (en) * 2014-10-14 2017-08-08 Kla-Tencor Corp. Defect detection using structural information
CN107533020B (zh) * 2015-04-28 2020-08-14 科磊股份有限公司 计算上高效的基于x射线的叠盖测量系统与方法
WO2016202560A1 (en) * 2015-06-18 2016-12-22 Asml Netherlands B.V. Calibration method for a lithographic apparatus
US9864280B2 (en) * 2015-10-02 2018-01-09 Applied Materials, Inc. Overlay error correction
US10303839B2 (en) * 2016-06-07 2019-05-28 Kla-Tencor Corporation Electrically relevant placement of metrology targets using design analysis
KR102649158B1 (ko) * 2018-12-03 2024-03-20 에이에스엠엘 네델란즈 비.브이. 반도체 제조 공정의 수율을 예측하는 방법
WO2020141071A1 (en) * 2018-12-31 2020-07-09 Asml Netherlands B.V. Method for calibrating a scanning charged particle microscope
EP3971648A1 (en) * 2020-09-17 2022-03-23 ASML Netherlands B.V. Mark to be projected on an object durign a lithograhpic process and method for designing a mark

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63260045A (ja) * 1987-04-17 1988-10-27 Hitachi Ltd バ−ニアパタ−ン
JPS6450529A (en) * 1987-08-21 1989-02-27 Oki Electric Ind Co Ltd Wafer alignment
JPH0231411A (ja) * 1988-07-21 1990-02-01 Mitsubishi Electric Corp 半導体装置のアライメントマークの形成方法
JP2663623B2 (ja) * 1989-01-30 1997-10-15 住友金属工業株式会社 レジストパターンの形成方法
JPH0562874A (ja) * 1991-09-05 1993-03-12 Fujitsu Ltd 半導体装置の製造方法
JPH0658730A (ja) * 1992-08-06 1994-03-04 Nikon Corp 重ね合わせ精度測定方法
JP3511552B2 (ja) * 1996-08-07 2004-03-29 松下電器産業株式会社 重ね合わせ測定マークおよび測定方法
JPH10189425A (ja) * 1996-12-27 1998-07-21 Matsushita Electron Corp アライメント方法、アライメント精度測定方法及びアライメント測定用マーク
JPH10308346A (ja) * 1997-05-01 1998-11-17 Nikon Corp 投影露光方法及び投影露光による半導体デバイスの製造方法
US7317531B2 (en) * 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
JP2002351054A (ja) * 2001-05-29 2002-12-04 Sony Corp 位置合わせ用マーク及びこれを用いた位置合わせ方法、素子の転写方法
US6772084B2 (en) * 2002-01-31 2004-08-03 Timbre Technologies, Inc. Overlay measurements using periodic gratings
US6982793B1 (en) * 2002-04-04 2006-01-03 Nanometrics Incorporated Method and apparatus for using an alignment target with designed in offset
US6958819B1 (en) * 2002-04-04 2005-10-25 Nanometrics Incorporated Encoder with an alignment target
US6804005B2 (en) * 2002-05-02 2004-10-12 Timbre Technologies, Inc. Overlay measurements using zero-order cross polarization measurements
US7440105B2 (en) * 2002-12-05 2008-10-21 Kla-Tencor Technologies Corporation Continuously varying offset mark and methods of determining overlay
US7075639B2 (en) * 2003-04-25 2006-07-11 Kla-Tencor Technologies Corporation Method and mark for metrology of phase errors on phase shift masks
KR100546336B1 (ko) * 2003-07-03 2006-01-26 삼성전자주식회사 복수의 교점을 가지는 오버레이 키 및 이를 이용한오버레이 측정 방법
JP2005129781A (ja) * 2003-10-24 2005-05-19 Seiko Epson Corp レチクル、半導体ウェハおよび半導体装置の製造方法
JP4734261B2 (ja) * 2004-02-18 2011-07-27 ケーエルエー−テンカー コーポレイション 連続変化するオフセットマークと、オーバレイ決定方法
US7289214B1 (en) * 2004-11-23 2007-10-30 N&K Technology, Inc. System and method for measuring overlay alignment using diffraction gratings
US7477396B2 (en) * 2005-02-25 2009-01-13 Nanometrics Incorporated Methods and systems for determining overlay error based on target image symmetry
US7526749B2 (en) * 2005-10-31 2009-04-28 Kla-Tencor Technologies Corporation Methods and apparatus for designing and using micro-targets in overlay metrology

Similar Documents

Publication Publication Date Title
JP2013153217A5 (https=)
JP2017523927A5 (https=)
JP2015532733A5 (https=)
IL274834B2 (en) A method for determining information about a printing procedure, a method for reducing errors in measurement data, a method for calibrating a metrology process, a method for selecting metrological targets
CN103542958B (zh) 温度分布检测装置及方法
IL228201B (en) Substrate and patterning device for use in metrology, metrology method and device manufacturing method
WO2016034428A3 (en) Method of measuring a property of a target structure, inspection apparatus, lithographic system and device manufacturing method
JP2018081560A5 (https=)
JP2013195243A5 (ja) 色計測プログラム及び色計測方法
IL272780B2 (en) A method for determining a parameter for building processes
JP2016129212A5 (https=)
JP2015087314A5 (https=)
JP2018195725A5 (https=)
CN103884471B (zh) 重心测量方法
JP2015038985A5 (https=)
CN109458990B (zh) 一种基于免标记锚点检测的仪器设备位姿测量及误差补偿方法
JP2016008924A5 (https=)
CN104764465B (zh) 一种遥感卫星地面分辨率的测量方法
JP2013225725A5 (https=)
JP2014159103A5 (https=)
CN104298844A (zh) 获取点阵法测量光学遥感载荷在轨mtf测量精度的方法
Olson et al. Determination of residual stress intensity factor in the compact tension coupon
CN102393965B (zh) 一种利用四面体插值法实现测色色差计颜色校正的方法
MY190509A (en) Printing system, management device, and management method
JP2012225907A5 (https=)