JP2013110176A5 - - Google Patents

Download PDF

Info

Publication number
JP2013110176A5
JP2013110176A5 JP2011252177A JP2011252177A JP2013110176A5 JP 2013110176 A5 JP2013110176 A5 JP 2013110176A5 JP 2011252177 A JP2011252177 A JP 2011252177A JP 2011252177 A JP2011252177 A JP 2011252177A JP 2013110176 A5 JP2013110176 A5 JP 2013110176A5
Authority
JP
Japan
Prior art keywords
film
metal
oxide
forming
metal element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011252177A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013110176A (ja
JP5912444B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011252177A priority Critical patent/JP5912444B2/ja
Priority claimed from JP2011252177A external-priority patent/JP5912444B2/ja
Publication of JP2013110176A publication Critical patent/JP2013110176A/ja
Publication of JP2013110176A5 publication Critical patent/JP2013110176A5/ja
Application granted granted Critical
Publication of JP5912444B2 publication Critical patent/JP5912444B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011252177A 2011-11-18 2011-11-18 半導体装置の作製方法 Expired - Fee Related JP5912444B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011252177A JP5912444B2 (ja) 2011-11-18 2011-11-18 半導体装置の作製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011252177A JP5912444B2 (ja) 2011-11-18 2011-11-18 半導体装置の作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015160928A Division JP6039150B2 (ja) 2015-08-18 2015-08-18 半導体装置の作製方法及び半導体装置

Publications (3)

Publication Number Publication Date
JP2013110176A JP2013110176A (ja) 2013-06-06
JP2013110176A5 true JP2013110176A5 (enExample) 2014-10-09
JP5912444B2 JP5912444B2 (ja) 2016-04-27

Family

ID=48706672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011252177A Expired - Fee Related JP5912444B2 (ja) 2011-11-18 2011-11-18 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP5912444B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016001712A (ja) * 2013-11-29 2016-01-07 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2018067672A (ja) * 2016-10-21 2018-04-26 株式会社ブイ・テクノロジー 酸化物半導体装置及びその製造方法
KR102637201B1 (ko) * 2018-03-01 2024-02-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
JP7534083B2 (ja) * 2019-11-26 2024-08-14 株式会社ジャパンディスプレイ 薄膜トランジスタの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621088A (ja) * 1992-06-29 1994-01-28 Kawasaki Steel Corp 半導体装置の製造方法
JPH08306698A (ja) * 1995-05-10 1996-11-22 Casio Comput Co Ltd パターン形成方法
JPH11330486A (ja) * 1998-05-16 1999-11-30 Semiconductor Energy Lab Co Ltd 半導体装置
JP2000150898A (ja) * 1998-11-17 2000-05-30 Matsushita Electric Ind Co Ltd 薄膜トランジスターとその製造方法。
JP3913756B2 (ja) * 2002-05-22 2007-05-09 雅司 川崎 半導体装置およびそれを用いる表示装置
JP2004022690A (ja) * 2002-06-14 2004-01-22 Seiko Epson Corp 半導体装置及びその製造方法
JP5608347B2 (ja) * 2008-08-08 2014-10-15 株式会社半導体エネルギー研究所 半導体装置及び半導体装置の作製方法

Similar Documents

Publication Publication Date Title
JP2013175718A5 (enExample)
JP2012160719A5 (enExample)
JP2012216853A5 (enExample)
JP2015135953A5 (enExample)
JP2015111742A5 (ja) 半導体装置の作製方法、及び半導体装置
JP2014132646A5 (ja) 半導体装置及びその作製方法
JP2011181917A5 (enExample)
JP2011100982A5 (enExample)
JP2015181151A5 (ja) 半導体装置
JP2012069935A5 (ja) 半導体装置の作製方法
JP2012248829A5 (ja) 半導体装置の作製方法
JP2013102149A5 (enExample)
JP2012068627A5 (ja) 半導体装置の作製方法
JP2011171721A5 (enExample)
JP2012164976A5 (ja) 半導体装置の作製方法
JP2015188079A5 (enExample)
JP2011009724A5 (ja) 半導体装置の作製方法
JP2013251255A5 (enExample)
JP2013153140A5 (ja) 半導体装置の作製方法
JP2012033908A5 (enExample)
JP2011086927A5 (ja) 半導体装置
JP2011009719A5 (enExample)
JP2011054946A5 (enExample)
JP2011129898A5 (ja) 半導体装置
JP2015156515A5 (ja) 半導体装置の作製方法