JP2013115177A5 - - Google Patents

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Publication number
JP2013115177A5
JP2013115177A5 JP2011259001A JP2011259001A JP2013115177A5 JP 2013115177 A5 JP2013115177 A5 JP 2013115177A5 JP 2011259001 A JP2011259001 A JP 2011259001A JP 2011259001 A JP2011259001 A JP 2011259001A JP 2013115177 A5 JP2013115177 A5 JP 2013115177A5
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JP
Japan
Prior art keywords
functional
fine
space
fine powder
dispersion medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011259001A
Other languages
English (en)
Japanese (ja)
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JP2013115177A (ja
JP5687175B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2011259001A external-priority patent/JP5687175B2/ja
Priority to JP2011259001A priority Critical patent/JP5687175B2/ja
Priority to EP12275175.3A priority patent/EP2596884A1/en
Priority to US13/678,900 priority patent/US20130136645A1/en
Priority to TW101143595A priority patent/TW201331995A/zh
Priority to KR1020120133271A priority patent/KR20130059281A/ko
Priority to CN2012104951011A priority patent/CN103137438A/zh
Publication of JP2013115177A publication Critical patent/JP2013115177A/ja
Publication of JP2013115177A5 publication Critical patent/JP2013115177A5/ja
Publication of JP5687175B2 publication Critical patent/JP5687175B2/ja
Application granted granted Critical
Priority to US15/643,417 priority patent/US9950925B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011259001A 2011-11-28 2011-11-28 微細空間内に機能部分を形成する方法 Active JP5687175B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2011259001A JP5687175B2 (ja) 2011-11-28 2011-11-28 微細空間内に機能部分を形成する方法
EP12275175.3A EP2596884A1 (en) 2011-11-28 2012-11-16 Method for forming functional part in minute space
US13/678,900 US20130136645A1 (en) 2011-11-28 2012-11-16 Method for forming functional part in minute space
KR1020120133271A KR20130059281A (ko) 2011-11-28 2012-11-22 미세 공간내에 기능 부분을 형성하는 방법
TW101143595A TW201331995A (zh) 2011-11-28 2012-11-22 於微細空間內形成功能部分之方法
CN2012104951011A CN103137438A (zh) 2011-11-28 2012-11-28 在微细空间内形成功能部分的方法
US15/643,417 US9950925B2 (en) 2011-11-28 2017-07-06 Method for forming functional part in minute space

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011259001A JP5687175B2 (ja) 2011-11-28 2011-11-28 微細空間内に機能部分を形成する方法

Publications (3)

Publication Number Publication Date
JP2013115177A JP2013115177A (ja) 2013-06-10
JP2013115177A5 true JP2013115177A5 (https=) 2014-10-30
JP5687175B2 JP5687175B2 (ja) 2015-03-18

Family

ID=47227726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011259001A Active JP5687175B2 (ja) 2011-11-28 2011-11-28 微細空間内に機能部分を形成する方法

Country Status (6)

Country Link
US (2) US20130136645A1 (https=)
EP (1) EP2596884A1 (https=)
JP (1) JP5687175B2 (https=)
KR (1) KR20130059281A (https=)
CN (1) CN103137438A (https=)
TW (1) TW201331995A (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5687175B2 (ja) * 2011-11-28 2015-03-18 有限会社 ナプラ 微細空間内に機能部分を形成する方法
JP6134884B2 (ja) * 2013-07-19 2017-05-31 株式会社ザイキューブ 電極、電極材料及び電極形成方法
JP5885351B2 (ja) * 2013-10-09 2016-03-15 有限会社 ナプラ 接合部及び電気配線
JP6347104B2 (ja) * 2013-12-27 2018-06-27 セイコーエプソン株式会社 電気配線層の製造方法、電気配線層形成用部材、電気配線層、電気配線基板の製造方法、電気配線基板形成用部材、電気配線基板、振動子、電子機器および移動体
JP6022492B2 (ja) * 2014-02-13 2016-11-09 有限会社 ナプラ 微細空間内に導体を形成する製造方法
US9305866B2 (en) 2014-02-25 2016-04-05 International Business Machines Corporation Intermetallic compound filled vias
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CN107210221A (zh) * 2015-02-19 2017-09-26 住友精密工业株式会社 填充方法及填充装置
JP5859162B1 (ja) * 2015-08-06 2016-02-10 住友精密工業株式会社 金属充填装置および金属充填方法
EP3348338B1 (en) * 2015-09-07 2020-06-10 Hitachi Chemical Company, Ltd. Copper paste for joining, method for producing joined body, and method for producing semiconductor device
US9515044B1 (en) 2015-10-14 2016-12-06 Napra Co., Ltd. Electronic device, method of manufacturing the same, metal particle, and electroconductive paste
US20180138110A1 (en) * 2016-11-17 2018-05-17 Texas Instruments Incorporated Enhanced Adhesion by Nanoparticle Layer Having Randomly Configured Voids
US9865527B1 (en) 2016-12-22 2018-01-09 Texas Instruments Incorporated Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation
US9941194B1 (en) 2017-02-21 2018-04-10 Texas Instruments Incorporated Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer
US20200306894A1 (en) * 2017-12-07 2020-10-01 Ormet Circuits, Inc. Metallurgical compositions with thermally stable microstructures for assembly in electronic packaging
CN108598056A (zh) * 2018-06-29 2018-09-28 北京梦之墨科技有限公司 一种应用tsv技术的电子器件及其制作方法
CN113510241A (zh) * 2021-04-25 2021-10-19 福建尚辉润德新材料科技有限公司 一种磁粉注射成型粘结剂、制备方法及应用方法

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US3864715A (en) * 1972-12-22 1975-02-04 Du Pont Diode array-forming electrical element
US4613369A (en) * 1984-06-27 1986-09-23 Pall Corporation Porous metal article and method of making
JP2685112B2 (ja) * 1992-06-24 1997-12-03 大同特殊鋼 株式会社 粉末成形品の製造法
US5953629A (en) * 1995-06-09 1999-09-14 Vacuum Metallurgical Co., Ltd. Method of thin film forming on semiconductor substrate
US5770136A (en) * 1995-08-07 1998-06-23 Huang; Xiaodi Method for consolidating powdered materials to near net shape and full density
US6235624B1 (en) * 1998-06-01 2001-05-22 Kabushiki Kaisha Toshiba Paste connection plug, burying method, and semiconductor device manufacturing method
US5985208A (en) * 1998-08-27 1999-11-16 Alliedsignal Inc. Process for debinding and sintering metal injection molded parts made with an aqueous binder
JP2001237140A (ja) * 1999-12-13 2001-08-31 Murata Mfg Co Ltd 積層型セラミック電子部品およびその製造方法ならびにセラミックペーストおよびその製造方法
JP2003305588A (ja) * 2002-04-11 2003-10-28 Fujitsu Ltd 接合材料
TWI325739B (en) * 2003-01-23 2010-06-01 Panasonic Corp Electroconductive paste, its manufacturing method, circuit board using the same electroconductive paste, and its manufacturing method
JP2006131952A (ja) * 2004-11-05 2006-05-25 Hitachi Powdered Metals Co Ltd Ｆｅ−Ｔｉ焼結合金の製造方法
US7425507B2 (en) * 2005-06-28 2008-09-16 Micron Technology, Inc. Semiconductor substrates including vias of nonuniform cross section, methods of forming and associated structures
JP4278007B1 (ja) 2008-11-26 2009-06-10 有限会社ナプラ 微細空間への金属充填方法
EP2259307B1 (en) * 2009-06-02 2019-07-03 Napra Co., Ltd. Electronic device
JP4505540B1 (ja) 2009-06-02 2010-07-21 有限会社ナプラ 金属充填装置
JP4563506B1 (ja) * 2010-01-13 2010-10-13 有限会社ナプラ 電極材料
JP5250582B2 (ja) * 2010-04-22 2013-07-31 有限会社 ナプラ 充填用基材及びそれを用いた充填方法
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JP4790089B2 (ja) * 2011-01-24 2011-10-12 有限会社ナプラ 導電性組成物及び電子デバイスの製造方法
JP5687175B2 (ja) * 2011-11-28 2015-03-18 有限会社 ナプラ 微細空間内に機能部分を形成する方法
FI125558B (en) * 2013-05-29 2015-11-30 Iprotoxi Oy Device for controlling sensors
SG11201601075PA (en) * 2013-08-28 2016-03-30 3M Innovative Properties Co Electronic assembly with fiducial marks for precision registration during subsequent processing steps
JP6022492B2 (ja) * 2014-02-13 2016-11-09 有限会社 ナプラ 微細空間内に導体を形成する製造方法

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